SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
Patent Applications by SAMSUNG ELECTRONICS CO., LTD. on February 27th, 2025
SAMSUNG ELECTRONICS CO., LTD.: 213 patent applications
SAMSUNG ELECTRONICS CO., LTD. has applied for patents in the areas of H01L23/00 (17), H01L25/065 (15), H01L23/31 (11), H01L23/528 (10), H04L5/00 (8) H10B43/27 (4), G06F12/0246 (2), H04W72/23 (2), H04W48/18 (2), G06F3/013 (2)
With keywords such as: device, based, configured, information, including, data, layer, semiconductor, signal, and display in patent application abstracts.
Patent Applications by SAMSUNG ELECTRONICS CO., LTD.
Inventor(s): Yoonkyung CHO of Suwon-si (KR) for samsung electronics co., ltd., Soohoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Juhan SEON of Suwon-si (KR) for samsung electronics co., ltd., Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L7/00, A47L11/40
CPC Code(s): A47L7/0023
Abstract: a vacuum cleaner includes a cleaner main body including a battery, and a wet mop brush driven by power supplied from the battery. the wet mop brush may include at least one mop pad provided on a bottom of a brush body to contact a surface to be cleaned, a motor configured to rotate the at least one mop pad, a heater configured to heat water supplied from a water tank to a heating tank, a sprayer configured to spray the water heated by the heater toward the surface to be cleaned, a pump configured to provide pressure for moving the water from the water tank to the sprayer, and a processor configured to adjust an amount of power supplied to at least one of the motor, the heater, or the pump based on a first current threshold available in the wet mop brush.
Inventor(s): Joonyoung HEO of Suwon-si (KR) for samsung electronics co., ltd., Minjin Song of Suwon-si (KR) for samsung electronics co., ltd., Jinhwi Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/00, A47L9/28, G06V10/12, G06V20/58
CPC Code(s): A47L9/009
Abstract: provided is a cleaning robot and a method of controlling same, the cleaning robot including: at least one sensor; at least one camera; a driver; at least one memory storing at least one instruction; and at least one processor connected with the at least one sensor, the at least one camera, the driver, and the at least one memory and configured to execute the at least one instruction, wherein the at least one instruction, when executed by the at least one processor, causes the cleaning robot to: identify a surrounding environment based on a video captured using the at least one camera, wherein the video is captured while the driver causes the cleaning robot to move, and adjust, based on the surrounding environment, a processing priority order of data obtained from the video.
Inventor(s): Seongu LEE of Suwon-si (KR) for samsung electronics co., ltd., Minji KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyeongjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Ahyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yeongju LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeshik JEONG of Suwon-si (KR) for samsung electronics co., ltd., Yoonkyung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47L9/28
CPC Code(s): A47L9/2821
Abstract: the present disclosure relates to a self-diagnosis on a state of a cleaning system, whereby a wireless vacuum cleaner solely, or the wireless vacuum cleaner docked on a station device, may self-diagnose the state of the wireless vacuum cleaner based on at least one of a flow path pressure value of the wireless vacuum cleaner and an operation current value of a brush device, and a state of a station device is self-diagnosed based on a pressure value of the station device.
Inventor(s): Young Jun HONG of Seoul (KR) for samsung electronics co., ltd., Jonghan KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/145, A61B5/00
CPC Code(s): A61B5/14532
Abstract: a blood glucose measuring apparatus and a method of operating the blood glucose measuring apparatus are provided. the blood glucose measuring method includes extracting a measurement signal based on signals captured by a cell capsule comprising a reservoir configured to accommodate cells, including distinguishing the signals from noise; and estimating a characteristic of the cells based on the extracted measurement signal. the signals have respective oscillations that are dependent on a membrane action potential bursts phase and a membrane lower potential inter-burst phase of the cells.
Inventor(s): DONGHOON KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B24B37/27, B24B37/34, B24B51/00
CPC Code(s): B24B37/27
Abstract: a substrate polishing device according to an embodiment includes a first polishing module disposed in a first region and including a plurality of first polishing units having first polishing pads, a second polishing module disposed in a second region and including at least one second polishing unit having a second polishing pad, and a transfer module configured to transfer a substrate between the first polishing module and the second polishing module. the second region is disposed adjacent to or within the first region, and a diameter of the second polishing pad is smaller than a diameter of the first polishing pad.
Inventor(s): Doojin KIM of Suwon-si (KR) for samsung electronics co., ltd., Byongjoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65H49/32, B65H69/02, B65H69/04, B65H69/08, H01L23/00
CPC Code(s): B65H49/32
Abstract: a wire supply module may include a plurality of spools and a joint machine. wires may be wound on the spools. the joint machine may be arranged between the spools to join the wires to each other. the joint machine may include a housing, a jointer and a cutter. the housing may have a joint passage configured to receive ends of the wires. the jointer may be arranged in the housing to join the ends of the wires to each other. the cutter may be arranged in the housing to partially cut the joined ends of the wires. thus, when all the wire on a currently used spool may be exhausted, the wire on another spool may be joined to the wire on the currently used spool so that the wire may be continuously supplied without a spool exchange.
Inventor(s): Soonok Jeon of Suwon-si (KR) for samsung electronics co., ltd., Junyeob Lee of Seongnam-si (KR) for samsung electronics co., ltd., Halim Lee of Seongnam-si (KR) for samsung electronics co., ltd., Jihoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Inkoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmo Sung of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Seoul (KR) for samsung electronics co., ltd., Sangho Park of Anyang-si (KR) for samsung electronics co., ltd., Soohwan Sul of Suwon-si (KR) for samsung electronics co., ltd., Won-joon Son of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C07D519/00, C07D487/14, H10K50/11, H10K50/12, H10K71/00, H10K85/60, H10K101/00, H10K101/10, H10K101/30, H10K101/40
CPC Code(s): C07D519/00
Abstract: provided are a heterocyclic compound represented by formula 1-1 or 1-2, an organic light-emitting device including the heterocyclic compound, and an electronic apparatus including the organic light-emitting device:
Inventor(s): Soonok Jeon of Suwon-si (KR) for samsung electronics co., ltd., Junyeob Lee of Seongnam-si (KR) for samsung electronics co., ltd., Halim Lee of Seongnam-si (KR) for samsung electronics co., ltd., Jihoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Inkoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmo Sung of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Seoul (KR) for samsung electronics co., ltd., Sangho Park of Anyang-si (KR) for samsung electronics co., ltd., Soohwan Sul of Suwon-si (KR) for samsung electronics co., ltd., Won-joon Son of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C07D519/00, C07D487/14, H10K50/11, H10K50/12, H10K71/00, H10K85/60, H10K101/00, H10K101/10, H10K101/30, H10K101/40
CPC Code(s): C07D519/00
Abstract:
Inventor(s): Soonok Jeon of Suwon-si (KR) for samsung electronics co., ltd., Junyeob Lee of Seongnam-si (KR) for samsung electronics co., ltd., Halim Lee of Seongnam-si (KR) for samsung electronics co., ltd., Jihoon Kang of Suwon-si (KR) for samsung electronics co., ltd., Inkoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngmo Sung of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Seoul (KR) for samsung electronics co., ltd., Sangho Park of Anyang-si (KR) for samsung electronics co., ltd., Soohwan Sul of Suwon-si (KR) for samsung electronics co., ltd., Won-joon Son of Suwon-si (KR) for samsung electronics co., ltd., Hyeonho Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C07D519/00, C07D487/14, H10K50/11, H10K50/12, H10K71/00, H10K85/60, H10K101/00, H10K101/10, H10K101/30, H10K101/40
CPC Code(s): C07D519/00
Abstract: formulae 1-1 and 1-2 may each be understood by referring to the descriptions of formulae 1-1 and 1-2 provided herein.
Inventor(s): Jongwon Choi of Yongin-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Hwaseong-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sangdong Kim of Seongnam-si (KR) for samsung electronics co., ltd., Soyeon Kim of Seoul (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Sunghun Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Jiyoun Lee of Anyang-si (KR) for samsung electronics co., ltd., Dmitry KRAVCHUK of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30
CPC Code(s): C07F15/0033
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Jongwon Choi of Yongin-si (KR) for samsung electronics co., ltd., Yongsuk Cho of Hwaseong-si (KR) for samsung electronics co., ltd., Seungyeon Kwak of Suwon-si (KR) for samsung electronics co., ltd., Sangdong Kim of Seongnam-si (KR) for samsung electronics co., ltd., Soyeon Kim of Seoul (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Sunghun Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Jiyoun Lee of Anyang-si (KR) for samsung electronics co., ltd., Dmitry KRAVCHUK of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30
CPC Code(s): C07F15/0033
Abstract:
Inventor(s): Kyuyoung Hwang of Anyang-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Seoul (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30
CPC Code(s): C07F15/0086
Abstract: an organometallic compound represented by formula 1:
Inventor(s): Kyuyoung Hwang of Anyang-si (KR) for samsung electronics co., ltd., Byungjoon Kang of Seoul (KR) for samsung electronics co., ltd., Myungsun Sim of Suwon-si (KR) for samsung electronics co., ltd., Sukekazu ARATANI of Hwaseong-si (KR) for samsung electronics co., ltd., Kum Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Banglin Lee of Suwon-si (KR) for samsung electronics co., ltd., Byoungki Choi of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F15/00, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30
CPC Code(s): C07F15/0086
Abstract:
Inventor(s): Sanghwa LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09G1/04
CPC Code(s): C09G1/04
Abstract: a polishing slurry composition may include water and an abrasive including a cerium-based metal organic framework. the cerium-based metal organic framework may have a three-dimensional (3d) network structure including a plurality of cerium hexanuclear nanoclusters and a plurality of organic linkers. each of the plurality of cerium hexanuclear nanoclusters may include six cerium atoms and each of the plurality of organic linkers may be connected between two corresponding cerium hexanuclear nanoclusters among the plurality of cerium hexanuclear nanoclusters. a method of manufacturing an integrated circuit (ic) device may include forming a film to be polished on a substrate, and polishing the film to be polished by performing a chemical mechanical polishing (cmp) process using the polishing slurry composition.
Inventor(s): Junghoon LEE of Seongnam-si (KR) for samsung electronics co., ltd., Byonggwon SONG of Seoul (KR) for samsung electronics co., ltd., Kunmo CHU of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C09J11/04, B22F1/052, B22F1/17, B23K35/02, B23K35/26, B23K103/08
CPC Code(s): C09J11/04
Abstract: provided are metal particles for an adhesive paste, a solder paste composition including the same, and a method of preparing the metal particles for an adhesive paste. the metal particles for an adhesive paste may include a core including one or more metal materials; and a shell arranged on part or an entirety of the core and including one or more metal materials. the metal material of the core may have a melting point higher than that of the metal material of the shell. an intermetallic compound is capable of being formed between the metal material of the core and the metal material of the shell. a ratio (d90/d10) of the 90% cumulative mass particle size distribution (d90 size) to the 10% cumulative mass particle size distribution (d10 size) in a particle size distribution of the metal particles may be 1.22 or less.
Inventor(s): Changseok LEE of Gwacheon-si (KR) for samsung electronics co., ltd., Hyeonsuk SHIN of Ulsan (KR) for samsung electronics co., ltd., Hyeonjin SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seokmo HONG of Ulsan (KR) for samsung electronics co., ltd., Minhyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunggeol NAM of Suwon-si (KR) for samsung electronics co., ltd., Kyungyeol MA of Ulsan (KR) for samsung electronics co., ltd.
IPC Code(s): C30B29/38, H01L21/02
CPC Code(s): C30B29/38
Abstract: a boron nitride layer and a method of fabricating the same are provided. the boron nitride layer includes a boron nitride compound and has a dielectric constant of about 2.5 or less at an operating frequency of 100 khz.
Inventor(s): Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd., Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Seulgi LEE of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/04, D06F19/00, D06F33/36, D06F33/38, D06F33/40, D06F35/00, D06F39/40, D06F58/38, D06F101/20, D06F103/04, D06F105/58
CPC Code(s): D06F34/04
Abstract: a method may include transmitting, by a spot cleaner, an end signal to notify an end of a washing process performed by the spot cleaner in which a garment was cleaned by the spot cleaner, based on completion of the washing process, wherein the spot cleaner is positionable inside a clothes care apparatus so that the washing process is performable by the spot cleaner while the spot cleaner and garment are inside the clothes care apparatus, and the spot cleaner is positionable outside of the clothes care apparatus so that the washing process is performable by the spot cleaner while the spot cleaner and garment are outside of the clothes care apparatus; and performing, by the clothes care apparatus, a clothes care process or providing an interface to start the clothes care process, based on the end signal having been transmitted by the spot cleaner.
Inventor(s): Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/18, D06F19/00, D06F33/36, D06F34/04, D06F34/20, D06F34/32, D06F35/00, D06F39/14, D06F103/02, D06F103/40, D06F105/58
CPC Code(s): D06F34/18
Abstract: a clothes care apparatus includes a cabinet, where a first chamber is defined in the cabinet; a first door configured to open or close the first chamber, where a second chamber separated from the first chamber and configured to accommodate a garment is defined in the first door; a second door pivotally coupled to the first door and configured to open or close the second chamber; a switchable mirror arranged on the second door and operable in a mirror mode or a transparent mode; a spot cleaning device arranged in the second chamber to partially clean the garment accommodated in the second chamber, and movable in the second chamber; and a controller configured to control the switchable mirror and the spot cleaning device.
Inventor(s): Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Sori JEON of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/28, D06F34/14, D06F103/06, D06F105/58
CPC Code(s): D06F34/28
Abstract: provided are a garment treatment device and method for guiding a user through treatment of a garment. the garment treatment device obtains garment information of a plurality of garments accommodated in the garment treatment device, through a tag reader, determine, based on the obtained garment information, whether there is a garment that needs to be separated from other garments among the plurality of garments, based on determining that there is the garment that needs to be separated from the other garments, output, through output components, guide information for guiding a user through separating the garment that needs to be separated from the other garments, along with identification information of the garment that needs to be separated, and control garment treatment components according to a user input received in response to the guide information, to wash or dry the other garments with or without the garment that needs to be separated.
Inventor(s): Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd., Soohyun SUNG of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Hyelim PARK of Suwon-si (KR) for samsung electronics co., ltd., Myoungsoo JANG of Suwon-si (KR) for samsung electronics co., ltd., Chihong CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F34/32, D06F25/00, D06F33/68, D06F33/70, D06F34/30, D06F101/14, D06F101/20, D06F103/04, D06F105/56, D06F105/58
CPC Code(s): D06F34/32
Abstract: provided are a washing machine for providing guidance about a washing and drying method and a control method for the washing machine. the washing machine receives, through an input interface, a user input of setting a desired time for washing and drying of laundry to be completed, calculates a minimum time required for the washing and drying of the laundry to be completed, based on determining that the desired time is less than the minimum time required, displays, through a display, guide information for completing the washing and drying of the laundry within the desired time, and based on a user input according to the guide information, drives washing components and drying components to wash and dry the laundry within the desired time.
20250066980. CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F35/00, D06F19/00, D06F39/02, D06F39/08, D06F39/12
CPC Code(s): D06F35/00
Abstract: a clothes care apparatus including a cabinet; a care room inside the cabinet and configured to accommodate clothes; a clothes supporting member detachably couplable to an upper side of the care room, and configured to support clothes; a door configured to open and close the care room; a fixing portion on a side wall of the care room and configured to fix a lower part of the clothes; and a spot cleaning device on a side wall of the care room, and configured to be movable relative to the side wall to, when the clothes supporting member is coupled to the upper side of the care room and clothes are supported by the clothes supporting member, spot clean the clothes supported by the clothes supporting member.
20250066983. CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/08, D06F39/14
CPC Code(s): D06F39/088
Abstract: a clothes care apparatus includes a cabinet; a first chamber formed inside the cabinet, and configured to accommodate a garment; a first door configured to open or close the first chamber, having a second chamber separated from the first chamber, and configured to accommodate a garment, and including a door water supply tub and a door drain tub; a second door pivotally coupled to the first door to open or close the second chamber; and a spot cleaning device arranged inside the second chamber to spot clean the garment accommodated in the second chamber, and including a water supply tub to receive water from the door water supply tub, and a drain tub to release the water from the second chamber to the door drain tub.
Inventor(s): Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongpil SEO of Suwon-si (KR) for samsung electronics co., ltd., Kanghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngjin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/10, B01D29/11, B01D29/64, B01D35/143, B01D35/157, D06F23/02, D06F34/20, D06F37/26, D06F39/08, D06F39/12, D06F103/42, D06F103/44, D06F105/02, D06F105/06, D06F105/08, D06F105/54, D06F105/58
CPC Code(s): D06F39/10
Abstract: a washing machine comprising: a housing having a loading inlet that is open; a tub to be positioned inside the housing; a door to open and close the loading inlet; a detergent supply device provided in a first space formed between the housing and the upper part of a first side of the tub to supply detergent to the tub; a pump device provided to pump washing water inside the tub; and a filter provided to filter the washing water flowing in from the pump device.
20250066985. CLOTHES CARE APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaeryong PARK of Suwon-si (KR) for samsung electronics co., ltd., Myungwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Younghak KONG of Suwon-si (KR) for samsung electronics co., ltd., Byeongcheol YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F43/00, D06F43/08, D06F45/16, D06F51/00
CPC Code(s): D06F43/002
Abstract: a clothes care apparatus may include a cabinet, a first chamber formed inside the cabinet and configured to accommodate clothes, a first door configured to open or close the first chamber, the first door having a second chamber and configured to accommodate clothes, a second door configured to open or close the second chamber and rotatably coupled to the first door, and a spot cleaner disposed inside the second chamber and configured to spot clean the clothes accommodated in the second chamber. the spot cleaner is movable inside the second chamber to spot clean a target area of the clothes accommodated in the second chamber.
20250067489. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangmin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jin JEONG of Suwon-si (KR) for samsung electronics co., ltd., Juno KWON of Suwon-si (KR) for samsung electronics co., ltd., Seokjun YOON of Suwon-si (KR) for samsung electronics co., ltd., Gahyeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Seokjun SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25C1/24, B67D1/00, B67D1/12, F25C1/25
CPC Code(s): F25C1/24
Abstract: a refrigerator comprises a body comprising a storage compartment, a first control valve, an ice maker connected to the first control valve and to generate ice using the water discharged from the first control valve, a second control valve, a dispenser comprising an operating lever to supply the water received from the second valve by an operation of the operating lever, and an automatic water supply device to supply the water received from the second valve to a water container and to control the water container to be filled with a predetermined amount of water. the first control valve selectively guides the water received from the external water supply source to the ice maker or to the second control valve, and the second control valve selectively guides the water received from the first control valve to the dispenser or the automatic water supply device.
Inventor(s): Kidu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeyeon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Hani YANG of Suwon-si (KR) for samsung electronics co., ltd., Odo YU of Suwon-si (KR) for samsung electronics co., ltd., Suho JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/02, H04R1/02, H04R1/40
CPC Code(s): F25D23/028
Abstract: a refrigerator is provided. the refrigerator includes a main body, a storage compartment, a door configured to open and close the storage compartment, and a speaker device embedded in the door, wherein the door includes upper door and lower door, wherein the speaker device includes at least one first speaker facing a first direction that is a user handle space direction, and configured to output sound in a full-range frequency band, and at least one second speaker facing a second direction that is a door inner wall surface direction as a direction different from the first direction, and configured to output sound in a full-range frequency band.
