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Category:Bhagya Prakash Bandusena of Singapore SG

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Bhagya Prakash Bandusena

Bhagya Prakash Bandusena from Singapore SG has applied for patents in technology areas such as H01L23/552, H01L23/00 with STMicroelectronics International N.V..

Patents

WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMISSION AND RECEIPT OF EMI AT AN OPTICAL EMISSIONS COMPONENT (18485523)

Pages in category "Bhagya Prakash Bandusena of Singapore SG"

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18485523. WIRE BOND ELECTROMAGNETIC INTERFERENCE (EMI) CAGE TO BLOCK TRANSMISSION AND RECEIPT OF EMI AT AN OPTICAL EMISSIONS COMPONENT (STMicroelectronics International N.V.)

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