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20240047491. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)

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SENSOR PACKAGE STRUCTURE

Organization Name

TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor(s)

YU-WEN Lee of Taipei City (TW)

LI-CHUN Hung of Hsin-Chu County (TW)

SENSOR PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047491 titled 'SENSOR PACKAGE STRUCTURE

Simplified Explanation

The abstract of the patent application describes a sensor package structure that includes various layers and a package body. The layers include a substrate, a sensor chip, a light-curing layer, a light-permeable layer, a shielding layer, and a light filter layer. The package body is formed on the substrate. The shielding layer surrounds a sensing region of the sensor chip and has at least one light-permeable slot covered by the light filter layer. The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body, which exposes at least part of the light-permeable layer.

  • The sensor package structure includes multiple layers and a package body.
  • The layers include a substrate, a sensor chip, a light-curing layer, a light-permeable layer, a shielding layer, and a light filter layer.
  • The package body is formed on the substrate.
  • The shielding layer surrounds the sensing region of the sensor chip.
  • The shielding layer has at least one light-permeable slot covered by the light filter layer.
  • The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body.
  • The package body exposes at least part of the light-permeable layer.

Potential applications of this technology:

  • Sensor packages for various industries such as automotive, consumer electronics, medical devices, etc.
  • Optical sensors requiring protection from external light interference.
  • Sensing applications where precise control of light exposure is necessary.

Problems solved by this technology:

  • Protection of the sensor chip from external light interference.
  • Enhanced accuracy and reliability of sensor measurements by shielding the sensing region.
  • Prevention of damage to the sensor chip from external factors.

Benefits of this technology:

  • Improved performance and accuracy of sensors.
  • Increased durability and lifespan of sensor packages.
  • Enhanced functionality and versatility in various applications.
  • Cost-effective solution for sensor packaging.


Original Abstract Submitted

a sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer disposed on an inner surface of the light-permeable layer, a light filter layer arranged between the light-curing layer and the shielding layer, and a package body that is formed on the substrate. a projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. the shielding layer has at least one light-permeable slot being covered by the light filter layer. the sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.

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