20250067503. REFRIGERATOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donggun KO of Suwon-si (KR) for samsung electronics co., ltd., Yeonwoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Eungryeol SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06
CPC Code(s): F25D23/063
Abstract: a refrigerator including a main body formed by an assembly of a plurality of insulation panels; a storage space in the main body; a door to open and close the storage space; and a cooling device to supply cold air to the storage space, wherein the plurality of insulation panels includes a first insulation panel coupled to a second insulation panel, the first insulation panel includes an inner case coupled to an outer case to thereby form an insulating space between the inner case and the outer case, and insulation in the insulating space, the inner case includes a space forming portion defining one side of the storage space, and a contact portion offset from the space forming portion and contacting an outer surface of the second insulation panel, and the contact portion includes an opening to reduce heat transfer between the first insulation panel and the second insulation panel.
Inventor(s): Yongwoo KIM of Seongnam-si (KR) for samsung electronics co., ltd., Sera An of Hwaseong-si (KR) for samsung electronics co., ltd., Dongsuk Lee of Suwon-si (KR) for samsung electronics co., ltd., Chanhui Park of Yongin-si (KR) for samsung electronics co., ltd., Seunghoon Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Michael Choi of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G01R31/319, G01R31/30, G05B19/042
CPC Code(s): G01R31/31924
Abstract: a monitoring circuit includes a sensor circuit having a plurality of devices and a selection circuit, which selects a device to be monitored among the plurality of devices, an input circuit, which applies, based on input digital data, a first signal to the device to be monitored and an output circuit, which generates output digital data based on a second signal generated by the sensor circuit. the input circuit includes a digital-to-analog converter, and the output circuit includes an analog-to-digital converter.
Inventor(s): Sagar BHARATHRAJ of Bengaluru (IN) for samsung electronics co., ltd., Shashishekara Parampalli ADIGA of Bengaluru (IN) for samsung electronics co., ltd.
IPC Code(s): G01R31/52, G01R31/378, G01R31/3835, H01M10/42
CPC Code(s): G01R31/52
Abstract: provided is a method of estimating a short resistance of a target battery associated with a battery-driven device. the method includes: determining voltage values of the target battery within a time period during a charging or discharging state of the target battery, wherein the time period is associated with a constant resistance value within the target battery; comparing the voltage values with reference voltage values associated with a reference battery; based on the comparing, determining, for the pre-defined time period, a magnitude of a voltage deviation of the target battery with respect to the reference battery; detecting a short circuit in the target battery based on the determined magnitude of the voltage deviation; and estimating the short resistance associated with the short circuit of the target battery based on the constant resistance value and the magnitude of the voltage deviation.
Inventor(s): Byunggil JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sunil KIM of Suwon-si (KR) for samsung electronics co., ltd., Junghyun PARK of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481, G02F1/29
CPC Code(s): G01S7/4817
Abstract: provided are a spatial light modulator, a method of manufacturing the same, and a light detection and ranging (lidar) apparatus including the spatial light modulator. the spatial light modulator includes a substrate including an opening, and a plurality of pixels, wherein at least one pixel of the plurality of pixels includes a first reflective layer provided on the substrate, a cavity layer provided on the first reflective layer, and a second reflective layer provided on the cavity layer, the second reflective layer including a grating structure. the plurality of pixels are supported by the substrate and are arranged to be separated from each other.
Inventor(s): Changgyun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/481
CPC Code(s): G01S7/4818
Abstract: an optical device according to various example embodiments includes a first waveguide including a first core, a second waveguide including a second core spaced apart from the first waveguide and having a refractive index less than that of the first core, and a third waveguide disposed between the first waveguide and the second waveguide and including a third core having a refractive index less than the refractive index of the first core and greater than the refractive index of the second core.
Inventor(s): Sookyoung ROH of Yongin-si (KR) for samsung electronics co., ltd., Sangyun LEE of Yongin-si (KR) for samsung electronics co., ltd., Sungmo AHN of Yongin-si (KR) for samsung electronics co., ltd., Seokho YUN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G02B3/00, H04N9/64, H04N23/84
CPC Code(s): G02B3/0056
Abstract: an image sensor includes a color separating lens array including a plurality of first pixel corresponding regions respectively corresponding to a plurality of first pixels and a plurality of second pixel corresponding regions respectively corresponding to a plurality of second pixels, wherein each of the plurality of first pixel corresponding regions and the plurality of second pixel corresponding regions includes a plurality of nanoposts, and at least one of a shape, a width, and an arrangement of the plurality of nanoposts of the plurality of first pixel corresponding regions changes according to an azimuth direction of the plurality of nanoposts in a peripheral portion surrounding a central portion of the color separating lens array.
20250067930. PHOTONIC INTEGRATED APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bongyong JANG of Suwon-si (KR) for samsung electronics co., ltd., Eunkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Dongsik SHIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B6/122, G02B6/12
CPC Code(s): G02B6/122
Abstract: a photonic integrated apparatus includes a substrate, a dielectric layer disposed on the substrate and including an opening exposing a part of the substrate, a photonic source contacting a partial area of the substrate through the opening, a waveguide disposed on the dielectric layer, and a photonic steering device disposed on the dielectric layer and configured to steer light emitted from the photonic source to the waveguide.
Inventor(s): Sangyun LEE of Yongin-si (KR) for samsung electronics co., ltd., Sookyoung Roh of Yongin-si (KR) for samsung electronics co., ltd., Seokho Yun of Seoul (KR) for samsung electronics co., ltd., Sungmo Ahn of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B7/28, G02B3/00, G02B27/10, G02B27/12, G03B13/36, H04N9/01, H04N25/704
CPC Code(s): G02B7/28
Abstract: an image sensor includes a sensor substrate including first, second, third, and fourth pixels, and a color separating lens array, wherein each of the first pixels includes a first focusing signal region and a second focusing signal region that independently generate focusing signals, and the first focusing signal region and the second focusing signal region are arranged to be adjacent to each other in the first pixel in a first direction, and each of the fourth pixels includes a third focusing signal region and a fourth focusing signal region that independently generate focusing signals, and the third focusing signal region and the fourth focusing signal region are arranged to be adjacent to each other in the fourth pixel in a second direction that is different from the first direction.
Inventor(s): Dohyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jimin KIM of Suwon-si (KR) for samsung electronics co., ltd., Joayoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Changsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Changyoul LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoon HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02B27/01, G06Q50/10, G06T19/00, H04N13/332, H04N13/366, H04N13/383, H04N21/414, H04N21/442, H04N21/81
CPC Code(s): G02B27/0179
Abstract: a method of providing an augmented reality (ar) content in a vehicle, and/or a wearable ar device and an electronic device for performing a method. the wearable ar device may include a processor and a memory storing instructions. the processor, when executing the instructions, causes the wearable ar device to: set reference points corresponding to positions of anchor devices on first spatial map data corresponding to a space of a vehicle, determine a position and a direction of the wearable ar device on the first spatial map data based on the reference points and a positional relationship between the wearable ar device and anchor devices, and control output ar content based on the determined position and the determined direction of the wearable ar device.
20250068017. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hyojae JANG of Suwon-si (KR) for samsung electronics co., ltd., Sungho Kim of Suwon-si (KR) for samsung electronics co., ltd., Mira Jo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G02F1/1362, G02F1/1333, G02F1/1335, G02F1/1368
CPC Code(s): G02F1/136204
Abstract: a display apparatus is provided and includes a display panel including a first border and a second border, and a decorative bezel that covers the first border. the display panel further includes: a first substrate, a second substrate including a first side, on which the first substrate is disposed, and a second side opposite to the first side, an electrode layer on the second side of the second substrate; a ground wire between the first substrate and the second substrate, the ground wire configured to connect to a ground; and a conductive silicon that is on the second border and electrically connects the electrode layer and the ground wire.
Inventor(s): Sanghoon EUM of Suwon-si (KR) for samsung electronics co., ltd., Giseok SUNG of Suwon-si (KR) for samsung electronics co., ltd., Gohwoon JEONG of Suwon-si (KR) for samsung electronics co., ltd., Dosung JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03B21/14, H04N9/31
CPC Code(s): G03B21/145
Abstract: a mobile projector includes: a main body including a projector; a left moving part on a left side of the main body; a right moving part on a right side of the main body, symmetrical with the left moving part; a left elevating part between the left side of the main body and the left moving part to move the left moving part up and down with respect to the main body; and a right elevating part between the right side of the main body and the right moving part to move the right moving part up and down with respect to the main body.
Inventor(s): Munja Kim of Suwon-si (KR) for samsung electronics co., ltd., Jongju Park of Suwon-si (KR) for samsung electronics co., ltd., Byunghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Yunhan Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G03F1/24
CPC Code(s): G03F1/24
Abstract: a photomask assembly includes a mask pattern providing an upper surface and including a plurality of pins extending in a vertical direction with respect to the upper surface, a pellicle membrane disposed to be spaced apart from the mask pattern in the vertical direction, and a frame assembly configured to support the pellicle membrane, wherein the frame assembly includes a frame body having a plurality of pin holes configured to respectively fasten the plurality of pins, a first magnetic member configured to surround the plurality of pin holes inside the frame body and generate an attractive force on the plurality of pins, and a second magnetic member disposed in a lower portion of the frame body and configured to generate an attractive force on the upper surface of the mask pattern.
Inventor(s): Seongwook CHUNG of Suwon-si (KR) for samsung electronics co., ltd., Woojin PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G05D1/648, A47L9/00, A47L9/28, A47L11/40, G05D1/622, G05D101/20, G05D105/10
CPC Code(s): G05D1/6484
Abstract: provided is a robot cleaner includes: a sensor; at least one memory storing one or more instructions; and at least one processor, wherein the at least one processor, by executing the one or more instructions, is configured to identify a plurality of objects based on sensing data acquired through the sensor, identify a target object located on a travel surface of the robot cleaner among the plurality of objects, acquire power information indicating remaining power of the robot cleaner, determine whether to avoid the target object based on a result of comparing the power information with a threshold power value, based on the power information being less than the threshold power value, control the robot cleaner to travel to avoid the target object, based on the power information being greater than or equal to the threshold power value, acquire feature information of the target object based on the sensing data, acquire type information of the target object based on the feature information, based on the type information including a predetermined type, control the robot cleaner to travel to avoid the target object, and based on the type information not including the predetermined type, control the robot cleaner to travel based on a movement path for moving the target object to a target location.
20250068215. BRIDGE DEVICE AND DISPLAY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Suan CHOI of Suwon-si (KR) for samsung electronics co., ltd., Bumho CHUN of Suwon-si (KR) for samsung electronics co., ltd., Dongwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonsuk SEO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1681
Abstract: a bridge device including a first cover having flexibility; a second cover having flexibility; a support member between the first cover and the second cover; a first connector fixed to the support member; and a second connector fixed to the support member and electrically connected to the first connector, wherein the bridge device is configured to be connectable to a first display device and a second display device so that, when the bridge device is connected to the first display device and the second display device, the first display device and the second display device are electrically connected through the first connector and the second connector, and the first display device and the second display device are rotatable relative to one another due to the flexibility of the first cover and the flexibility of the second cover.
Inventor(s): Junhee YOO of Yongin-si (KR) for samsung electronics co., ltd., Jaehyun KIM of Incheon (KR) for samsung electronics co., ltd., Jingyu AHN of Seoul (KR) for samsung electronics co., ltd., Wooil KIM of Suwon-si (KR) for samsung electronics co., ltd., Manhwee JO of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/3234, G11C7/22
CPC Code(s): G06F1/3234
Abstract: a system on chip (soc) and an application processor are provided. the soc includes a memory controller configured to control a memory; a plurality of function modules configured to access the memory through a memory interface; a system interconnect circuit configured to operate based on a first clock signal and connect the memory interface and the plurality of function modules; and a power controller configured to control the first clock signal to be periodically gated, and control the memory to operate in a lower-power mode during a period in which the first clock signal is gated.
Inventor(s): Jinmo KANG of Suwon-si (KR) for samsung electronics co., ltd., Gunhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunyoung JUNG of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01
CPC Code(s): G06F3/013
Abstract: a wearable device according to an embodiment includes: at least one camera configured for eye tracking, at least one display configured to be aligned with eyes of a user wearing the wearable device, and at least one processor comprising processing circuitry. at least one processor, individually and/or collectively, is configured to: control the wearable device to display a screen on the at least one display; obtain gaze data related to an object in the screen through the at least one camera; determine whether to recognize the gaze data as an input for the object, using an area for the object that has size set based on an overall brightness level of the screen; and execute a function provided from the object based on the gaze data recognized as the input.
Inventor(s): Sungsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Beomsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Boyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyojin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G02B27/00, G02B27/01, G06V20/20, G06V20/64
CPC Code(s): G06F3/013
Abstract: a wearable device includes a display, one or more cameras, and at least one processor configured to identify information on a target object and a visual object related to an external object corresponding to the target object in at least one image. the at least one processor is configured to identify whether a first image including the visual object is displayed through the display. the at least one processor is configured to change the first image to emphasize the visual object, based on identifying that the first image including the visual object is displayed through the display. the at least one processor is configured to display an affordance for changing the gaze of the user to display the first image by overlapping the second image, based on identifying that a second image, which is distinct from the first image including the visual object, is displayed through the display.
Inventor(s): Kyeongho KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungmoon KANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Changbyung PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jiwoo LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/046, G06F1/16, G06F3/0354, G06F3/041
CPC Code(s): G06F3/046
Abstract: an electronic device is provided and includes a housing, and a display module disposed on a front surface of the housing and including a display panel, a conductive pattern, and a digitizer panel disposed under the display panel; a digitizer circuit connected to the digitizer panel; and a processor electrically connected to the display module and the digitizer circuit. the digitizer circuit may be configured to recognize a first signal generated as the first cover of a cover device including a cover coil approaches the digitizer panel; and recognize a second signal generated as a pen input device approaches the digitizer panel. the processor may be configured to control the display module in response to recognition of the first signal and the second signal.
Inventor(s): Bona LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwansuk YOO of Suwon-si (KR) for samsung electronics co., ltd., Sukjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Junwon JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04845, G06F3/04842
CPC Code(s): G06F3/04845
Abstract: an electronic device is provided. the electronic device includes a display, a memory, and a processor operatively connected to the display and the memory, wherein the processor may be configured to display a screen composed of a plurality of windows corresponding to a plurality of applications on the display, detect an event for changing a layout of the plurality of windows, in response to the detection of the event, display, on the display, a plurality of recommended layouts in which the plurality of windows are arranged differently on the basis of an attribute of each of the plurality of applications and a state of the electronic device, and when one of the plurality of recommended layouts is selected, display, on the display, the plurality of windows to which the selected recommended layout is applied.
Inventor(s): Jongeun Lee of Ulsan (KR) for samsung electronics co., ltd., Jaewoo Park of Ulsan (KR) for samsung electronics co., ltd., Sugil Lee of Ulsan (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0613
Abstract: a memory device includes a memory cell array, an operator comprising a logic circuit configured to perform an operation comprising a plurality of stages, and a plurality of buffers configured to store first data and second data corresponding to a plurality of operation commands received from a host for each of the plurality of stages, respectively, wherein the operator comprises a butterfly unit configured to perform butterfly operations based on at least one of the first data and the second data.
Inventor(s): Hyojin AHN of Suwon-si (KR) for samsung electronics co., ltd., Seoyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hoon JO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G11C16/04, G11C16/08, G11C16/26, H10B43/27
CPC Code(s): G06F3/0619
Abstract: in some embodiments, an operating method of a storage device includes obtaining a plurality of points by searching for a first valley point between threshold voltage distributions of selection memory cells coupled to a selection word line of a plurality of word lines; calculating, using a first function, a first voltage level that corresponds to a first reference count value; calculating, using a second function, a second voltage level that corresponds to the first reference count value; classifying the selection memory cells into a plurality of coupling patterns according to an aggressor cell group of each of adjacent memory cells coupled to at least one adjacent word line adjacent to the selection word line; and performing a read operation, based on the plurality of coupling patterns of the selection memory cells, the first voltage level, and the second voltage level.
Inventor(s): Hao Yan of Xi'an (CN) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0631
Abstract: a storage device includes: a nand chip array having a plurality of nand chips; a zone switcher configured to control output of write data to a zone cache when a zone write command is received; the zone cache configured to cache the write data in a cache space corresponding to a zone among a plurality of zones; and a zone persistence controller configured to control storing, in parallel, the write data in at least two of the plurality of zones cached in the zone cache in nand chips of the nand chip array corresponding to the plurality of zones.
Inventor(s): Youkun SHIN of Suwon-si (KR) for samsung electronics co., ltd., Jea-Young KWON of Suwon-si (KR) for samsung electronics co., ltd., Jaesub KIM of Suwon-si (KR) for samsung electronics co., ltd., Yangwoo ROH of Suwon-si (KR) for samsung electronics co., ltd., Hongmoon WANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: disclosed is a method of operating a storage device which communicates with a host device. the method includes receiving a first request indicating a setting operation of a first virtual function corresponding to a first virtual machine from the host device executing the first virtual machine, the first request including first requirement level information of the first virtual machine, setting a first performance attribution of the first virtual function, based on the first requirement level information, and providing the host device with a done response indicating that the first performance attribution is set.
Inventor(s): Chon Yong LEE of Suwon-si (KR) for samsung electronics co., ltd., Jae-Gon LEE of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Chang RYOO of Suwon-si (KR) for samsung electronics co., ltd., Kyunghan LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyeyoung RYU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0656
Abstract: a method of operating storage devices, a memory device, a host device, and a switch, is provided. the method includes: receiving, by the memory device, a first request corresponding to target user data from the host device; generating, by the memory device, first input/output (i/o) stream information based on telemetry information corresponding to the storage devices and map data in a buffer memory of the memory device based on the first request, wherein the first i/o stream information indicates a data path between a first storage device of the storage devices and the host device; providing, by the memory device, a first redirection request including the first request and the first i/o stream information to the host device or the first storage device through the switch; and processing the target user data according to the first i/o stream information in the first redirection request.
Inventor(s): Natasha MEENA of Uttar Pradesh (IN) for samsung electronics co., ltd., Avinash SINGH of Uttar Pradesh (IN) for samsung electronics co., ltd., Mayur AGGARWAL of Uttar Pradesh (IN) for samsung electronics co., ltd.
IPC Code(s): G06F3/16, G10L21/028, G10L25/63
CPC Code(s): G06F3/165
Abstract: a method for modifying audio content including: determining a crisp emotion value defining an audio object emotion, for each audio object among a plurality of audio objects associated with an audio content, the plurality of audio objects being at least some of a total number of audio objects associated with the audio content; determining a composition factor representing one or more emotions, among a plurality of emotions, in the crisp emotion value of each audio object; calculating a probability of a user associating with each of the one or more emotions represented in the composition factor; and calculating a priority value for each audio object based on the probability of the user associating with the each of the one or more emotions represented in the composition factor of each audio object and the composition factor of each audio object.
