Huawei technologies co., ltd. (20240321771). CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract
CHIP SYSTEM AND COMMUNICATION DEVICE
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CHIP SYSTEM AND COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321771 titled 'CHIP SYSTEM AND COMMUNICATION DEVICE
The abstract of the patent application describes a chip system with a chip package body and an electromagnetic shielding enclosure. The chip package body is connected to a circuit board through a first connection part and includes a package substrate and at least one chip. The electromagnetic shielding enclosure consists of a conductive first shielding structure and a conductive second shielding structure, with the first shielding structure connected to the package substrate.
- The chip system includes a chip package body and an electromagnetic shielding enclosure.
- The chip package body is electrically connected to a circuit board through a first connection part.
- The chip package body comprises a package substrate and at least one chip that are electrically connected.
- The electromagnetic shielding enclosure consists of a conductive first shielding structure and a conductive second shielding structure.
- The first shielding structure is connected to the package substrate.
- The first shielding structure has a first cavity to accommodate at least one chip.
- The second shielding structure is connected to the circuit board or a solder pad of the circuit board.
- The second shielding structure forms a second cavity with the first shielding structure.
Potential Applications: - Electronic devices requiring electromagnetic shielding. - High-frequency communication systems. - Aerospace and defense applications.
Problems Solved: - Protection of sensitive electronic components from electromagnetic interference. - Ensuring signal integrity in high-frequency applications.
Benefits: - Enhanced reliability of electronic systems. - Improved performance in high-frequency environments. - Compliance with electromagnetic compatibility standards.
Commercial Applications: Title: "Electromagnetic Shielding Chip System for Enhanced Signal Integrity" This technology can be utilized in the development of: - Mobile devices. - Satellite communication systems. - Military electronics.
Questions about the technology: 1. How does the electromagnetic shielding enclosure protect the electronic components from interference? - The conductive shielding structures block external electromagnetic signals from affecting the chips inside the package body. 2. What are the advantages of using a chip system with an electromagnetic shielding enclosure? - The main advantage is the improved signal integrity and reliability of electronic devices in high-frequency environments.
Original Abstract Submitted
a chip system includes a chip package body and an electromagnetic shielding enclosure. the chip package body is electrically connected to a circuit board through a first connection part. the chip package body includes a package substrate and at least one chip that are electrically connected. the electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. the first shielding structure is connected to the package substrate. a first cavity included in the first shielding structure is configured to accommodate at least one chip. a first end of the second shielding structure is connected to the circuit board or a solder pad of the circuit board; or a second end of the second shielding structure is connected to the first shielding structure to form a second cavity.