18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

Organization Name

TEXAS INSTRUMENTS INCORPORATED

Inventor(s)

Yiqi Tang of Allen TX (US)

Chittranjan Mohan Gupta of Richardson TX (US)

Rajen Manicon Murugan of Dallas TX (US)

Jie Chen of Plano TX (US)

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18071972 titled 'MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

Simplified Explanation

The abstract describes an electronic device with a multilevel package substrate, a conductive signal trace, a conductive box shield, a semiconductor die, and a package structure.

• The electronic device has a multilevel package substrate with multiple levels and a conductive signal trace in the second level.
• The device includes a conductive box shield that surrounds a portion of the conductive signal trace.
• A semiconductor die is attached to the multilevel package substrate and has a conductive structure coupled to the end of the conductive signal trace.
• The electronic device also has a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.

Potential Applications

This technology could be used in various electronic devices such as smartphones, tablets, and laptops to improve signal integrity and reduce electromagnetic interference.

Problems Solved

This technology helps in reducing signal interference and improving the overall performance of electronic devices by providing shielding for the conductive signal trace.

Benefits

The benefits of this technology include improved signal quality, enhanced device performance, and reduced electromagnetic interference.

Potential Commercial Applications

The potential commercial applications of this technology include consumer electronics, telecommunications equipment, and industrial automation devices.

Possible Prior Art

One possible prior art for this technology could be similar packaging designs used in electronic devices to improve signal integrity and reduce interference.

Unanswered Questions

How does this technology compare to existing packaging solutions in terms of cost-effectiveness?

Answer: This article does not provide information on the cost-effectiveness of this technology compared to existing packaging solutions.

What are the specific materials used in the conductive box shield and how do they contribute to the overall performance of the electronic device?

Answer: The article does not detail the specific materials used in the conductive box shield and their impact on device performance.

Original Abstract Submitted

An electronic device includes a multilevel package substrate having a first level, a second level, a third level, a conductive signal trace that extends in the second level, and a conductive box shield that surrounds a portion of the conductive signal trace. The electronic device includes a semiconductor die attached to the multilevel package substrate and having a conductive structure coupled to an end of the conductive signal trace. The electronic device includes a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.