Inventor(s): Boopathi RAMASAMY of Suwon-si (KR) for samsung electronics co., ltd., Weonsu KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeonjoo NA of Suwon-si (KR) for samsung electronics co., ltd., Kyoungbeom CHEA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F9/455
CPC Code(s): G06F9/45558
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment of the present disclosure, a method for operation of a first high availability (ha) pod included in a first cluster may comprise: while a first element management system (ems) of the first cluster is in an active state, identifying whether a failure has occurred in the first ems; based on the failure occurring in the first ems, transmitting, to a second ha pod included in a second cluster, a first message instructing to change a state of a second ems of the second cluster, is the second cluster being logically distinguished from the first cluster and includes the second ems, from a standby state to the active state; and changing a state of the first ems from the active state to the standby state.
Inventor(s): Rekha PITCHUMANI of Oak Hill VA (US) for samsung electronics co., ltd., Zongwang LI of Dublin CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F11/07, G06F11/14
CPC Code(s): G06F11/1044
Abstract: a storage device is disclosed. the storage device may include storage for data. a controller may manage writing the data to the storage and reading the data from the reading storage. a data quality metric table may map a first number of errors to a first data quality metric and map a second number of errors to a second data quality metric. a transmitter may return the data quality metric table to a host.
Inventor(s): Eunhye OH of Suwon-si (KR) for samsung electronics co., ltd., Taewook PARK of Suwon-si (KR) for samsung electronics co., ltd., Jisu KANG of Suwon-si (KR) for samsung electronics co., ltd., Yongki LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/10, G06F11/07
CPC Code(s): G06F11/1068
Abstract: provided is a storage device including a memory device configured to store original data; and a controller configured to control the memory device, the controller including a first error correction circuit configured to correct an error of the original data, and a second error correction circuit configured to correct an error of the original data, a maximum number of correctable error bits of the second error correction circuit being greater than a maximum number of correctable error bits of the first error correction circuit, a mapping memory configured to store at least some of parity bits generated by the second error correction circuit and store an address of the memory device at which the original data is stored; and a control block configured to control the first error correction circuit, the second error correction circuit, and the mapping memory.
Inventor(s): Woohyun KANG of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jisoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangkwon MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyunkyo OH of Suwon-si (KR) for samsung electronics co., ltd., Donghoo LIM of Suwon-si (KR) for samsung electronics co., ltd., Jin gu JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: a storage device includes a non-volatile memory device configured to store fast cell information obtained from a threshold voltage distribution formed through a one-shot program for memory cells; and a storage controller configured to read the fast cell information from the non-volatile memory device during booting or initialization to perform mapping a fast cell area based on a fast cell management policy, wherein the fast cell information is acquired through the one-shot program performed in a test stage or a mass production evaluation stage, and is stored in the non-volatile memory device before a firmware of the storage controller is executed.
Inventor(s): Xing HE of XiAn (CN) for samsung electronics co., ltd., Hao YAN of XiAn (CN) for samsung electronics co., ltd., Zhao CHEN of XiAn (CN) for samsung electronics co., ltd., Yiwen ZHANG of XiAn (CN) for samsung electronics co., ltd., Yanlong YANG of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F12/02
CPC Code(s): G06F12/0246
Abstract: a method and device for configuring zones of a zoned namespace (zns) solid state drive (ssd) are provided. the method includes determining types of sizes of zones into which storage space of the zns ssd is to be divided and a number of zones having each type of size, and sending information indicating the types of the sizes of the zones and the number of zones having each type of size to the zns ssd such that the storage space of the zns ssd is divided into zones having different sizes.
Inventor(s): INSOON JO of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/16, G06F9/50
CPC Code(s): G06F13/1668
Abstract: an operating method of an electronic device which includes a processor and a memory, the method including: accessing, using the processor, the memory without control of an external host device in a first bias mode; sending, from the processor, information of the memory to the external host device when the first bias mode ends; and accessing, using the processor, the memory under control of the external host device in a second bias mode.
20250068579. SYSTEM ON CHIP_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minha Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F13/42
CPC Code(s): G06F13/42
Abstract: a system on chip is provided. the system on chip includes a bus including a data channel through which data is transmitted in at least one direction and a master interface configured to receive first data from the data channel, perform a bit operation on the first data and on second data input before input of the first data, determine an encoding operation for the first data based on a result of the bit operation, perform the encoding operation on the first data, to obtain encoded data, and provide the encoded data and a transformation signal indicating the encoding operation to the data channel.
Inventor(s): Yuanyi ZHANG of XiAn (CN) for samsung electronics co., ltd., Heng Zhang of XiAn (CN) for samsung electronics co., ltd., Wenwen Chen of XiAn (CN) for samsung electronics co., ltd.
IPC Code(s): G06F16/17
CPC Code(s): G06F16/1724
Abstract: a defragmentation method may include: acquiring at least one chunk information of data in response to a writing request for the data, wherein the at least one chunk information may include an identification of at least one chunk and a stream identification assigned to data of the at least one chunk; updating a fragmentation degree of each of the at least one chunk and a stream to which the each of the at least one chunk belongs in a chunk index structure to obtain an updated chunk index structure, based on the at least one chunk information, wherein the chunk index structure may include identifications of a plurality of chunks, stream identifications corresponding to the plurality of chunks, and fragmentation degrees of the plurality of chunks; and determining a first chunk to be defragmented, based on the fragmentation degrees of the plurality of chunks in the updated chunk index structure.
Inventor(s): Rajashekhar Hanumantappa Payagond of San Diego CA (US) for samsung electronics co., ltd., Kedar Patwardhan of Urbana IL (US) for samsung electronics co., ltd., Nithya Ramakrishnan of San Jose CA (US) for samsung electronics co., ltd., Mayank Saxena of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/2455, G06F16/2457
CPC Code(s): G06F16/24553
Abstract: a system and method for accelerating algorithms using disaggregated computational storage. in some embodiments, the system includes: a non-volatile storage device, including: non-volatile memory; and a processing circuit, wherein: the non-volatile memory of the non-volatile storage device stores a first part of an object portion; and the processing circuit of the non-volatile storage device is configured: to receive a data structure, the data structure defining a query; and to execute an operation, on the first part of the object portion, based on the query.
Inventor(s): Usman Sajid of Lawrence KS (US) for samsung electronics co., ltd., Sai Prahladh Padmanabhan of San Jose CA (US) for samsung electronics co., ltd., Marie Mai Nguyen of Pittsburgh PA (US) for samsung electronics co., ltd., Rekha Pitchumani of Oak Hill VA (US) for samsung electronics co., ltd., Yang Seok Ki of Palo Alto CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F16/28, G06F16/245, G06F16/2455
CPC Code(s): G06F16/285
Abstract: a method of grouping embedding vectors in a storage device includes receiving, at a storage device, an inference query request including a first access index associated with a first embedding vector, determining, with a classification model, a first classification of the first access index, based on the first classification, searching for the first embedding vector in a cache of the storage device, receiving, at the storage device, a second access index associated with a second embedding vector, determining, with the classification model, a second classification of the second access index, and based on the second classification, searching for the second embedding vector in a persistent storage of the storage device.
Inventor(s): Hyungseuk KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F21/44, G06F21/60, G06F21/71
CPC Code(s): G06F21/445
Abstract: a method of manufacturing a multi-chip includes generating a first authentication certificate in a first die using a private key of the first die, verifying the first authentication certificate in a second die using a public key of the first die, generating a second authentication certificate in the second die using a private key of the second die, and verifying the second authentication certificate using a public key of the second die in a third die.
Inventor(s): Vipul GUPTA of Bangalore (IN) for samsung electronics co., ltd., Ankur Agrawal of Bangalore (IN) for samsung electronics co., ltd., Vaibhav Negi of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): G06F21/60, G06N5/04
CPC Code(s): G06F21/602
Abstract: a method, an electronic device and a non-transitory computer readable medium for securing sensor data are provided. the method comprises: obtaining context information by fetching a plurality of sensor data by a plurality of applications, mapping the plurality of sensor data to the plurality of applications and storing the mapped plurality of sensor data, generating pre-processed information based on the context information and the mapped plurality of sensor data, creating an inference category of the pre-processed information based on the pre-processed information and information from a database, and predicting at least one useful inference and at least one harmful inference of the plurality of sensor data based on the inference category, the context information and the plurality of sensor data.
Inventor(s): Saurabh Pareek of Noida (IN) for samsung electronics co., ltd., Abhishek Kumar Singh of Noida (IN) for samsung electronics co., ltd., Udish Nagpal of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): G06F21/84, G06F21/62
CPC Code(s): G06F21/84
Abstract: a method and/or system for securing display of confidential content by an electronic device. the method may include displaying content on a screen of the electronic device. the method may include detecting an event to initiate a secure mode in the electronic device. the method may include determining confidential portions and non-confidential portions of the content displayed on the screen of the electronic device based on a view priority score and a confidentiality score, and determining a viewing angle of a user of the electronic device and a viewing distance of the user of the electronic device. the method may include displaying the confidential portions of the content based on the viewing angle of the user of the electronic device and the viewing distance of the user of the electronic device.
Inventor(s): Sang Ha PARK of Suwon-si (KR) for samsung electronics co., ltd., Hasup LEE of Suwon-si (KR) for samsung electronics co., ltd., Kuhwan JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/25
CPC Code(s): G06F30/25
Abstract: a method and device with spectrum modeling are disclosed. the electronic device includes one or more processors and a memory electrically connected to the processor and storing instructions configured to cause the one or more processors to: determine, based on a spectrum and a number of clusters, initial values of respective parameters included in a resonance mixture model that models a resonance function; determine, for each of the number of clusters, values of the parameters based on a loss between the spectrum and the resonance mixture model; and generate a model corresponding to the spectrum based on the determined values of the parameters.
Inventor(s): YUNHO CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jeong Min KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F30/398, G06F30/392, G06F115/02, G06F119/06
CPC Code(s): G06F30/398
Abstract: provided is a method of designing a layout of a semiconductor device including a plurality of wiring layers, the method including verifying a power distribution network, the verifying of the power distribution network including designing a layout including a power wiring pattern, extracting a top layer wiring pattern and a next-top layer wiring pattern connected to bumps in the power wiring pattern, determining whether the top layer wiring pattern and the next-top layer wiring pattern are interconnected, and modifying the layout based on whether the top layer wiring pattern and the next-top layer wiring pattern are interconnected.
Inventor(s): Hyungtak CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyeonmok KO of Suwon-si (KR) for samsung electronics co., ltd., Sangjun JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F40/35
CPC Code(s): G06F40/35
Abstract: a control method of an electronic device for generating an event including: obtaining, in real-time, participants from a conversation content and the conversation content of the participants; and generating an event including at least one slot from the obtained conversation content using a trained event generating artificial intelligence model, where the generating the event includes: identifying the participants and history information regarding slot contents from a dialogue history of the participants; applying weight values to each of the slot contents expressed by each identified participant based on at least one among confirm or reject information, additional information, and history information of other participants regarding respective slot contents expressed by each participant identified from the obtained conversation content; and determining a slot content agreed to by participants, or a slot content having at least a pre-set weight as a final slot content of the at least one slot of the event.
Inventor(s): Jonghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Chulsoo PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/048
CPC Code(s): G06N3/048
Abstract: a method performed by at least one processor configured to implement an accelerator for processing a softmax function includes: obtaining input data comprising a plurality of quantized input values; generating input data distribution information indicating a plurality of frequencies corresponding to the plurality of quantized input values included in the input data; identifying a largest value from among the plurality of quantized input values as a first maximum value, based on the input data distribution information; determining an offset value based on a difference between the first maximum value and a second maximum value, wherein the second maximum value indicates a maximum quantization value that is representable by an input value of the input data; determining a plurality of index values by applying the offset value to each quantized input value of the plurality of quantized input values; and outputting a value of the softmax function corresponding to each of the plurality of quantized input values based on the plurality of index values.
Inventor(s): Youngchun KWON of Suwon-si (KR) for samsung electronics co., ltd., Seokho KANG of Gwacheon-si (KR) for samsung electronics co., ltd., Jin Woo KIM of Suwon-si (KR) for samsung electronics co., ltd., Seung Min BAEK of Suwon-si (KR) for samsung electronics co., ltd., Joonhyuk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Taesin HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0499, G06N3/045, G06N3/0895, G16C20/10, G16C20/70
CPC Code(s): G06N3/0499
Abstract: provided is a method of training a prediction model, the method including obtaining molecular descriptors of molecules based on a molecular database, pre-training a pre-training neural network based on the molecular descriptors, and adjusting the pre-training neural network such that the pre-training neural network matches a target task, by applying a training data set labeled corresponding to the target task to the pre-trained pre-training neural network.
Inventor(s): Pengtao ZHANG of Xi'an (CN) for samsung electronics co., ltd., Chao MA of Xi'an (CN) for samsung electronics co., ltd., Chao WEI of Xi'an (CN) for samsung electronics co., ltd., Hao YANG of Xi'an (CN) for samsung electronics co., ltd.
IPC Code(s): G06N3/126
CPC Code(s): G06N3/126
Abstract: a method and device for optimizing parameters of a biometric recognition mode are provided, the method includes: repeating steps of selecting a first test data set si from current decision space based on latin hypercube sampling (lhs), obtaining a first set o of multi-objective values corresponding to the set s determined based on original evaluation and determining a first pareto solution set of the set si based on the set o, wherein the decision space is composed of parameters of the biometric recognition model, selecting a second test data set s from the current decision space based on a non-dominated ranking genetic algorithm nsga and obtaining a second set o of multi-objective values corresponding to the set s determined based on a trained agent model, determining a second pareto solution set of the set s based on the set o, and updating the current decision space based on the set o, the set o, the set s and the set s until a condition is met; and determining a final pareto solution set based on the first pareto solution set and the second pareto solution set in response to the condition being satisfied.
Inventor(s): Minje KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaejin LEE of Seoul (KR) for samsung electronics co., ltd., Dohun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinpyo KIM of Seoul (KR) for samsung electronics co., ltd., Soon-Wan KWON of Suwon-si (KR) for samsung electronics co., ltd., Heehoon KIM of Seoul (KR) for samsung electronics co., ltd., Daeyoung PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06N5/022, G06F1/3203, G06N3/04
CPC Code(s): G06N5/022
Abstract: a processor-implemented method includes obtaining a benchmark execution result, receiving input data comprising a neural network model subject to prediction and analysis requirement information, receiving information on hardware of a device in which the neural network model is run, building a prediction model based on the benchmark execution result and the hardware information, extracting layer information respectively corresponding to a plurality of layers configuring the neural network model, and predicting either one or both of operation performance information and energy efficiency information respectively corresponding to the plurality of layers by inputting the analysis requirement information and the layer information to the prediction model.
Inventor(s): Minyoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Taegeon UM of Suwon-si (KR) for samsung electronics co., ltd., Byungsoo OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N5/04
CPC Code(s): G06N5/04
Abstract: an electronic device include at least one processor that causes the electronic device to: acquire first throughput information for an inference operation of a first model and second throughput information for a training operation of a second model, identify, based on at least the first throughput information and the second throughput information, a first resource to perform the inference operation of the first model and a second resource to perform the training operation of the second model, allocate the identified first resource as a resource to perform the inference operation of the first model, and allocate the identified second resource as a resource to perform the training operation of the second model, and train, based on the allocated first and second resources, the second model by using the inference result of the first model.
Inventor(s): Yuqi ZHANG of Xian (CN) for samsung electronics co., ltd., Shuyang WANG of Xian (CN) for samsung electronics co., ltd., Wenwen HAO of Xian (CN) for samsung electronics co., ltd., Yongwong KWON of Suwon-si (KR) for samsung electronics co., ltd., Chankyu KOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N20/20
CPC Code(s): G06N20/20
Abstract: a method for operating a storage device and the storage device are provided. the method includes obtaining an initial failure warning model comprising a plurality of decision trees, the obtaining the initial failure warning model including being trained with a random forest algorithm based on historical failure related data, the historical failure related data comprising historical multiple operational attributes data of the storage device and failure logs of the storage device, determining high frequency decision nodes in the plurality of decision trees, the high frequency decision nodes being similar single-nodes with at least a first number in the plurality of decision trees, the similar single-nodes being single-nodes having a same monitoring attribute, a same attribute determination symbol, and a difference between attribute thresholds within a first range, and constructing the failure warning model of a new decision tree comprising the high frequency decision nodes.
Inventor(s): Hyunwoo CHUN of Suwon-si (KR) for samsung electronics co., ltd., Wonkyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun PARK of Suwon-si (KR) for samsung electronics co., ltd., Hyesu YEOM of Suwon-si (KR) for samsung electronics co., ltd., Seongmin JOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06Q30/0242, G06Q30/0251
CPC Code(s): G06Q30/0245
Abstract: an electronic apparatus comprises: a display; a memory that stores a trained first artificial intelligence model; and at least one processor that acquires viewing group information of a user by inputting context information including profile information of the user and use history information of the electronic apparatus into the first artificial intelligence model, controls the display to display advertisement content identified on a basis of the obtained viewing group information, acquires feedback information of the user related to the displayed advertisement content, and updates the first artificial intelligence model to a second artificial intelligence model retrained on the basis of the input context information and the obtained feedback information.
Inventor(s): Nazrinbanu Nurmohammad NAGORI of Bangalore (IN) for samsung electronics co., ltd., Mrinmoy SEN of Bangalore (IN) for samsung electronics co., ltd., Venkat Ramana PEDDIGARI of Bangalore (IN) for samsung electronics co., ltd., Sai Pradyumna CHERMALA of Bangalore (IN) for samsung electronics co., ltd., Praful MATHUR of Bangalore (IN) for samsung electronics co., ltd., Darshana Venkatesh MURTHY of Bangalore (IN) for samsung electronics co., ltd., Moonhwan JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T5/50, G06T7/00
CPC Code(s): G06T5/60
Abstract: a method may include: receiving, by a first camera of a multi-camera device, a first image of an input scene; identifying at least one shadow in the first image; determining at least one of at least one property of the at least one shadow or a region of interest (roi) of the at least one shadow in the first image; applying at least one configuration to a second camera for obtaining a second image of the input scene based on the at least one of at least one property of the at least one shadow or the roi of the at least one shadow, to identify at least one additional context of the input scene, where the at least one additional context is not obtained using the first camera; and removing the at least one shadow from the first image, based on the first image and the second image.
Inventor(s): Sangwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Nagyeong LEE of Suwon-si (KR) for samsung electronics co., ltd., Hana LEE of Suwon-si (KR) for samsung electronics co., ltd., Myungsub CHOI of Suwon-si (KR) for samsung electronics co., ltd., Hyong Euk LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/00, G06T5/50, G06T5/60, H04N5/265, H04N23/67
CPC Code(s): G06T7/0002
Abstract: a method of determining a focal length and an electronic device that performs the method are provided. the electronic device includes a processor, a camera comprising a lens, and a memory configured to store one or more instructions executable by the processor. the processor is configured to receive a plurality of original images with the lens in response to the one or more instructions being executed, generate a composite image based on the plurality of original images, and determine a focal length of the lens by inputting one or more original images of the plurality of original images and the composite image to an autofocus (af) model.
