ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

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ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304564 titled 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

The patent application describes an electronic device with multiple packages and a shielding can for protection and grounding.

The electronic device includes a base substrate, a first package with a semiconductor chip, a second package with another semiconductor chip and a sealing material, and a conformal conductive coating on the sealing material.
A conductive fixing portion is secured to a ground pad on the base substrate, allowing for grounding.
A shielding can is secured to the base substrate, surrounding the first and second packages, for electromagnetic interference protection.
A metal paste is formed between the shielding can and the conformal conductive coating for additional grounding and protection.

Potential Applications: - This technology can be used in electronic devices requiring electromagnetic interference protection and grounding. - It can be applied in various industries such as telecommunications, automotive, and aerospace for reliable performance.

Problems Solved: - Provides electromagnetic interference protection for sensitive semiconductor chips. - Ensures proper grounding for electronic devices to prevent malfunctions.

Benefits: - Enhanced reliability and performance of electronic devices. - Improved protection against electromagnetic interference. - Simplified manufacturing process for electronic devices.

Commercial Applications: - This technology can be utilized in the production of smartphones, tablets, GPS devices, and other consumer electronics. - It can also be integrated into industrial equipment, medical devices, and military electronics for improved functionality.

Questions about the technology: 1. How does the shielding can contribute to the overall protection of the electronic device? 2. What are the specific advantages of using a conformal conductive coating in this electronic device design?

Original Abstract Submitted

an electronic device includes a base substrate; a first package mounted on the base substrate, the first package including a first substrate and a first semiconductor chip mounted on the first substrate; a second package mounted on the first package, the second package including a second substrate, a second semiconductor chip mounted on the second substrate, a sealing material surrounding an upper surface of the second substrate and the second semiconductor chip, and a conformal conductive coating formed on at least an upper surface of the sealing material. a conductive fixing portion is secured to a ground pad exposed at an upper surface of the base substrate. a shielding can is secured to the base substrate by the conductive fixing portion and includes a side portion extending around the first and second packages. a metal paste is formed between the shielding can and the conformal conductive coating to contact the shielding can and the conformal conductive coating.