18894714. SEMICONDUCTOR PACKAGES (SK hynix Inc.)

SEMICONDUCTOR PACKAGES

Organization Name

SK hynix Inc.

Inventor(s)

Won Duck Jung of Icheon-si Gyeonggi-do (KR)

SEMICONDUCTOR PACKAGES

This abstract first appeared for US patent application 18894714 titled 'SEMICONDUCTOR PACKAGES

Original Abstract Submitted

A semiconductor package is configured to include a package substrate, a semiconductor chip disposed on the package substrate, and bonding wires. The package substrate includes a first column of bond fingers disposed in a first layer and a second column of bond fingers disposed in a second layer. The semiconductor chip includes a first column of chip pads arrayed in a first column and a second column of chip pads arrayed in a second column adjacent to the first column. The first column of chip pads are connected to the first column of bond fingers, respectively, through first bonding wires, and the second column of chip pads are connected to the second column of bond fingers, respectively, through second bonding wires.