Inventor(s): Vishakha S R of Karnataka (IN) for samsung electronics co., ltd., Bindigan Hariprasanna Pawan Prasad of Bangalore (IN) for samsung electronics co., ltd., Green Rosh K S of Kerala (IN) for samsung electronics co., ltd., Akula Jayaprakash of Orissa (IN) for samsung electronics co., ltd.
IPC Code(s): G06T7/246, G06T3/18, G06T7/70, G06V40/20
CPC Code(s): G06T7/246
Abstract: a method for recognizing an action of at least one object in a plurality of images, includes obtaining a plurality of image frames by capturing at least one object on a ground plane; detecting a motion of the at least one object and a motion of the ground plane in each of the plurality of image frames; estimating a trajectory of the ground plane by tracking the motion of the ground plane; correcting the motion of the at least one object in each of the plurality of image frames based on the trajectory of the ground plane; and recognizing an action of the at least one object based on the corrected motion of the at least one object.
Inventor(s): Hyuntaek WOO of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Sanghun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jungjik LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/246, G06F3/01, G06F3/0338
CPC Code(s): G06T7/248
Abstract: a wearable device includes memory storing instructions, a camera, and at least one processor. the instructions, when executed by the at least one processor individually or collectively, causes the wearable device to obtain at least one first image having a first attribute for tracking of body portion of a user and at least one second image having a second attribute different from the first attribute for tracking of an external electronic device, to obtain first feature values for tracking of the body portion from the at least one first image and second feature values for tracking of the external electronic device from the at least one second image, to change a mode of the wearable device from the first mode to a second mode based on the first feature values and the second feature values, and to obtain, in the second mode, another images.
Inventor(s): Jihye KIM of Anyang-si (KR) for samsung electronics co., ltd., Seon Min RHEE of Seoul (KR) for samsung electronics co., ltd., Heewon KIM of Seoul (KR) for samsung electronics co., ltd., Seungju HAN of Seoul (KR) for samsung electronics co., ltd., Jaejoon HAN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/55
CPC Code(s): G06T7/55
Abstract: a method and apparatus for generating a depth image are provided. the apparatus receives an input image, extracts a feature corresponding to the input image, generates features for each depth resolution by decoding the feature using decoders corresponding to different depth resolutions, estimates probability distributions for each depth resolution by progressively refining the features for each depth resolution, and generates a target depth image corresponding to the input image based on a final estimated probability distribution from among the probability distributions for each depth resolution.
Inventor(s): Haoyu REN of San Diego CA (US) for samsung electronics co., ltd., Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd., Jungwon LEE of San Diego CA (US) for samsung electronics co., ltd., Hai SU of San Diego CA (US) for samsung electronics co., ltd., Qingfeng LIU of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06T7/579, G06T3/18, G06T7/194
CPC Code(s): G06T7/579
Abstract: methods and systems for performing video prediction, including obtaining an input frame from among a plurality of frames included in an input video; extracting a first feature map by providing the input frame to a first plurality of feature extraction layers and a first strided convolutional layer included in an encoder; providing the first feature map and at least one neighboring first feature map corresponding to at least one neighboring frame to a first fusion module included in the encoder; fusing the first feature map with the at least one neighboring first feature map to generate a fused first feature map using the first fusion module; generating a prediction corresponding to the input frame based on the fused first feature map using a decoder; and performing a video prediction task using the prediction.
Inventor(s): Ho-Ik CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yonggonjong PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaewoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T7/73, B60W60/00, G06V10/762, G06V10/774, G06V10/776, G06V20/58
CPC Code(s): G06T7/73
Abstract: a processor-implemented method including determining, from a first image frame, a first amodal region including a visible region in which a static landmark is visible and an occluded region in which the static landmark is occluded, calculating an occluded region confidence information for the occluded region in the first amodal region based on the first amodal region, determining a second amodal region corresponding to the static landmark from a second image frame temporally subsequent to the first image frame, calculating transformation information between the first image frame and the second image frame based on the first amodal region, the second amodal region, and the occluded region confidence information, and calculating localization information of an electronic device comprising the processor based on the transformation information.
Inventor(s): Kiwon YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T9/00, G06N3/045, H04N19/436
CPC Code(s): G06T9/002
Abstract: disclosed is an electronic device processing an image using ai encoding. the electronic device comprises: a memory in which a learned first neural network model is stored; a communication interface; and a processor configured to obtain ai decoding information of an external device and context information of the electronic device; identify operation setting information associated with ai encoding based on the ai decoding information of the external device and the context information of the electronic device; input an image into a first neural network model to which the operation setting information is applied to obtain an ai-encoded image; obtain a compressed image by encoding the ai-encoded image; transmit the compressed image and ai encoding information associated with the first neural network model to the external device through the communication interface.
Inventor(s): Seungki CHO of Suwon-si (KR) for samsung electronics co., ltd., Sunggyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Han KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaemun SIM of Suwon-si (KR) for samsung electronics co., ltd., Injae YU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T15/00, G06T7/20, G06V10/44
CPC Code(s): G06T15/00
Abstract: an electronic apparatus, includes: one or more processors; and at least one memory storing instructions that, when executed by the one or more processors, cause the electronic apparatus to: obtain image frames in a user-captured image stored in the at least one memory; identify an object which includes motion information based on the image frames; obtain first feature information of the object from a first image frame from among the image frames; obtain a first avatar image corresponding to the object based on the first feature information; obtain second feature information of the object from a second image frame from among the image frames; obtain a second avatar image corresponding to the object based on the second feature information; and obtain a virtual space image based on the first avatar image and the second avatar image.
Inventor(s): Tristan AUMENTADO-ARMSTRONG of Toronto CA (US) for samsung electronics co., ltd., Ashkan MIRZAEI of Toronto (CA) for samsung electronics co., ltd., Aleksai LEVINSHTEIN of Thornhill (CA) for samsung electronics co., ltd., Marcus Anthony BRUBAKER of Toronto (CA) for samsung electronics co., ltd., Konstantinos G. DERPANIS of Toronto (CA) for samsung electronics co., ltd., Igor GILITSCHENSKI of Toronto (CA) for samsung electronics co., ltd.
IPC Code(s): G06T15/20, G06T15/06
CPC Code(s): G06T15/205
Abstract: an electronic device includes: a camera; a memory; a processor to obtain a plurality of multiview color images of the object; obtain, from the latent field about the object, a plurality of multiview latent images and a plurality of camera parameters respectively corresponding to the plurality of multiview latent images; based on the plurality of multiview latent images and the plurality of camera parameters, render a first feature map about the object by using a latent field and an autoencoder; based on the first feature map about the object, train the improved nerf by performing iterative operations; receive a request for a novel view of the object; generate, by using the improved nerf, a second feature map from the novel view of the object; and generate, by a decoder of the autoencoder, an image about the novel view of the object based on the second feature map.
Inventor(s): Minkyung KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Jungjik LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungoh KIM of Suwon-si (KR) for samsung electronics co., ltd., Dasom LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G02B27/01
CPC Code(s): G06T19/006
Abstract: according to an embodiment, a processor of a wearable device obtains, while displaying a first screen with respect to a virtual space on an entire displaying region of a display, an audio signal including sound of an external space by using one or more microphones. the processor identifies, in response to detection of an external object generating the sound by using the audio signal, data corresponding to the external object in information associated with the external space obtained based on the camera. the processor, based on identifying the data in the information, displays, together with the first screen in the displaying region, a second screen including a portion segmented from an image obtained from the camera based on the identified data.
Inventor(s): Fang Qin of Suzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G06V10/75, G06T7/231
CPC Code(s): G06V10/751
Abstract: a method of image matching and an image processing device are disclosed. the method comprises: obtaining a reference image and an image to be matched; determining a template image block in the reference image, wherein the template image block is an image block located in a matching window in the reference image; determining a first image block in the image to be matched, wherein the first image block is an image block in the image to be matched having a smallest sum of an absolute difference (sad) with the template image block; determining a second image block in the image to be matched, wherein the second image block is an image block in the image to be matched having a smallest gradient information difference with the template image block; and determining a matching image block in the image to be matched based on the first image block and the second image block.
Inventor(s): Enxing Xiong of San Jose CA (US) for samsung electronics co., ltd., Michael Blix of Sunnyvale CA (US) for samsung electronics co., ltd., Laszlo Gombos of Winchester MA (US) for samsung electronics co., ltd.
IPC Code(s): G06V10/771, G06T7/70, G06T7/90, G06V10/56
CPC Code(s): G06V10/771
Abstract: in one embodiment, a method includes determining a first camera pose and a second camera pose. the method includes accessing, for a first frame, a first feature map that includes a feature vector for each pixel in the first frame and determining, by a nerf model and based on the first feature map and the first pose, a first color value for each first-frame pixel the method further includes accessing a second feature map for a second frame, determining (1) a feature-map difference between the first and second feature maps and (2) a pose difference between the first and second poses, and determining a second color value for each pixel in the second frame by modifying the first color value of a corresponding pixel in the first frame with an output of a trained residue neural network, the output based on (1) the feature-map difference and (2) the pose difference.
Inventor(s): Jaewook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Haedong Yeo of Suwon-si (KR) for samsung electronics co., ltd., Junho Rim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06V20/40, G06F40/20, G06V10/25, G06V10/774, G11B27/031
CPC Code(s): G06V20/46
Abstract: a device and method for providing a recipe video are provided, the method including obtaining text feature information corresponding to each step of a cooking recipe, the cooking recipe comprising a plurality of steps corresponding to a plurality of coking actions; obtaining image feature information corresponding to each frame of a plurality of frames constituting a cooking video; matching each step of the cooking recipe with a respective section of the cooking video based on a correlation between the obtained text feature information and the obtained image feature information obtained using a machine learned matching model, wherein the respective section of the cooking video corresponds to a respective step among the plurality of steps; and generating the recipe video by using the respective section of the cooking video matched with each step of the cooking recipe.
Inventor(s): Sohmin AHN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G06T11/00
CPC Code(s): G09G3/20
Abstract: an electronic device includes a memory configured to store computer-executable instructions, a processor configured to execute the computer-executable instructions by accessing the memory, and a communicator configured to receive luminance information comprising a maximum luminance and a luminance setting value from at least one target device among one or more external devices identified by the electronic device. the processor is configured to determine a luminance value of the at least one target device, based on the luminance information received from the at least one target device. the processor is further configured to determine a luminance value of an ar image associated with the at least one target device, based on the luminance value of the at least one target device.
Inventor(s): Minsung Kim of Suwon-si (KR) for samsung electronics co., ltd., Seung-Hoon Baek of Suwon-si (KR) for samsung electronics co., ltd., Choonghoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jeong Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
CPC Code(s): G09G3/2092
Abstract: a display device includes a pixel array including a plurality of pixels connected to a plurality of source lines, a voltage generator configured to generate a reference voltage, and a source driver configured to output a first source signal corresponding to a first source line among the plurality of source lines, receive a first return signal corresponding to the first source signal through a second source line positioned adjacent to the first source line, and generate a first count value based on a first comparison result of the first return signal and the reference voltage.
Inventor(s): Sangwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Joohyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20, G09G3/32, G09G3/3275
CPC Code(s): G09G3/2096
Abstract: a device and method for the device are provided such that the device is of a modular display device and includes a plurality of display modules, a first communication interface, a second communication interface, and a processor that identifies a driving gain value of the display device for an image displayed, receive a first driving gain value from a first display device from among the display devices through the first communication interface; receive a second driving gain value from a second display device from among the display devices through the second communication interface, identify, on a basis of a magnitude of the driving gain value, one from among the driving gain value of the display device and the first and second driving gain values received through the first and second communication interfaces, and display an image corresponding to the image data on the basis of the identified driving gain value.
Inventor(s): Seokho BAN of Suwon-si (KR) for samsung electronics co., ltd., Dongho LEE of Suwon-si (KR) for samsung electronics co., ltd., Sunyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooyeoun YOON of Suwon-si (KR) for samsung electronics co., ltd., Yongjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Bumho CHUN of Suwon-si (KR) for samsung electronics co., ltd., Jaewon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Nakwon CHOI of Suwon-si (KR) for samsung electronics co., ltd., Suan CHOI of Suwon-si (KR) for samsung electronics co., ltd., Saerom HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/00
CPC Code(s): G09G5/006
Abstract: a display apparatus may include: at least one processor configured to execute instructions to: based on identifying that the display apparatus is connected with a second display apparatus, identify a past connection history with the second display apparatus and first screen setting information corresponding to the past connection history, stored in the at least one memory; based on receiving second screen setting information of a second display in the second display apparatus through the communication interface, compare the first screen setting information and the second screen setting information; based on identifying that the first screen setting information and the second screen setting information are different as a result of the comparing, control the first display to display a message requesting to select one of the first screen setting information or the second screen setting information; and change a screen setting of the display based on a selected screen setting information.
Inventor(s): YOUNGJAE PARK of Suwon-si (KR) for samsung electronics co., ltd., SOOMIN KIM of Suwon-si (KR) for samsung electronics co., ltd., Yuchan KIM of Suwon-si (KR) for samsung electronics co., ltd., DONGHA KIM of Suwon-si (KR) for samsung electronics co., ltd., HYUNBO KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/406, G11C11/4076
CPC Code(s): G11C11/40615
Abstract: a self-refresh method of a semiconductor memory device includes: receiving a self-refresh entry command associated with a self-refresh operation; counting an elapsed time from a time of receiving the self-refresh entry command; and skipping the self-refresh operation depending on whether a self-refresh exit command is received before the counted elapsed time exceeds a reference time.
Inventor(s): Tal PHILOSOF of GIVATAYIM (IL) for samsung electronics co., ltd., Lior KISSOS of NETANYA (IL) for samsung electronics co., ltd., Ariel DOUBCHAK of HERZLIYA (IL) for samsung electronics co., ltd., Amit BERMAN of BINYAMINA (IL) for samsung electronics co., ltd.
IPC Code(s): G11C16/08, G11C16/10, G11C16/26, G11C29/52
CPC Code(s): G11C16/08
Abstract: provided are a memory system, a method of reading data and a method of finding read thresholds. the method of finding read thresholds includes: selecting a channel distribution among a plurality of channel distributions that corresponds to a read page of the memory device to be read in response to a read command; generating a trellis diagram based on a decoding scheme and a type of the read page; determining an optimal path through the trellis diagram using the selected channel distribution according to a dynamic programming algorithm; and finding the read thresholds from the optimal path.
Inventor(s): Rockhyun Baek of Pohang-si (KR) for samsung electronics co., ltd., Kihoon Nam of Pohang-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C16/12, G11C16/04, G11C16/32
CPC Code(s): G11C16/12
Abstract: a memory device, including: a memory cell array including a plurality of cell strings; a voltage generator configured to generate a precharge voltage, a program voltage, and a negative voltage; and a control logic circuit configured to control a program operation for programming a threshold voltage of a selected memory cell to have a target state, wherein the program operation is performed using a plurality of program loops, based on a voltage increment of the program voltage, and wherein each program loop from among the plurality of program loops includes a precharge duration and a program execution duration, wherein the control logic circuit is further configured to provide the negative voltage to a plurality of unselected string select transistors and a plurality of unselected ground select transistors included in a plurality of unselected cell strings from among the plurality of cell strings, during the program execution duration.
Inventor(s): Wonyoung Jang of Suwon-si (KR) for samsung electronics co., ltd., Taewon Kim of Suwon-si (KR) for samsung electronics co., ltd., Sanghee Kang of Suwon-si (KR) for samsung electronics co., ltd., Taeyun Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/00, G11C29/56
CPC Code(s): G11C29/76
Abstract: a memory device including a repair circuit and an operating method of the memory device are provided. the operating method includes outputting a signal representing a pre-decoded faulty row address based on predecoding a faulty row address, outputting a signal representing a pre-decoded row address based on predecoding a row address, outputting hit signals based on comparing a bit value of the pre-decoded faulty row address with a bit value of the pre-decoded row address, outputting a repair enable signal based on the hit signals, and performing a row repair operation based on the repair enable signal.
Inventor(s): Wooseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Sangmin YOO of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeol BAE of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Soyeon KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01F27/28, H03H7/38, H04B1/04
CPC Code(s): H01F27/28
Abstract: a switchable coil includes a first coil including a first outer coil and a first inner coil, the first inner coil and the first outer coil forming a first crossing-region, a second coil including a second outer coil and a second inner coil, the second inner coil and the second outer coil forming a second crossing-region, and the second crossing-region being inside the first inner coil viewed in a first direction, and a switch connected to a region facing the second crossing-region in the second inner coil.
Inventor(s): Solhee IN of Suwon-si (KR) for samsung electronics co., ltd., Dohyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sungsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaesup Lee of Suwon-si (KR) for samsung electronics co., ltd., Byungwook Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/244, H01J37/32, H02J50/20, H02J50/40, H02J50/90
CPC Code(s): H01J37/244
Abstract: a system includes a radio frequency (rf) device outputting an rf signal; and at least one sensor device generating a power supply voltage using the rf signal output from the rf device, and operating by the power supply voltage, wherein the sensor device includes a case; a plurality of detectors disposed in the case, and collecting environmental data of a space in which the rf device and the sensor device are input, to generate detection data; a battery supplying a power supply voltage necessary for operation of the plurality of detectors; and a charger charging the battery, wherein the charger includes an antenna installed in the case and receiving rf power from an external source, an rf-dc converter converting an alternating current voltage corresponding to the rf power into a direct current voltage, a matching circuit connected between the antenna and the rf-dc converter, and a dc-dc converter adjusting a level of the direct current voltage and charging the battery.
Inventor(s): Myeongsoo Shin of Suwon-si (KR) for samsung electronics co., ltd., Donghyeon Na of Suwon-si (KR) for samsung electronics co., ltd., Kyung-Sun Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaebin Kim of Suwon-si (KR) for samsung electronics co., ltd., Myoung Soo Park of Suwon-si (KR) for samsung electronics co., ltd., Jong In Park of Suwon-si (KR) for samsung electronics co., ltd., Seungbo Shim of Suwon-si (KR) for samsung electronics co., ltd., Jimo Lee of Suwon-si (KR) for samsung electronics co., ltd., Woongjin Cheon of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32669
Abstract: a magnetic element assembly includes a magnetic member having a circular ring shape or an arc shape, and at least one focusing member made of a ferromagnetic material, connected to the magnetic member, and configured to adjust distribution of a magnetic force in a peripheral space, where the at least one focusing member includes a connection portion connected to the magnetic member and at least one focusing portion extending downward from the connection portion.
Inventor(s): Jonghwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Jawon KO of Suwon-si (KR) for samsung electronics co., ltd., Taijo JEON of Suwon-si (KR) for samsung electronics co., ltd., Yunsong JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32917
Abstract: a plasma processing apparatus includes a chamber in which plasma is generated, a support portion configured to support an object to be processed within the chamber, a head portion within the chamber and opposite to the support portion in a first direction, and a plasma analyzer including: a plurality of light collectors in the head portion, the plurality of light collectors configured to receive light emitted from plasma at a plurality of positions, a spectrometer outside the chamber nd connected to the plurality of light collectors, and a multiplexer connected between the plurality of light collectors and the spectrometer, the multiplexer configured to select one of a plurality of lights transmitted from the plurality of light collectors and transmit the selected one of the plurality of lights to the spectrometer.
Inventor(s): Jonghwa LEE of Suwon-si (KR) for samsung electronics co., ltd., Jawon KO of Suwon-si (KR) for samsung electronics co., ltd., Taijo JEON of Suwon-si (KR) for samsung electronics co., ltd., Yunsong JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32, G01J3/28, H01L21/66
CPC Code(s): H01J37/32972
Abstract: a sensor apparatus for analyzing plasma in a plasma processing chamber, includes: a first substrate; a second substrate on the first substrate; and a plurality of sensors between the first substrate and the second substrate, the plurality of sensors being spaced apart from each other, wherein each of the plurality of sensors includes: (a) a sensing assembly that includes: (i) a wavelength selector on which light emitted from the plasma is incident and that is configured to separate wavelengths of a spectrum of the light, and (ii) a spectrometer that is optically connected to the wavelength selector and that is configured to detect the spectrum for each separated wavelength; and (b) a battery connected to the sensing assembly and configured to supply first power to the sensing assembly.
Inventor(s): Jakyoung Gu of Suwon-si (KR) for samsung electronics co., ltd., Kyoungok Jung of Suwon-si (KR) for samsung electronics co., ltd., Jihye Shim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, G03F7/00, G03F7/20, H01L23/00, H01L23/31, H01L23/538, H01L25/00
CPC Code(s): H01L21/481
Abstract: in a method of manufacturing a semiconductor package, a lower redistribution wiring layer having a central region and a peripheral region surrounding the central region is formed. a photosensitive insulating layer is formed on the lower redistribution wiring layer. a first light is radiated onto the photosensitive insulating layer through a first mask to form a first hardened portion on the central region. a second light is radiated onto the photosensitive insulating layer through a second mask to form a second hardened portion on the peripheral region, the second hardened portion surrounding through opening regions. non-hardened portions in the through opening regions and at least a portion of the first hardened portion are removed. conductive structures are formed in the through opening regions. the second hardened portion and the remainder of the first hardened portion are removed using a strip solution.
Inventor(s): Joonyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Dongho KIM of Seoul (KR) for samsung electronics co., ltd., Hyunjoon KIM of Seoul (KR) for samsung electronics co., ltd., Seogwoo HONG of Yongin-si (KR) for samsung electronics co., ltd., Kyungwook HWANG of Seoul (KR) for samsung electronics co., ltd., Junsik HWANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/67, H01L21/673, H01L33/00
CPC Code(s): H01L21/67144
Abstract: provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (leds) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.
Inventor(s): Sunjae Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, H01L23/00, H01L23/31, H01L23/48, H01L25/18, H10B80/00
CPC Code(s): H01L22/32
Abstract: a semiconductor package includes a first semiconductor chip having a chip mounting region on a central portion thereof and a test region surrounding the chip mounting region; a plurality of first measurement structures on the test region and sequentially arranged to be spaced apart from an edge of the chip mounting region; a second semiconductor chip mounted on the chip mounting region of the first semiconductor chip via a plurality of conductive bumps; an adhesive layer filling a gap between the first semiconductor chip and the second semiconductor chip, and including a central portion in the chip mounting region and at least one overflow portion protruding from the central portion to the test region to contact at least one of the plurality of first measurement structures; and a molding member on the upper surface of the first semiconductor chip to cover side surfaces of the second semiconductor chip.
Inventor(s): Jinyong Choi of Suwon-si (KR) for samsung electronics co., ltd., Sooyeol Yang of Suwon-si (KR) for samsung electronics co., ltd., Jaeeun Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyuckjoon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Jinwon Choi of Suwon-si (KR) for samsung electronics co., ltd., Takuya Futatsuyama of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/66, G01R31/28
CPC Code(s): H01L22/32
Abstract: a semiconductor multi-layer structure includes a first semiconductor wafer including a plurality of first pads, a second semiconductor wafer including a plurality of second pads combined with the plurality of first pads, and a test circuit configured to apply a first voltage to a reference combination portion in which a preset first reference pad among the plurality of first pads is combined with a preset second reference pad among the plurality of second pads and apply a second voltage to a comparison combination portion in which at least one first pad among the plurality of first pads is combined with at least one second pad among the plurality of second pads, wherein the test circuit compares a voltage distributed based on a resistance ratio of the reference combination portion to the comparison combination portion with a preset reference voltage to determine whether the at least one first pad is aligned with the at least one second pad.
Inventor(s): Daehyun KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/29, H01L23/00, H01L23/31, H01L23/498, H01L25/065
CPC Code(s): H01L23/295
Abstract: a semiconductor package includes a substrate including an interconnection, a chip stack including a plurality of semiconductor chips stacked on the substrate, bonding wires electrically coupling the plurality of semiconductor chips to the interconnection, a protective layer on the chip stack and including a first insulating resin and first fillers dispersed in the first insulating resin, a mold at least partially covering the chip stack and the protective layer, the mold including a second insulating resin and second fillers dispersed in the second insulating resin, and connection bumps electrically coupled to the interconnection below the substrate. a first average diameter of the first fillers is smaller than a second average diameter of the second fillers. a first concentration of the first fillers in the first insulating resin is lower than a second concentration of the second fillers in the second insulating resin.
20250069971. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yong Hoe CHO of Suwon-si (KR) for samsung electronics co., ltd., Oh Guk KWON of Suwon-si (KR) for samsung electronics co., ltd., Sun Jae KIM of Suwon-si (KR) for samsung electronics co., ltd., Hui Yeong JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/48, H01L25/065
CPC Code(s): H01L23/31
Abstract: a semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, at least one connection bump between the first semiconductor chip and the second semiconductor chip, an underfill in a region below the second semiconductor chip and on a side of the at least one connection bump and a molding layer on the first semiconductor chip and on a side of the second semiconductor chip, wherein an upper surface of the second semiconductor chip is above an upper surface of the molding layer, a height difference between the upper surface of the second semiconductor chip and the upper surface of the molding layer is 0.3 �m to 2.0 �m, and a surface roughness of the upper surface of the second semiconductor chip is 3 nm or less.
20250069972. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Haseob Seong of Suwon-si (KR) for samsung electronics co., ltd., Seungduk Baek of Suwon-si (KR) for samsung electronics co., ltd., Aenee Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/48, H01L25/065
CPC Code(s): H01L23/3107
Abstract: provided is a semiconductor package including a first semiconductor chip including a first semiconductor substrate having an active surface and an inactive surface opposite to each other, a plurality of second semiconductor chips each including a second semiconductor substrate having an active surface and an inactive surface opposite to each other, and a package molding layer including a bottom molding portion on a portion of an upper surface of the first semiconductor chip, which is exposed by the lowermost second semiconductor chip, and a side molding portion on side walls of the plurality of second semiconductor chips, wherein the side molding portion of the package molding layer extends in a vertical direction from an edge of an upper surface of the bottom molding portion of the package molding layer.
20250069979. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Eunseok CHO of Asan-si (KR) for samsung electronics co., ltd., Minjeong GU of Asan-si (KR) for samsung electronics co., ltd., Joonsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehoon CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/367, H01L21/48, H01L21/56, H01L23/00, H01L23/31, H01L23/498, H01L23/552, H01L25/065, H01L25/18
CPC Code(s): H01L23/3675
Abstract: a method of manufacturing a semiconductor package is provided and includes: forming a lower redistribution structure, the lower redistribution structure including lower redistribution patterns having lower connection pads; forming an upper redistribution structure on a boundary surface of the lower redistribution structure, the upper redistribution structure including upper redistribution patterns having upper connection pads electrically connected to the lower connection pads; forming openings exposing at least a portion of each of the lower connection pads; disposing an interposer substrate, including the lower redistribution structure and the upper redistribution structure, on a base substrate, the lower connection pads of the interposer substrate electrically connected to wiring patterns of the base substrate through lower connection bumps disposed on the openings; and disposing at least one of semiconductor chips, including connection pads, on the interposer substrate, the connection pads electrically connected to the upper connection pads through upper connection bumps.
20250070002. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kyungtae Kim of Suwon-si (KR) for samsung electronics co., ltd., Minsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jakyoung Gu of Suwon-si (KR) for samsung electronics co., ltd., Kyoungok Jung of Suwon-si (KR) for samsung electronics co., ltd., Hyunwoong Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/522, H01L23/528, H01L23/532
CPC Code(s): H01L23/49816
Abstract: a semiconductor package, may include: a lower redistribution structure including lower redistribution layers; a semiconductor chip on the lower redistribution structure, and electrically connected to the lower redistribution layers; connection bumps on the lower redistribution structure, and electrically connected to the lower redistribution layers; an encapsulant covering at least a portion of the semiconductor chip; an upper redistribution structure including an upper insulating layer on the semiconductor chip, and upper redistribution layers including a metal structure on the upper insulating layer; an interconnection structure that electrically connects the lower redistribution layers and the upper redistribution layer; and a metal plate on an upper surface of the metal structure, wherein the upper surface may have a first surface, a second surface around the first surface, and a third surface around the second surface, the first surface may be on the same or higher level than that of the second surface.
20250070012. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juhyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunchul Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/13, H01L23/31, H01L23/42, H01L25/10
CPC Code(s): H01L23/49838
Abstract: the present disclosure relates to semiconductor packages and semiconductor package manufacturing methods. an example semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, an interposer on the first semiconductor chip, a support substrate on the first package substrate and spaced apart from a sidewall of the first semiconductor chip, a conductive filler on the support substrate, a connection bump between the support substrate and the interposer and electrically connecting the conductive filler with the interposer, and a first molding layer surrounding the sidewall of the first semiconductor chip and a sidewall of the connection bump.
Inventor(s): Minjeung Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyojoon An of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/525, G11C17/16, G11C17/18, H01L23/528
CPC Code(s): H01L23/5256
Abstract: an integrated circuit includes a first backside wiring layer arranged on a backside of a substrate, and an e-fuse bit cell. the e-fuse bit cell includes an e-fuse, a transistor arranged on a front side of the substrate, and a first backside contact passing through the substrate in a vertical direction and electrically connecting the e-fuse to the transistor. the e-fuse includes a first terminal electrically connected to a bit line, a second terminal electrically connected to the first backside contact, and a link between the first terminal and the second terminal, and the first terminal, the second terminal, and the link are included in the first backside wiring layer.
Inventor(s): Ki-Il KIM of Suwon-si (KR) for samsung electronics co., ltd., Jisoo OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H01L27/092, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L23/5283
Abstract: provided is a semiconductor device and method of manufacturing same. the semiconductor device includes: a transistor on a substrate; a first wiring layer on the transistor, the first wiring layer including a first wiring electrically connected to the transistor; and a second wiring layer on the first wiring layer, the second wiring layer including an interlayer insulating layer and a second wiring provided in the interlayer insulating layer, wherein the second wiring includes a line structure and a first via structure, wherein the first via structure vertically connects the line structure and the first wiring, wherein the first via structure includes: a first outer surface in contact with the interlayer insulating layer; and a second outer surface in contact with the interlayer insulating layer and facing a direction opposite from the first outer surface, wherein the first outer surface and the second outer surface are curved surfaces, and wherein a curvature of the first outer surface and a curvature of the second outer surface are different from each other.
20250070022. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongkyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyejin KIM of Suwon-si (KR) for samsung electronics co., ltd., Yonghyeok SON of Suwon-si (KR) for samsung electronics co., ltd., Jichang SIM of Suwon-si (KR) for samsung electronics co., ltd., Joo-Sung LEE of Suwon-si (KR) for samsung electronics co., ltd., Yujin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/528, H01L23/522, H10B12/00
CPC Code(s): H01L23/5283
Abstract: a semiconductor device may include a substrate including a cell array region, a core region, and a peripheral circuit region, a core circuit wiring on the core region of the substrate, a core signal wiring overlapping the core circuit wiring, and a contact plug between the core circuit wiring and the core signal wiring. the contact plug may connect the core circuit wiring to the core signal wiring. a positional relationship between the core signal wiring and the contact plug may be different depending on distance from the peripheral circuit region.
Inventor(s): Junhyoung KIM of Seoul (KR) for samsung electronics co., ltd., Joongshik SHIN of Yongin-si (KR) for samsung electronics co., ltd., Kwangsoo KIM of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/535, H01L21/768, H01L23/522, H01L23/528, H10B41/27, H10B41/35, H10B41/41, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H01L23/535
Abstract: a three-dimensional semiconductor device may include a substrate having a cell area and an extension area, a word line stack disposed above the substrate, the word line stack including mold layers and word lines alternately stacked, vertical channel structures vertically penetrating the word line stack in the cell area, and a first extension through-via structure vertically penetrating the word line stack in the extension area. the first extension through-via structure may include a first via plug and a first via liner layer surrounding sidewalls of the first via plug. the first via liner layer may include first dents respectively disposed at the same levels horizontally as the word lines of the word line stack.
Inventor(s): Jong-youn KIM of Seoul (KR) for samsung electronics co., ltd., Seok-hyun LEE of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/56, H01L21/683, H01L23/00, H01L23/367, H01L25/065, H01L25/18
CPC Code(s): H01L23/5385
Abstract: provided is a semiconductor package including an interposer. the semiconductor package includes: a package base substrate; a lower redistribution line structure disposed on the package base substrate and including a plurality of lower redistribution line patterns; at least one interposer including a plurality of first connection pillars spaced apart from each other on the lower redistribution line structure and connected respectively to portions of the plurality of lower redistribution line patterns, and a plurality of connection wiring patterns; an upper redistribution line structure including a plurality of upper redistribution line patterns connected respectively to the plurality of first connection pillars and the plurality of connection wiring patterns, on the plurality of first connection pillars and the at least one interposer; and at least two semiconductor chips adhered on the upper redistribution line structure while being spaced apart from each other.
20250070038. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): KYOUNG LIM SUK of Suwon-si (KR) for samsung electronics co., ltd., SEOKHYUN LEE of Hwaseong-si (KR) for samsung electronics co., ltd., JAEGWON JANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/56, H01L21/683, H01L23/00, H01L23/31, H01L25/10
CPC Code(s): H01L23/5389
Abstract: disclosed is a semiconductor package comprising a redistribution substrate that has a first trench that extends through a top surface of the redistribution substrate, a first semiconductor chip on the redistribution substrate, a capacitor chip on a bottom surface of the first semiconductor chip, and an under-fill layer on the bottom surface of the first semiconductor chip. the redistribution substrate includes a plurality of dielectric layers vertically stacked, a plurality of redistribution patterns in each of the dielectric layers, and a plurality of dummy redistribution patterns in the first trench. the dummy redistribution patterns vertically overlap the first semiconductor chip. an uppermost surface of the dummy redistribution pattern is located at a level higher than a level of a bottom surface of the first trench.
Inventor(s): Kwangyong Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/544, H01L23/00, H01L25/065
CPC Code(s): H01L23/544
Abstract: a semiconductor package includes a package substrate and at least two semiconductor chips stacked on the package substrate and electrically connected to the package substrate via a wire, in which a first semiconductor chip located on a lower side among the at least two semiconductor chips is coupled, without an adhesive, to a second semiconductor chip located above the first semiconductor chip.
20250070048. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dawoon JUNG of Suwon-si (KR) for samsung electronics co., ltd., Haseob SEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/28, H01L23/48, H01L25/16, H10B80/00
CPC Code(s): H01L23/562
Abstract: a semiconductor package includes a first semiconductor chip including: a first semiconductor substrate having an first active surface and a first inactive surface opposite to the first active surface, and a plurality of first electrodes penetrating through the first semiconductor substrate; a plurality of second semiconductor chips, each of the plurality of second semiconductor chips comprising: a second semiconductor substrate having a second active surface and a second inactive surface opposite to the second active surface, and a plurality of second electrodes penetrating through the second semiconductor substrate, wherein the plurality of second semiconductor chips are stacked on the first semiconductor chip, the second active surfaces of the plurality of second semiconductor substrates face the first inactive surface of the first semiconductor substrate, and vertical heights of the plurality of second semiconductor chips are identical.
Inventor(s): Seongyo KIM of Suwon-si (KR) for samsung electronics co., ltd., MINSOO KIM of Suwon-si (KR) for samsung electronics co., ltd., SANG-SICK PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L24/32
Abstract: a semiconductor package includes a first semiconductor die, a first under-fill layer on an upper surface of the first semiconductor die, a second under-fill layer on the first under-fill layer, a second semiconductor die provided on the second under-fill layer, and a mold layer on side surfaces of the second semiconductor die, the second under-fill layer, and the upper surface of the first semiconductor die. the first semiconductor die includes a first substrate, a first redistribution pattern on the first substrate, a first redistribution dielectric layer provided on the first redistribution pattern, and a first dam on the first redistribution dielectric layer and along an edge of the first substrate, and the first under-fill layer contacts a side surface of the first dam.
Inventor(s): YongChul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Rhee of Suwon-si (KR) for samsung electronics co., ltd., Sujie Kang of Suwon-si (KR) for samsung electronics co., ltd., Sun-woo Park of Suwon-si (KR) for samsung electronics co., ltd., Nungpyo Hong of Suwon-si (KR) for samsung electronics co., ltd., Kyeongbin Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, B32B43/00, H01L21/78
CPC Code(s): H01L24/80
Abstract: a semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.
20250070082. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sojeong HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/29, H01L23/31
CPC Code(s): H01L25/0652
Abstract: a semiconductor package including a substrate; a first chip structure and a second chip structure on the substrate, the first chip structure adjacent to the second chip structure, the first chip structure including a first step portion on an upper portion of the first chip structure, and the second chip structure including a second step portion on an upper portion of the second chip structure; and a mold sealing the first and second chip structures. the mold includes first fillers distributed in a first region between the first step portion and the second step portion, and second fillers distributed in a second region below the first region. a first content of the first fillers is greater than a second content of the second fillers.
Inventor(s): Joo-Young Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31
CPC Code(s): H01L25/0657
Abstract: a semiconductor package comprises a package substrate and a first chip stack. the first chip stack includes: a first semiconductor chip on the package substrate, a plurality of second semiconductor chips that are on the first semiconductor chip and have an offset stack structure, and a plurality of first adhesive layers that are respectively on a bottom surface of the first semiconductor chip and bottom surfaces of the second semiconductor chips. the first semiconductor chip includes: a first semiconductor substrate, a plurality of first integrated elements on a top surface of the first semiconductor substrate, and a first wiring layer on the top surface of the first semiconductor substrate. a width of the first semiconductor chip and a width of a lowermost one of the second semiconductor chips are the same. the first semiconductor chip is electrically insulated from the package substrate and the second semiconductor chips.
20250070088. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): JINHEE HONG of Suwon-si (KR) for samsung electronics co., ltd., BU-WON KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes: a substrate including a plurality of connection pads; a first semiconductor chip on the substrate and including a plurality of first data pads on an upper surface thereof; a second semiconductor chip on the first semiconductor chip and including a plurality of second data pads on an upper surface thereof; a third semiconductor chip on the second semiconductor chip and including a plurality of third data pads on an upper surface thereof; and a plurality of connection members for connecting some of the plurality of connection pads and some of the plurality of first data pads, connecting the plurality of connection pads and the plurality of second data pads, and connecting some of the plurality of second data pads and some of the plurality of third data pads.
20250070098. DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jeonghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Wookjin LEE of Suwon-si (KR) for samsung electronics co., ltd., Minchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Bongju LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/075
CPC Code(s): H01L25/0753
Abstract: a display apparatus includes a display module provided with a magnetic material; a frame configured to support the display module; and a connection device. the connection device includes: a fixing part fixed to the frame; an adjustment part movably coupled to the fixing part so as to be movable with respect to the fixing part; and an adjustment magnet movably coupled to the adjustment part so as to movable with respect to the adjustment part, and configured to generate an attractive force between the magnetic material and the adjustment magnet to mount the display module too the frame so that the display module is supported by the frame with a gap between the display module and the frame. the gap is adjustable by movement of the adjustment part with respect to the fixing part.
Inventor(s): Naoki SUZUKI of Yokohama-city (JP) for samsung electronics co., ltd., Nobuyoshi YASHIRO of Yokohama-city (JP) for samsung electronics co., ltd., Takanobu YAMADA of Yokohama-city (JP) for samsung electronics co., ltd., Yuichi AIHARA of Yokohama-city (JP) for samsung electronics co., ltd.
IPC Code(s): H01M10/0585, H01M4/02, H01M4/133, H01M4/36, H01M4/38, H01M4/587, H01M4/66, H01M10/0525, H01M10/0562, H01M10/42, H01M10/44
CPC Code(s): H01M10/0585
Abstract: a method of charging an all-solid-state secondary battery, wherein when charging is performed an initial charge capacity of the anode active material layer is exceeded, and a metal layer can be deposited anywhere between the anode current collector and the solid electrolyte, and an initial charge capacity of the cathode active material layer is greater than an initial charge capacity of the anode active material layer. the all-solid-state secondary battery including: a cathode including a cathode active material layer; an anode including an anode current collector, and an anode active material layer on the anode current collector, wherein the anode active material layer includes a plurality of particles comprising amorphous carbon.
Inventor(s): Hojung NAM of Suwon-si (KR) for samsung electronics co., ltd., Sungkoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kyungmoon SEOL of Suwon-si (KR) for samsung electronics co., ltd., Cheolhong SON of Suwon-si (KR) for samsung electronics co., ltd., Kookjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Donguk CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaewon CHOE of Suwon-si (KR) for samsung electronics co., ltd., Soonho HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01Q1/24, H01Q1/38, H04M1/02
CPC Code(s): H01Q1/243
Abstract: an electronic device according to an embodiments includes a foldable housing including a first housing part, a second housing part and a third housing part, a wireless communication circuit, a first conductive portion formed along at least a portion of a first side exterior surface of the first housing part and including a feeding point and a ground point, and a filter circuit electrically connected to a portion of a second conductive portion in a second side exterior surface of the second housing part. the portion corresponds to a region between the feeding point of the first conductive portion and the ground point of the first conductive portion, in a folded state in which the first housing part and the second housing part are folded.
Inventor(s): Jaesung LEE of Suwon-si (KR) for samsung electronics co., ltd., Donghyeon KIM of Suwon-si (KR) for samsung electronics co., ltd., Sanghyeok KIM of Suwon-si (KR) for samsung electronics co., ltd., Taehyun WOO of Suwon-si (KR) for samsung electronics co., ltd., Seungho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J7/00
CPC Code(s): H02J7/00032
Abstract: an electronic device and a charging device connected to the electronic device are provided. the electronic device includes a plurality of units, wherein each of the plurality of units includes a battery, a processor, a communication module configured to establish a connection for communication with a user terminal, and a memory electrically connected to the processor and configured to store instructions executable by the processor, wherein, when the instructions are executed, the processor is configured to share state information of the battery with another unit, determine a unit to perform a preset operation mode among the plurality of units based on the state information of the battery, and control the determined unit to perform the operation mode.
Inventor(s): Ikhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Junsuk BANG of Suwon-si (KR) for samsung electronics co., ltd., Jeongil SEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F1/02, H03F3/24, H04B1/04
CPC Code(s): H03F1/0233
Abstract: a power modulator configured to provide a supply voltage of a power amplifier. the power modulator includes a converter configured to output the supply voltage to the power amplifier, a switch connected to a first capacitor and a second capacitor, a first end of the first capacitor being connected to the converter, a second end of the first capacitor being connected to the switch, a first end of the second capacitor being connected to the converter, a second end of the second capacity being connected to a ground and the switch, and a capacitance of the second capacitor being less than a capacitance of the first capacitor, and a driver connected to the switch, the driver being configured to turn off the switch based on an occurrence of a transition of the supply voltage.
Inventor(s): Wooseok LEE of Suwon-si (KR) for samsung electronics co., ltd., Minchul KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangmin YOO of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeol BAE of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03F3/24, H03F3/45, H04B1/04
CPC Code(s): H03F3/245
Abstract: disclosed is a transmitter. the transmitter includes a plurality of power amplifiers, each of the plurality of power amplifiers being configured to receive an rf input signal, a parallel power combiner configured to combine outputs of the plurality of power amplifiers to generate an rf output signal, a supply voltage switch configured to provide one supply voltage to the plurality of power amplifiers, the one supply voltage being selected from among a plurality of supply voltages of different voltage levels, and a controller configured to control an output power of the rf output signal by selecting the one supply voltage from among the plurality of supply voltages, and controlling whether to activate each of the plurality of power amplifiers.
Inventor(s): Bosung SUH of Suwon-si (KR) for samsung electronics co., ltd., Byoungjoong KANG of Suwon-si (KR) for samsung electronics co., ltd., Heeyong YOO of Suwon-si (KR) for samsung electronics co., ltd., Beomyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Jeongyeol BAE of Suwon-si (KR) for samsung electronics co., ltd., Sangmin YOO of Suwon-si (KR) for samsung electronics co., ltd., Jongsoo LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03H11/24, H03F1/12, H03G3/00, H03H17/00, H04B1/04
CPC Code(s): H03H11/24
Abstract: an electronic device includes an amplifier circuit configured to amplify a radio frequency (rf) signal received from an antenna, the rf signal having a receiving power, an attenuator circuit connected between the amplifier circuit and a mixer, the attenuator circuit including at least one resistor and at least one transistor, and a processor configured to turn on a first transistor among the at least one transistor based on the receiving power being less than a threshold value, a signal output from the amplifier circuit being directly transferred to the mixer based on the first transistor being turned on, and control one or more transistors among the at least one transistor using a look-up table based on the receiving power being greater than or equal to the threshold value, the attenuator circuit having a resistance value corresponding to the receiving power based on the control of the one or more transistors.
Inventor(s): Jaeha Lee of Suwon-si (KR) for samsung electronics co., ltd., Bai-Sun Kong of Suwon-si (KR) for samsung electronics co., ltd., Bomin Joo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/037
CPC Code(s): H03K3/0372
Abstract: a flip-flop configured to generate an output toggling according to an input clock includes an inverter configured to generate the output by inverting a first data signal, a first circuit configured to generate a second data signal based on an input clock and a latch signal, a second circuit configured to generate the latch signal based on the input clock and the second data signal, and a third circuit configured to generate the first data signal using the input clock, the second data signal, and the latch signal, wherein the third circuit is further configured to pull down the first data signal, independently of the second data signal, using the input clock and the latch signal.
Inventor(s): Jaeha Lee of Suwon-si (KR) for samsung electronics co., ltd., Bai-sun Kong of Suwon-si (KR) for samsung electronics co., ltd., Bomin Joo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/356, G11C7/06
CPC Code(s): H03K3/356113
Abstract: a sense amplifier flip-flop includes a first stage configured to generate, in response to a rising edge of a clock signal, a first latch signal and a second latch signal by pulling down a first pull-down node or a second pull-down node according to a data input and an inverted data input, wherein the first stage includes a bridge circuit configured to electrically connect the first pull-down node and the second pull-down node to each other in response to an activated bridge signal, and a control circuit configured to activate the bridge signal when the data input transitions while the clock signal is logic high.
Inventor(s): Jaeha Lee of Suwon-si (KR) for samsung electronics co., ltd., Bai-Sun Kong of Suwon-si (KR) for samsung electronics co., ltd., Bomin Joo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K3/3562, H03K3/012
CPC Code(s): H03K3/35625
Abstract: a flip-flop is provided. the flip-flop includes: a master latch; and a slave latch. the master latch includes: a first circuit configured to, based on a clock signal, a data input signal, and a first data signal, generate a second data signal complementary to the data input signal; a second circuit configured to, based on the clock signal, an inverted data input signal, and the second data signal, generate the first data signal complementary to the inverted data input signal; and a third circuit configured to generate a latch signal based on the clock signal, an input of the slave latch, and the second data signal. the slave latch is configured to latch the input of the slave latch based on the clock signal and the latch signal.
Inventor(s): Minseob Lee of Suwon-si (KR) for samsung electronics co., ltd., Sangmin Yoo of Suwon-si (KR) for samsung electronics co., ltd., Joonhee Lee of Suwon-si (KR) for samsung electronics co., ltd., Ikkyun Jo of Suwon-si (KR) for samsung electronics co., ltd., Honggul Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03L7/197, H03L7/097, H03L7/099
CPC Code(s): H03L7/1976
Abstract: a phase-locked loop (pll) circuit includes a voltage-controlled oscillator configured to generate an output clock signal of the pll circuit, a phase detector configured to generate a phase error signal representing a phase difference between a first clock signal based on a reference clock signal and a second clock signal based on the output clock signal, a comparator configured to generate a phase error sign signal based on a reference voltage and the phase error signal, and a reference voltage generation circuit configured to scale first and second sign values of the phase error sign signal based on a fixed gain value and a variable gain value, respectively, and generate the reference voltage based on the scaled first and second sign values.
20250070794. DIGITAL-TO-ANALOG CONVERSION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Byungwoo Koo of Suwon-si (KR) for samsung electronics co., ltd., Sunghan Do of Suwon-si (KR) for samsung electronics co., ltd., Sangpil Nam of Suwon-si (KR) for samsung electronics co., ltd., Youngjae Cho of Suwon-si (KR) for samsung electronics co., ltd., Michael Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/68
CPC Code(s): H03M1/687
Abstract: a digital-to-analog converter (dac) for generating an analog output from a digital input includes a controller configured to generate a control signal based on the digital input, and a segment cell circuit including a plurality of segment cells turned on or off based on the control signal and configured to generate the analog output based on outputs of the plurality of segment cells, wherein the plurality of segment cells include a plurality of first segment cells each configured to generate an output corresponding to each of bits included in a first bit group of the digital input, a plurality of second segment cells each configured to generate an output corresponding to each of bits included in a second bit group of the digital input, and an additional segment cell configured to generate an output corresponding to a lowermost bit among the bits included in the second bit group.
Inventor(s): Janghoon HAN of Suwon-si (KR) for samsung electronics co., ltd., Gilyong KU of Suwon-si (KR) for samsung electronics co., ltd., Hyunjun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seongyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Seunghee SON of Suwon-si (KR) for samsung electronics co., ltd., Jiyeong YU of Suwon-si (KR) for samsung electronics co., ltd., Jungeun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H01Q1/24, H05K7/14
CPC Code(s): H04B1/0053
Abstract: an electronic device includes a housing including at least one conductive portion disposed along at least a portion of a side surface of the housing, the at least one conductive portion configured to receive or to transmit a signal, a first module inside the housing and adjacent to the at least one conductive portion, and a first printed circuit board inside the housing and comprising a communication line electrically connected to the first module, wherein the communication line extends along an edge of the first printed circuit board to have a resonance frequency different from a frequency of the signal received or transmitted by the at least one conductive portion.
Inventor(s): Hana CHOE of Suwon-si (KR) for samsung electronics co., ltd., Taejun LIM of Suwon-si (KR) for samsung electronics co., ltd., Bumjin PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung YOU of Suwon-si (KR) for samsung electronics co., ltd., Woosup LEE of Suwon-si (KR) for samsung electronics co., ltd., Sehwan CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/3888, H04B5/26, H04B5/48
CPC Code(s): H04B1/3888
Abstract: an electronic device is provided. the electronic device includes a display, a coil, a magnet assembly including a plurality of first magnets disposed to surround the coil and a plurality of second magnets disposed to be spaced a designated distance apart from the plurality of first magnets so as to surround the plurality of first magnets, a first shielding sheet extending along the magnet assembly toward the display so as to be attached to the magnet assembly, a second shielding sheet disposed between the coil and the display toward the display from the first shielding sheet, and a third shielding sheet disposed between the display and the second shielding sheet.
Inventor(s): Younghyun JEON of Suwon-si (KR) for samsung electronics co., ltd., Seokju JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B7/0456, H04W72/044
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to various embodiments of the present disclosure, a method performed by a base station in a wireless communication system may comprise: acquiring, on the basis of a csi report in a first time period, channel information including current channel state information (csi) from a terminal; identifying, on the basis of the channel information, a spatial domain (sd) component, a frequency domain (fd) component, and a linear combination (lc) coefficient value mapped to the sd component and the fd component used for compression; acquiring a filtered lc coefficient value on the basis of a kalman filter, and generating predicted channel information in a second time period on the basis of the sd component, the fd component, and the filtered lc coefficient value.
Inventor(s): Ozlem Yildiz of Brooklyn NY (US) for samsung electronics co., ltd., Ahmad AlAmmouri of Richardson TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/06952
Abstract: the disclosed technology can include three dimensional (3d) beamforming for joint phase-time arrays (jtpas). in some embodiments, a method for operating a bs is provided. the method includes receiving information from a plurality of user equipment (ues) and identifying, based on the received information, azimuth and elevation information associated with the ues. the method further includes determining at least two ues of the plurality of ues to serve based at least in part on the azimuth and elevation information of the at least two ues, respectively, determining bandwidth allocations for the at least two ues, respectively, and determining joint-phase-time array (jpta) beams for the at least two ues, respectively, based on the bandwidth allocations and the azimuth and elevation information of the at least two ues, respectively. the method further includes transmitting information on the jpta beams to the at least two ues, respectively.
Inventor(s): Youngbum KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk RYU of Suwon-si (KR) for samsung electronics co., ltd., Junyung YI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W52/02, H04W76/28
CPC Code(s): H04B7/06968
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the disclosure may provide a method and an apparatus for saving power of a wireless communication system. according to the disclosure, a method performed by a terminal in a communication system is provided. the method includes: receiving, from a base station, configuration information on a network energy saving mode; identifying that the network energy saving mode is applied; identifying an uplink transmission power for transmitting an uplink signal on an uplink channel in the network energy saving mode or a quasi co-location (qcl) relation of at least one of downlink signal or a downlink channel based on a reference signal in the network energy saving mode; and transmitting, to the base station, the uplink signal on the uplink channel based on the uplink transmission power or receiving, from the base station, the downlink signal on a downlink channel based on the qcl relation.
20250070854. MULTI-TRAFFIC RELAY TRANSMISSION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yue Qi of Plano TX (US) for samsung electronics co., ltd., Rubayet Shafin of Frisco TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Abhishek Sehgal of Frisco TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei City (TW) for samsung electronics co., ltd.
IPC Code(s): H04B7/155, H04W28/02, H04W74/0816
CPC Code(s): H04B7/155
Abstract: method and apparatus for multi-traffic relay transmission. a method of wireless communication performed by a wireless device, the method comprising: receiving, from a source node, an indication of relay capabilities for multi-traffic transmission; receiving a message from the source node indicating that the message is for relay operations; and relaying the message to a destination node.
Inventor(s): Raul Hernan ETKIN of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/185, H04W48/16
CPC Code(s): H04B7/18513
Abstract: a system and a method are disclosed for improving cell searching in a non-terrestrial network (ntn), the method including obtaining almanac information, obtaining position, velocity or time (pvt) information, and generating a list of one or more satellites in view based on the almanac information and the pvt information.
20250070908. IMAGE PROCESSING DEVICE AND METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chanho JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, G06T9/00, H04L1/20
CPC Code(s): H04L1/0002
Abstract: a transmission device in an image processing system, includes: at least one processor configured to: transmit, to a reception device, first forward-error-correction (fec) encoded data including first source data encoded at a first bitrate and first repair data used for error correction of the first source data; receive, from the reception device, information related to a reception error for the first fec encoded data; and determine whether to change a bitrate of second source data into a second bitrate higher than the first bitrate based on the information related to the reception error, and wherein the second source data is included in second fec encoded data transmitted after the first fec encoded data is transmitted.
Inventor(s): Soomin KO of Suwon-si (KR) for samsung electronics co., ltd., Jeongchan KIM of Suwon-si (KR) for samsung electronics co., ltd., Okyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00
CPC Code(s): H04L1/0009
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transmission rate. according to various embodiments, a method performed by a serving base station in a wireless communication system may comprise: receiving information about an aggregated slot from an aggregated slot managing device; aggregating, on the basis of the information about the aggregated slot, traffic to be transmitted during a specific interval into the aggregated slot and scheduling same; determining adaptive modulation and coding (amc) parameters separately for an aggregated slot and a non-aggregated slot; and transmitting the traffic for the aggregated slot using the determined amc parameters.
Inventor(s): KYUNGHWAN MIN of Suwon-si (KR) for samsung electronics co., ltd., JAHOON JIN of Suwon-si (KR) for samsung electronics co., ltd., SANGHO KIM of Suwon-si (KR) for samsung electronics co., ltd., JISU YOOK of Suwon-si (KR) for samsung electronics co., ltd., SOOMIN LEE of Suwon-si (KR) for samsung electronics co., ltd., JIHOON LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00, H04L25/03
CPC Code(s): H04L1/0042
Abstract: disclosed are a transmitter and transceiver for improving switching jitter. the transmitter includes an encoder that encodes an input signal representable by x levels (where x is a natural number of 3 or more) and outputs a plurality of encoded signals representing a multi-bit binary number including a most significant bit and a least significant bit; an edge adjustment circuit that generates a plurality of adjusted encoded signals by adjusting a falling edge timing of a first one of the encoded signals corresponding to the most significant bit and adjusting a rising edge timing of a second one of the encoded signals corresponding to the least significant bit; and a driver circuit that generates and outputs an output signal having the x levels based on the adjusted encoded signals.
Inventor(s): Min JANG of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Seho MYUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/00
CPC Code(s): H04L1/0057
Abstract: embodiments of the disclosure provide a device in a communication system or a broadcasting system that may comprise: a memory, at least one transceiver and at least one processor comprising processing circuitry. at least one processor, individually and/or collectively, may be configured to: receive a signal including bits encoded based on polar codes; identify a polar code configuration for at least one information bit and at least one frozen bit of the signal; and decode the signal based on the configuration of the polar codes.
Inventor(s): Youngwoo KWAK of Gyeonggi-do (KR) for samsung electronics co., ltd., Hoondong NOH of Gyeonggi-do (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/23
CPC Code(s): H04L5/0048
Abstract: methods and apparatuses are provided in a wireless communication system. a terminal receives a feedback configuration including a configuration for a wideband or a subband from a base station. the terminal receives, from the base station, quasi co-location (qcl) information for a physical downlink control channel (pdcch) via medium access control-control element (mac-ce) signaling. the terminal receives, from the base station, the pdcch based on the qcl information for the pdcch. the terminal reports channel state information (csi) for a csi-rs resource configuration based on the pdcch and the feedback configuration.
