Category:Juha Paavola of Hillsboro OR US
Juha Paavola
Juha Paavola from Hillsboro OR US has applied for patents in technology areas such as H01L23/00, H01L21/48, H01L23/15 with intel corporation.
Patents
Pages in category "Juha Paavola of Hillsboro OR US"
The following 6 pages are in this category, out of 6 total.
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- Intel corporation (20250003695). VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTACHMENT AND IMPROVED THERMAL MANAGEMENT
- Intel corporation (20250008711). METHOD AND APPARATUS FOR STIFFENING AN ELECTRONIC DEVICE
- Intel corporation (20250096154). Package Substrates with Stiffener Interposers
- Intel corporation (20250142778). HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE