Samsung electronics co., ltd. (20250125280). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
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SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
This abstract first appeared for US patent application 20250125280 titled 'SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
Original Abstract Submitted
a semiconductor package may include: a wiring structure having a structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a semiconductor chip disposed to vertically overlap the wiring structure; and a conductive shielding layer accommodating the semiconductor chip, and covering a portion of a side surface of the wiring structure to be connected to a ground of the at least one wiring layer, wherein the other portion of the side surface of the wiring structure may not be covered by the conductive shielding layer.