PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 20240258287 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

a package structure includes a semiconductor die, an antenna substrate structure, a redistribution layer. the semiconductor die laterally encapsulated by a first encapsulant. the antenna substrate structure disposed over the semiconductor die, wherein the antenna substrate structure includes a first type of antenna, and a second type of antenna disposed on a side of the antenna substrate structure facing away from the semiconductor die. the redistribution layer disposed between the semiconductor die and the antenna substrate structure. the semiconductor die, the first type of antenna, and the second type of antenna are electrically coupled through the redistribution layer. the polarization of radiation emitted by the first type of antenna is perpendicular to a polarization of radiation emitted by the second type of antenna.