Inventor(s): Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Kyunggyu LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0446, H04W72/23
CPC Code(s): H04L5/0055
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting higher data transfer rates. the present disclosure provides a method of, when a terminal receives pdsch repetitive transmission and scheduling of multiple pdschs through one dci in a wireless communication system, collecting pieces of harq-ack information of the pdschs to generate a type-1 harq-ack codebook.
Inventor(s): Daechul KWON of Suwon-si (KR) for samsung electronics co., ltd., Dongyoung SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyojin CHO of Suwon-si (KR) for samsung electronics co., ltd., Gyeonghan CHA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L25/02, H04L5/00
CPC Code(s): H04L25/0272
Abstract: a communication interface circuit includes a protocol layer circuit that generates packet data based on input data, and a physical layer circuit that encodes the packet data to output a transmission state, and drives a data lane including a plurality of three-phase wire links based on the transmission state, wherein the physical layer circuit may include an encoder that calculates the transmission state based on a preceding state output from the encoder in a previous unit interval, a symbol mapped to the packet data, and a control code, and wherein the control code instructs an encoding change based on a coupling relationship of the plurality of three-phase wire links. the communication interface circuit stably transmits data.
Inventor(s): Seongyeal Yang of Suwon-si (KR) for samsung electronics co., ltd., Moonchul Choi of Suwon-si (KR) for samsung electronics co., ltd., Sungyong Cho of Suwon-si (KR) for samsung electronics co., ltd., Jaehyeok Baek of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L27/36
CPC Code(s): H04L27/36
Abstract: provided is a transmitting device for enlarging the size of a data eye of a transmission signal. the transmitting device includes an output driver including a plurality of driver circuits that drive a plurality of multi-level signals onto an output node, and a logic circuit configured to detect a direction of a pull-up or pull-down operation of each of the plurality of driver circuits by transitions of the plurality of driver control signals and generate pulse signals. the plurality of multi-level signals are driven based on a plurality of driver control signals and pulse signals, respectively, and the logic circuit provides a pulse signal to at least one static driver circuit connected to a driver control signal that does not transition, from among the plurality of driver circuits.
Inventor(s): Jongwook LEE of Suwon-si (KR) for samsung electronics co., ltd., Young Jun HONG of Suwon-si (KR) for samsung electronics co., ltd., Wonseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L45/02
CPC Code(s): H04L45/02
Abstract: a device includes: a processor configured to execute instructions in a memory, wherein, the instructions are configured to cause the processor to: select a first network group from among network groups, wherein the first network group is selected from among the network groups based on numbers of global links connecting the network groups, respectively; obtain a first list of network groups, among the network groups, that are not connected to the first network group; select a second network group and a third network group from among the network groups in the first list based on connections between the network groups in the first list; and based on the selecting of the first, second, and third network groups, form a topology including global links connecting the first network group, the second network group, and the third network group each to each other.
Inventor(s): Changmin KIM of Suwon-si (KR) for samsung electronics co., ltd., Jonghwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Kihyeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Sohae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jinyong KIM of Suwon-si (KR) for samsung electronics co., ltd., Jihoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Hakhoon SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/03
CPC Code(s): H04M1/03
Abstract: an electronic device according to an embodiment of the disclosure includes: a housing including a front plate, a back plate facing away from the front plate, and a side member surrounding a space between the front plate and the back plate, at least one microphone hole penetrating the side member in a first direction from an outer surface of the side member toward an inner surface of the side member, a microphone module comprising a microphone and configured to receive an acoustic signal through the microphone hole, a support disposed between the microphone module and the front plate in the housing and including a plurality of inner surfaces, an acoustic passage surrounded by the plurality of inner surfaces of the support and facing toward the microphone module from the microphone hole, and a branch passage formed in the support and diverging from the acoustic passage. the acoustic passage includes a first section extending from the microphone hole in the first direction and a second section fluidically connected with the first section and bent in a second direction toward the microphone module to face the microphone module. the branch passage is formed in a direction different from the second direction from at least one of the plurality of inner surfaces of the support member.
Inventor(s): Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Yongjoon JEON of Suwon-si (KR) for samsung electronics co., ltd., Sungkweon PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N7/15, G06F3/01, G06T19/20
CPC Code(s): H04N7/157
Abstract: a wearable device performing a call using a virtual object and a method for controlling the same are disclosed. a wearable device according to an embodiment of the disclosure may comprise: a display, memory, and a processor comprising processing circuitry. the memory may store instructions that may be executed by the processor, and at least one processor, individually and/or collectively, is configured to cause the wearable device to: obtain a first input for sending a call, based on the first input, control the display to display a first virtual object corresponding to a counterpart of the call to a user wearing the wearable device, obtain a second input for moving the first virtual object to a designated position in a real world or virtual reality, and perform the call with the counterpart based on the second input.
Inventor(s): Jaehong Jeon of Suwon-si (KR) for samsung electronics co., ltd., Giseok Sung of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon Eum of Suwon-si (KR) for samsung electronics co., ltd., Gohwoon Jeong of Suwon-si (KR) for samsung electronics co., ltd., Dosung Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N9/31
CPC Code(s): H04N9/3173
Abstract: an electronic apparatus including: a main body; a projecting part configured to retract in the main body and protrude from the main body to project an image; a memory storing at least one instruction; and at least one processor configured to execute the at least one instruction, where, by executing the at least one instruction, the at least one processor is configured to: obtain information about a projection plane, identify a protrusion distance of the projecting part corresponding to the projection plane based on the information about the projection plane, protrude the projecting part based on the protrusion distance, and control the projecting part to project the image on the projection plane.
20250071296. IMAGE PROCESSING DEVICE AND METHOD_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Chanho JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/176, H04N19/159, H04N19/177
CPC Code(s): H04N19/176
Abstract: the disclosure relates to a reception device of an image processing system. the reception device is configured to receive, from a transmission device, at least one data packet including data of a first frame, perform decoding on the first frame based on the at least one data packet, identify whether a failure in decoding on the first frame occurs, and based on identifying that the failure in decoding on the first frame occurs, transmit, to the transmission device, first information related to at least one first block where the decoding failure occurs. the first information may include block id information about the at least one first block where the decoding failure occurs and frame id information about the first frame to which the at least one first block belongs.
Inventor(s): Gongjin SUN of San Jose CA (US) for samsung electronics co., ltd., Ramdas KACHARE of Pleasanton CA (US) for samsung electronics co., ltd., Mohammadreza SOLTANIYEH of Sunnyvale CA (US) for samsung electronics co., ltd., Caroline KAHN of San Jose CA (US) for samsung electronics co., ltd., Xuebin YAO of Mountain View CA (US) for samsung electronics co., ltd.
IPC Code(s): H04N19/423, H04N19/17, H04N19/186, H04N19/436, H04N19/625, H04N19/80, H04N19/86, H04N19/91
CPC Code(s): H04N19/423
Abstract: a system and method for in-storage video processing. in some embodiments, the system includes a computational storage device, the computational storage device including non-volatile storage and a processing circuit. the processing circuit may be configured to process a first data unit and to process a second data unit, in parallel with the first data unit.
Inventor(s): Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Minsoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yinji PIAO of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/70, H04N19/124, H04N19/159, H04N19/52, H04N19/593, H04N19/60
CPC Code(s): H04N19/70
Abstract: an image decoding method includes: obtaining, from a bitstream, first coding tool enable flag information of a first coding tool, indicating whether or not the first coding tool is applicable to an image sequence; obtaining, from the bitstream, second coding tool enable flag information of at least one second coding tool related to the first coding tool, based on the obtained first coding tool enable flag information; identifying at least one coding tool of the first coding tool and the second coding tool that is applicable to the image sequence included in the bitstream, based on at least one of the first coding tool enable flag information and the second coding tool enable flag information; and performing decoding on the image sequence based on the identified at least one coding tool.
Inventor(s): Jongwoon JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Deukkyu OH of Gyeonggi-do (KR) for samsung electronics co., ltd., Kwangtaek WOO of Gyeonggi-do (KR) for samsung electronics co., ltd., Gisoo Lee of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/63, H04N5/262, H04N23/51, H04N23/62
CPC Code(s): H04N23/632
Abstract: a foldable electronic device may include: a foldable housing foldable along at least one axis; a first display disposed on a first surface of the foldable housing; a second display disposed on a second surface of the foldable housing; a first camera; a second camera; at least one sensor; a memory; and a processor. the processor may be configured to: provide a first preview to the first display by using the first camera in a folded state; receive a region configuration input for the first preview through the first display; after the reception of the region configuration input, sense unfolding of the foldable electronic device by using the at least one sensor; and provide a second preview corresponding to the region configuration input through the second display by using the second camera in an unfolded state. in addition, various other embodiments can be understood through the specification.
Inventor(s): Rahul VARNA of Bangalore (IN) for samsung electronics co., ltd., Akshit AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Ankur Mani TRIPATHI of Bangalore (IN) for samsung electronics co., ltd., Anunay SRIVASTAVA of Bangalore (IN) for samsung electronics co., ltd., Shivam ARORA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/60, H04N23/45, H04N23/667, H04N23/71, H04N23/73, H04N23/81, H04N23/84
CPC Code(s): H04N23/64
Abstract: provided is a system and method for enhancing media. the method includes: identifying whether a scene of a first preview frame captured by at least one primary camera was captured in low light based on at least one pre-defined parameter of the first preview frame; based on identifying that the first preview frame was captured in low light, triggering at least one secondary camera to capture a second preview frame of the scene, wherein the second preview frame has an exposure time higher than an exposure time of the first preview frame, and wherein the second preview frame includes one of a higher field of view (fov) and a same fov as compared to the first preview frame; and generating an output frame based on the first preview frame, the second preview frame, and at least one of the at least one pre-defined parameter.
Inventor(s): Shivam Arora of Karnataka (IN) for samsung electronics co., ltd., Ankit Shukla of Karnataka (IN) for samsung electronics co., ltd., Ashish Kumar Singh of Karnataka (IN) for samsung electronics co., ltd., Abhijit Dey of Karnataka (IN) for samsung electronics co., ltd., Kiran Nataraju of Karnataka (IN) for samsung electronics co., ltd., Rajib Basu of Karnataka (IN) for samsung electronics co., ltd., Amit Kumar Soni of Karnataka (IN) for samsung electronics co., ltd., Rohan Claude D'Souza of Karnataka (IN) for samsung electronics co., ltd., Amit Chowdhury of Karnataka (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/67, G02B7/10, G02B7/36, G06T5/20, G06T5/73, H04N23/611, H04N23/667
CPC Code(s): H04N23/675
Abstract: the embodiments herein disclose methods and systems for switching between a macro and a non-macro sensing mode for capturing macro and non-macro media in real-time. a method for controlling an electronic device may include acquiring at least one frame; identifying an operation mode of the electronic device among a macro sensing mode and non-macro sensing mode based on at least one of focus data and blur data of the at least one frame; and acquiring at least one image by using an image sensor, from among a plurality of image sensors of the electronic device, corresponding to the operation mode.
Inventor(s): Yongsik Cho of Suwon-si (KR) for samsung electronics co., ltd., Kwanhyung Kim of Suwon-si (KR) for samsung electronics co., ltd., Minook Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinmyoung Mok of Suwon-si (KR) for samsung electronics co., ltd., Dongjoon Won of Suwon-si (KR) for samsung electronics co., ltd., Seunghak Lee of Suwon-si (KR) for samsung electronics co., ltd., Younggyu Jung of Suwon-si (KR) for samsung electronics co., ltd., Kyungsung Chu of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/68, G02B13/00, G02B13/02, G02B15/14
CPC Code(s): H04N23/687
Abstract: a camera module and an electronic device include the camera module having a first lens group including at least one lens, a reflection member configured such that light incident from the first lens group in a first direction is reflected by the reflection member in a second direction crossing the first direction, a second lens group arranged in the second direction and including at least three lenses, and an image sensor configured to receive an optical signal passing through the second lens group and generate an electrical signal related to an image based on the optical signal, wherein the camera module satisfies 1.2<|f1/f|<3, where f1 refers to a focal length of the first lens group, and f refers to a total focal length of an optical system including the first lens group and the second lens group.
Inventor(s): Jaekyu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N23/73, H01L27/146, H04N25/531, H04N25/532
CPC Code(s): H04N23/73
Abstract: an image sensor pixel includes: first and second sub-pixels, which are electrically coupled to first and second floating diffusion nodes of the pixel, respectively; a first rolling shutter operation circuit configured to read out photocharges that are collected in the first floating diffusion node during a rolling shutter mode of operation; a second rolling shutter operation circuit configured to read out photocharges that are collected in the second floating diffusion node during the rolling shutter mode of operation; a global select switch circuit electrically coupled to the first and second rolling shutter operation circuits; and a global shutter operation circuit electrically coupled to the global select switch circuit. the global shutter operation circuit is configured to read out photocharges that are: (i) collected in the first and second floating diffusion nodes, and (ii) pass through the global select switch circuit during a global shutter mode of operation.
Inventor(s): Dong-Jin Park of Suwon-si (KR) for samsung electronics co., ltd., Jeehong Lee of Suwon-si (KR) for samsung electronics co., ltd., Sunghyuk Yim of Suwon-si (KR) for samsung electronics co., ltd., Wooseok Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N25/77
CPC Code(s): H04N25/77
Abstract: a pixel array is provided. the pixel array includes: a plurality of pixels in a matrix, the plurality of pixels including a first pixel, a second pixel and a third pixel adjacent the second pixel; a plurality of micro lenses, the plurality of micro lenses including a first micro lens and a second micro lens. each of the plurality of pixels includes a plurality of photoelectric conversion elements adjacent to each other in a first direction. the first micro lens extends across the plurality of photoelectric conversion elements of the first pixel, and the second micro lens extends in the first direction or a second direction across the second pixel and the third pixel.
Inventor(s): Wonjae JUNG of Suwon-si (KR) for samsung electronics co., ltd., Seunghwan LEE of Suwon-si (KR) for samsung electronics co., ltd., Jiyoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Jongdoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hanyeop LEE of Suwon-si (KR) for samsung electronics co., ltd., Gun LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R1/34, H04R1/02
CPC Code(s): H04R1/345
Abstract: an electronic device is provided. the electronic device includes a display, a housing including an opening for sound output, a camera module including an image sensor, at least one lens, and a barrel for fixing the at least one lens, a sound conduit element surrounding at least a portion of the barrel and including a sound inlet and a sound outlet, a sound element outputting sound through the sound conduit element and the opening, and a bracket on which the camera module and the sound element are mounted, wherein the bracket may include a first conduit that spatially connects a sound output surface of the sound element and the sound inlet, wherein the sound conduit element may include a second conduit that spatially connects the sound inlet and the sound outlet, and wherein the bracket may include a third conduit that spatially connects the sound outlet and the opening of the housing.
20250071482. ROTATABLE DISPLAY APPARATUS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Donghyun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jongbae KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungha SON of Suwon-si (KR) for samsung electronics co., ltd., Youngsang LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04R5/04, H04R1/02, H04R3/12, H04R5/02, H04S1/00, H05K5/02
CPC Code(s): H04R5/04
Abstract: a rotatable display apparatus includes a display panel including a rectangular shape, a plurality of speakers provided at an edge of the display panel, a rotating device provided on a rear surface of the display panel and configured to rotate the display panel, a panel rotation detector configured to detect a rotation state of the display panel, an audio signal processor configured to transmit a left audio signal, a right audio signal, and a mixed audio signal to the plurality of speakers based on the rotation state of the display panel, and a mixer provided in the audio signal processor and configured to generate the mixed audio signal by mixing the left audio signal and the right audio signal at a predetermined ratio.
20250071508. INTELLIGENT PROXIMITY SYSTEM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Daoud Burghal of San Jose CA (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Han Wang of Allen TX (US) for samsung electronics co., ltd., Samuel Albert of Robbinsville NJ (US) for samsung electronics co., ltd., Xiaochuan Ma of Hillsborough NJ (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Russell Ford of San Jose CA (US) for samsung electronics co., ltd., Yong Ren of Somerset NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04W4/021
CPC Code(s): H04W4/021
Abstract: an electronic device includes a transceiver configured to receive information related to an action request or rule. the electronic device further includes a processor operatively coupled to the transceiver. the processor is configured to determine that the action is location based, and identify a zone within which the electronic device is located. the identification of the zone is based on at least one of a first reception by the transceiver of at least one signal indicative of a location of the electronic device, and a second reception by the transceiver of at least one response to a transmission of a signal indicative of a location of the electronic device. the processor is further configured to trigger an action based on the action request or rule and the identified zone.
Inventor(s): Daesung CHO of Suwon-si (KR) for samsung electronics co., ltd., Taehwan SON of Suwon-si (KR) for samsung electronics co., ltd., Sunghee JUNG of Suwon-si (KR) for samsung electronics co., ltd., Suntae JOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/00, G06F3/01
CPC Code(s): H04W8/005
Abstract: an electronic device may include: memory configured to store a program including instructions, first communication circuitry configured to support a first communication scheme, second communication circuitry configured to support a second communication scheme, a display, and at least one controller comprising at least one processor, comprising processing circuitry. the instructions may, when executed by at least one processor, individually and/or collectively, cause the electronic device to: perform a scan for discovering an external device through the first communication circuitry; identify a plurality of external devices including a first wearable device, based on receiving of signals from the plurality of external devices, based on the scan; based on identifying the plurality of external devices, receive, from the first wearable device through the second communication circuitry, a first signal including identification information corresponding to the first wearable device; and display, through the display, a first screen indicating the first wearable device, based on the identification information included in the first signal corresponding to stored identification information.
Inventor(s): Bokkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Seung CHOO of Suwon-si (KR) for samsung electronics co., ltd., Joong Gunn PARK of Seoul (KR) for samsung electronics co., ltd., Hyun Jun CHOI of Seoul (KR) for samsung electronics co., ltd., Dong Jin LEE of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W8/08, H04W64/00
CPC Code(s): H04W8/08
Abstract: a server according to an embodiment can collect mobility data of user terminals and group the user terminals into clusters based on the similarity the similarity of the mobility data. the server applies identification information of the clusters to which the grouped user terminals belong and previous movement paths of the grouped user terminals to a neural network-based prediction model, thus making it possible to train a prediction model to predict a base station serving moving locations of the user terminals belonging to each cluster.
Inventor(s): Hongjin CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Jungje SON of Gyeonggi-do (KR) for samsung electronics co., ltd., Duckey LEE of Gyeonggi-do (KR) for samsung electronics co., ltd., Taehyung LIM of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W12/069, H04W12/041, H04W60/00
CPC Code(s): H04W12/069
Abstract: the present disclosure provides a method and a device by which a terminal is safely provisioned, from a ps, with credentials of an so-snpn to receive service when a non-public network is used in a wireless communication system. the method performed by a terminal in a wireless communication system may comprise the operations of: acquiring configuration information including a certificate of the terminal and a ca certificate associated with a certificate of a provisioning server; confirming that provisioning using a control plane is performed; generating a temporary key pair on the basis of the confirmation; and acquiring credentials of an so-snpn on the control plane on the basis of the configuration information and the temporary key pair.
