Samsung electronics co., ltd. (20250069979). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250069979 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a method of manufacturing a semiconductor package is provided and includes: forming a lower redistribution structure, the lower redistribution structure including lower redistribution patterns having lower connection pads; forming an upper redistribution structure on a boundary surface of the lower redistribution structure, the upper redistribution structure including upper redistribution patterns having upper connection pads electrically connected to the lower connection pads; forming openings exposing at least a portion of each of the lower connection pads; disposing an interposer substrate, including the lower redistribution structure and the upper redistribution structure, on a base substrate, the lower connection pads of the interposer substrate electrically connected to wiring patterns of the base substrate through lower connection bumps disposed on the openings; and disposing at least one of semiconductor chips, including connection pads, on the interposer substrate, the connection pads electrically connected to the upper connection pads through upper connection bumps.