Intel corporation (20250096154). Package Substrates with Stiffener Interposers
Package Substrates with Stiffener Interposers
Organization Name
Inventor(s)
Chin Mian Choong of Georgetown MY
Juha Paavola of Hillsboro OR US
Package Substrates with Stiffener Interposers
This abstract first appeared for US patent application 20250096154 titled 'Package Substrates with Stiffener Interposers
Original Abstract Submitted
the present disclosure is directed to a stiffener having a first lateral member and a vertical member that form a frame structure that encloses around a package substrate of a semiconductor package, and the vertical member having an upper end connected to the first lateral member and a lower end extending downward from the first lateral member for connecting to a printed circuit board.