Inventor(s): Aditya Dave of Plano TX (US) for samsung electronics co., ltd., Indranil Sinharoy of Richardson TX (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Daoud Burghal of San Jose CA (US) for samsung electronics co., ltd., Athul Prasad of Mountain View CA (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W16/18, H01Q15/00, H04W24/08
CPC Code(s): H04W16/18
Abstract: a method includes identifying a zone blocked from line of sight (los) of a gnb; receiving a 3d spatial map of a first area including the zone and a second area that surrounds the zone and that is within both a coverage area and the los of the gnb; determining whether the second area includes a mountable surface to which a passive rf reflective metasurface is attachable; and determining whether the metasurface, if attached to the mountable surface, generates a reflection path to the zone, based on a determination that the second area includes the mountable surface and based on estimated propagation paths from the gnb to the zone. the method includes determining whether to add a metasurface to the second area based on: a determination result whether the reflection path from the metasurface attached to the mountable surface to the zone includes reflected signals satisfying a threshold bandwidth condition.
Inventor(s): Mahmoud WATFA of Staines, Middlesex (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Mehrdad SHARIAT of Staines, Middlesex (GB) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W24/10
CPC Code(s): H04W28/0289
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of operating proximity services, prose, in a wireless communication system, wherein an entity in the wireless communication system is in communication with a user equipment, ue, wherein if the entity receives a remote ue report message for which a protocol data unit, pdu, session id in the remote ue report message belongs to any pdu session in state pdu session inactive in the entity, the entity includes a 5gsm cause information element, ie, in a remote ue report response message and sets the 5gsm cause ie to a predetermined value in the remote ue report response message.
Inventor(s): Shouvik Ganguly of Frisco TX (US) for samsung electronics co., ltd., Aniruddh Venkatakrishnan of Austin TX (US) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd., Mustafa Furkan Ozkoc of The Colony TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04L5/00, H04W28/18
CPC Code(s): H04W28/06
Abstract: methods and apparatuses for a bit compression of uplink fronthaul data in wireless communication systems are provided. the methods of ue comprise: identifying uplink fronthaul data to reduce a data load on an uplink fronthaul link, wherein the uplink fronthaul link is between the ru and a du; processing the uplink fronthaul data to obtain a set of representative values for a compression operation; selecting, based on the set of representative values, at least one encoding parameter for the compression operation; and transmitting, to the du, the uplink fronthaul data that is compressed based on the compression operation.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W72/21
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a user equipment (ue) in a wireless communication system is provided. the method comprises receiving, from a base station, a protocol data unit (pdu) session modification command message for a modification of a pdu session, in case that the pdu session modification command message includes an alternative single-network slice selection assistance information (s-nssai), setting an s-nssai for a pdu session establishment procedure to an s-nssai of the pdu session and transmitting, to the base station, a message for requesting a pdu session establishment for the pdu session establishment procedure, wherein the message includes the s-nssai of the pdu session.
Inventor(s): Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd., Kailash Kumar JHA of Bangalore (IN) for samsung electronics co., ltd., Aman AGARWAL of Bangalore (IN) for samsung electronics co., ltd., Mahmoud WATFA of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W4/90, H04W8/04, H04W84/04
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments herein disclose a device and methods for managing and selecting public land mobile networks (plmns) for disaster roaming during minimization of service interruption (mint) situations. a ue is configured for selecting one of the “list of plmn(s) to be used in disaster condition” configured by a hplmn/eplmn, and “list of plmn(s) to be used in disaster condition” configured by a vplmn, in a disaster situation based on a ue configuration. the method discloses selection of at least one forbidden plmn (fplmn) by the ce in a disaster situation, when a primary plmn list configured by a hplmn/eplmn is different from at least one secondary plmn list configured by at least one vplmn.
Inventor(s): Aby KANNEATH ABRAHAM of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W48/08
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present subject matter refers to a system and a method for performing slice-based cell reselection. the method includes receiving () a slice priority by a ue () from a network for each of one or more groups of slices over a nas. further, the method includes receiving () a frequency priority information and receiving () a set of legacy cell reselection priorities un-associated with the one or more slices by the ue () from the network for each of the one or more groups of slices from the network one or more groups of slices furthermore, the method includes determining () a relative priority by the ue () for each of the set of frequencies based on the received slice priority and the received frequency priority information by using one or more conditions. the method also includes performing () slice-based cell reselection by the ue () based on the determined relative priority.
Inventor(s): Mahmoud Esam Mohamed Ahmed ABDELGELIL of San Diego CA (US) for samsung electronics co., ltd., Wan Jong KIM of Tustin CA (US) for samsung electronics co., ltd., Pranav DAYAL of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W52/22, H04B7/06, H04W52/36
CPC Code(s): H04W52/228
Abstract: a system and method for controlling radiated power. in some embodiments, a device includes: a first radio; a second radio; and one or more processors; and a memory storing instructions which, when executed by the one or more processors, cause performance of: determining that a first transmission, of the first radio, is transmitted at a first power level greater than zero and less than a first threshold, and in response to determining that the first transmission of the first radio is transmitted at a first power level less than the first threshold, causing the second radio to transmit a second transmission at a second power level, wherein the second power level is determined based at least in part on the first power level and the first threshold.
Inventor(s): Yongjin KANG of Suwon-si (KR) for samsung electronics co., ltd., Duhe JANG of Suwon-si (KR) for samsung electronics co., ltd., Byungseok SOH of Suwon-si (KR) for samsung electronics co., ltd., Hyungyong LEE of Suwon-si (KR) for samsung electronics co., ltd., Chanho JUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W56/00, G06F1/12
CPC Code(s): H04W56/0045
Abstract: an electronic device includes a communication circuit including a first interface and a second interface, a memory storing instructions, and a processor communicatively coupled with the communication circuit via the first interface or via the second interface. the processor is configured to execute the instructions to send, to the communication circuit via the first interface, a request for clock information of the communication circuit, receive, from the communication circuit via the first interface, the clock information of the communication circuit, receive, from the communication circuit via the second interface, an interrupt signal and first time information corresponding to the interrupt signal being generated, and generate clock information of the processor based on the clock information of the communication circuit and the first time information.
Inventor(s): Bokkeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyun Seung CHOO of Suwon-si (KR) for samsung electronics co., ltd., Dong Jin LEE of Seoul (KR) for samsung electronics co., ltd., Hyun Jun CHOI of Seoul (KR) for samsung electronics co., ltd., Joong Gunn PARK of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W8/02
CPC Code(s): H04W68/02
Abstract: in a method for operating data analysis devices, including first data analysis devices distributed in a network and a centralized second data analysis device, according to an embodiment, the first data analysis devices collects mobility data of a user terminal from mobility management devices in the network, the second data analysis device preprocesses the mobility data, the second data analysis device applies the preprocessed mobility data to a prediction model based on a neural network and trains the prediction model to predict base stations serving a target location to which the user terminal is predicted to move by the prediction model, and the trained prediction model and identification information about the user terminal can be transferred to the first data analysis devices.
Inventor(s): Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Emad N. Farag of Flanders NJ (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/044, H04W24/10
CPC Code(s): H04W72/046
Abstract: a method for operating a user equipment (ue) comprises receiving configuration information including information on a set of transmission configuration indicator (tci) states and information on reception of a beam indication; receiving the beam indication based on the configuration information; and determining whether the beam indication is used for (a) or (b), wherein: (a) corresponds to triggering a beam measurement and a beam report, and (b) corresponds to indicating at least one tci state for downlink (dl) reception or uplink (ul) transmission.
Inventor(s): Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L5/00, H04W76/28
CPC Code(s): H04W72/23
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments of the present disclosure provide a method for monitoring pdcch, an electronic device and a computer-readable storage medium, the method including: receiving configuration information for configuring a time unit for pdcch monitoring within a first duration included in each period of a pdcch ss; monitoring pdcch based on the configuration information. this application embodiment enables the reduction of the number of pdcch monitoring, thereby achieving power saving for the ue.
Inventor(s): Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jeongho YEO of Gyeonggi-do (KR) for samsung electronics co., ltd., Younsun KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Jinyoung OH of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/23, H04L5/00, H04W72/00, H04W72/0453
CPC Code(s): H04W72/23
Abstract: the present invention relates to a communication technique for convergence of an iot technology and a 5g communication system for supporting a higher data transmission rate beyond a 4g system, and a system therefor. the present disclosure can be applied to an intelligent service (for example, a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5g communication technology and an iot-related technology. a method for communicating by a base station according to the present invention comprises transmitting control information relating to at least two services to a terminal; and transmitting data relating to the at least two services to the terminal, wherein at least one of a control region for transmitting the control information and a data region for transmitting the data may include at least two frequency bandwidths corresponding to each of the at least two services.
Inventor(s): Meifang JING of Beijing (CN) for samsung electronics co., ltd., Weili CUI of Beijing (CN) for samsung electronics co., ltd., Qing ZHU of Beijing (CN) for samsung electronics co., ltd., Ying LI of Beijing (CN) for samsung electronics co., ltd., Jing YUAN of Beijing (CN) for samsung electronics co., ltd., Yan LI of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/541, H04L1/20, H04L5/00
CPC Code(s): H04W72/541
Abstract: an example method performed by a network node may include obtaining measurement information of interference cell(s) of at least one ue and/or traffic information of the interference cell(s); adjusting a target block error rate (bler) for a target ue in the at least one ue according to the measurement information of the interference cell(s) and/or the traffic information of the interference cell(s); and transmitting data to the target ue based on the adjusted target bler.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W72/563, H04L1/1829, H04W72/25
CPC Code(s): H04W72/563
Abstract: the disclosure provides a method performed by a communication device in a communication system, comprising: receiving multiple sidelink control information (sci) from other communication devices; when the multiple sci indicate the same or partially overlapping resource, based on at least one of information about relationship between the communication device and the multiple sci, received power information related to the multiple sci, and information about priorities indicated by the multiple sci, determining whether a conflict occurs on resources indicated by the multiple sci.
Inventor(s): Jehwan SEO of Suwon-si (KR) for samsung electronics co., ltd., Chulju Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04L5/00, H04W76/11
CPC Code(s): H04W76/15
Abstract: a display device is disclosed, including a first communication unit communicating using a first wireless communication technology; a second communication unit communicating using a second wireless communication technology; and a processor connected to the first communication unit and the second communication unit. the display device may be configured to receive, from a first electronic device for transmitting data received from a source device, through the first communication unit, first image data; receive, from a remote control device for transmitting input information of the source device, through the second communication unit, a connection request; in response to receiving the connection request, perform pairing operation of the display device with the remote control device, and transmit pairing information of the display device and the remote control device to the first electronic device through the first communication unit. the first electronic device and the display device may be connected to a same network.
Inventor(s): June HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/18
CPC Code(s): H04W76/18
Abstract: the present disclosure relates to: a communication technique for combining iot technology with a 5g communication system for supporting a higher data transmission rate than 4g systems; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security- and safety-related services, etc.) on the basis of 5g communication technology and iot-related technology. disclosed in the present disclosure are a method and device which can prevent a packet routing failure in a backhaul and access haul combination system.
Inventor(s): Hyunjung KIM of Suwon-si (KR) for samsung electronics co., ltd., Suha YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/19, H04W24/10, H04W72/0446, H04W72/0453, H04W76/20
CPC Code(s): H04W76/19
Abstract: a method and an apparatus for controlling a radio resource of an electronic device are disclosed. according to various embodiments of the present invention, the method can comprise the steps of: receiving, from an electronic device, an assistance information message related to overheating of the electronic device using a first radio resource; transmitting, to the electronic device, a first radio resource control (rrc) connection reconfiguration message for allocating, to the electronic device, a second radio resource that has been reduced more than the first radio resource; receiving, from the electronic device, a first rrc reconfiguration completion message as a response to the first rrc connection reconfiguration message; and transmitting, to the electronic device, a second rrc connection reconfiguration message for allocating, to the electronic device, a third radio resource that has been expanded more than the second radio resource at a first time point after the first rrc reconfiguration completion message has been received.
Inventor(s): Youngbum KIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Taehan BAE of Gyeonggi-do (KR) for samsung electronics co., ltd., Junyung YI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/28, H04W52/02
CPC Code(s): H04W76/28
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. a method performed by a ue in a communication system includes transmitting, to a base station, capability information including a capability to support an energy saving mode of the base station, the energy saving mode of the base station being based on cell dtx, receiving, from the base station, information associated with a measurement for the energy saving mode of the base station, identifying that the base station operates according to the energy saving mode, and receiving, from the base station, a reference signal for measurement based on the information.
Inventor(s): Woong HWANG of Suwon-si (KR) for samsung electronics co., ltd., Minkyung LEE of Suwon-si (KR) for samsung electronics co., ltd., Jeongnam CHEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B3/82, H05B3/03, H05B3/14, H05B3/40
CPC Code(s): H05B3/82
Abstract: a heater, a water purifier, and a hot air blower comprising the same are provided. the heater is configured to heat a fluid and includes a graphene scroll forming a heating flow path extending between an inlet through which the fluid flows into the heater and an outlet through which the fluid flows out of the heater, and configured to generate heat in response to an electrical current flowing therethrough, and an electrode configured to apply a voltage to the graphene scroll. the electrode includes a first side electrode electrically connected to the graphene scroll, a second side electrode electrically connected to the graphene scroll and opposite to the first side electrode, and an intermediate electrode electrically connected to the graphene scroll and disposed between the first side electrode and the second side electrode.
Inventor(s): Youngsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Sungwon PARK of Suwon-si (KR) for samsung electronics co., ltd., Eunseck HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/02, H05K1/11, H05K1/14
CPC Code(s): H05K1/0283
Abstract: a printed circuit board is provided. the printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. the extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. in the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
Inventor(s): Casey Glenn Thielen of Chandler AZ (US) for samsung electronics co., ltd.
IPC Code(s): H05K1/18, H05K1/11
CPC Code(s): H05K1/181
Abstract: a system includes a printed circuit board having high-density interconnects, a number of surface mount connectors coupled to an edge portion of the printed circuit board, and at least one fastener securing the connectors to the printed circuit board. each surface mount connector includes a number of outriggers. a first connector and a second connector are interlocked on a first side of the printed circuit board. a third connector and a fourth connector are interlocked on a second side of the printed circuit board opposite to the first and second connectors on the first side of the printed circuit board.
Inventor(s): Daesu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yousub LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunyong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaemin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02, F16C11/04, F16M11/08, F16M11/22, F16M13/02, H05K5/00
CPC Code(s): H05K5/0226
Abstract: a display apparatus comprises: a first display unit comprising a first connector, a second display unit disposed adjacent to one side of the first display unit and comprising a second connector, and a connection bracket configured to connect the first display unit and the second display unit. the connection bracket comprises: a third connector configured to be electrically connected to the first connector, a fourth connector configured to be electrically connected to the second connector, and a hinge.
Inventor(s): Daesu CHOI of Suwon-si (KR) for samsung electronics co., ltd., Yousub LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunyong CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jaemin CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/00, H01R13/62, H01R13/629
CPC Code(s): H05K5/0021
Abstract: a display apparatus comprises: a first display unit comprising a first connector, a second display unit disposed adjacent to one side of the first display unit, the second display unit comprising a second connector, a connection bracket comprising a third connector configured to be electrically connectable to the first connector, and a fourth connector configured to be electrically connectable the second connector, and a position adjusting device configured to move at least one of the first display unit and the second display unit to adjust a mounting position of the at least one of the first display unit and the second display unit while the connection bracket is mounted to the first display unit and the second display unit so that the first connector is connected to the third connector and the second connector is connected to the fourth connector.
20250071967. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sohyun Park of Suwon-si (KR) for samsung electronics co., ltd., Inwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/0335
Abstract: a semiconductor device includes a semiconductor substrate, a plurality of contact plugs spaced apart from each other on the semiconductor substrate, a plurality of first landing pads spaced apart from each other on the plurality of contact plugs, a landing insulating layer surrounding upper sidewalls of the plurality of first landing pads and covering upper portions of the plurality of first landing pads, a stopper insulating layer disposed on the landing insulating layer, and a plurality of second landing pads spaced apart from each other on the plurality of first landing pads, passing through the stopper insulating layer, and buried in landing opening holes formed in the landing insulating layer, the plurality of second landing pads being electrically and respectively connected to the plurality of first landing pads.
20250071969. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Yun Choi of Suwon-si (KR) for samsung electronics co., ltd., Seungmuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Inwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Sohyun Park of Suwon-si (KR) for samsung electronics co., ltd., Hanseong Shin of Suwon-si (KR) for samsung electronics co., ltd., Kiseok Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyunjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Hosang Lee of Suwon-si (KR) for samsung electronics co., ltd., Hongjun Lee of Suwon-si (KR) for samsung electronics co., ltd., Heejae Chae of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L21/027, H01L21/311
CPC Code(s): H10B12/315
Abstract: a semiconductor device may include a plurality of active patterns disposed on a substrate, a gate structure extending in a first direction, a bit line structure extending in a second direction, and a plurality of capacitors electrically connected to the plurality of active patterns, respectively, the plurality of active patterns having a shape extending in a third direction oblique to the first and second directions, the gate structure passing through centers of the plurality of active patterns, the bit line structure connected to first end portions of the plurality of active patterns, the plurality of capacitors connected to second end portions of the plurality of active patterns, respectively, the first end portion and the second end portion positioned at opposite sides with respect to the gate structure, and the first end portion and the second end portion having point-symmetrical shapes with respect to a center of the active pattern.
Inventor(s): Jang Eun LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Suk Hoon KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Hyo-Sub KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device with an improved electric characteristic and reliability is provided. the semiconductor memory device including a substrate including an active region defined by device separation film, the active region including a first part and second parts, the second parts being on two opposite sides of the first part, respectively a bit line extending on the substrate and across the active region, and a bit line contact between the substrate and the bit line and connected to the first part of the active region may be provided. the bit line contact includes a first ruthenium pattern, and a width of upper surface of the first ruthenium pattern is smaller than a width of bottom surface of the first ruthenium pattern.
20250071980. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wonyoung JEONG of Suwon-si (KR) for samsung electronics co., ltd., Choonghyun LEE of Suwon-si (KR) for samsung electronics co., ltd., Jooncheol KIM of Suwon-si (KR) for samsung electronics co., ltd., Sunyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Youngseung CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/50
Abstract: a semiconductor device may include a substrate including, lower bit line structures from a first region to a second region adjacent to the first region and extending in a second direction perpendicular to the first direction, a second gate structure on the second region of the substrate to be spaced apart from the lower bit line structure, a first offset spacer on a first sidewall corresponding to an end of each of the lower bit line structures in the second direction, a second offset spacer and a first spacer sequentially arranged on a sidewall of the second gate structure, an insulation liner layer at least disposed a surface of the first offset spacer, and a capping pattern covering the lower bit line structures and an upper portion of the second gate structure. the first offset spacer and the insulation liner layer include silicon nitride.
Inventor(s): Sangwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Jongho WOO of Suwon-si (KR) for samsung electronics co., ltd., Seung Min LEE of Suwon-si (KR) for samsung electronics co., ltd., Moonkang CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L25/065, H10B43/10, H10B43/35, H10B51/10, H10B51/20, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a source structure comprising a first source layer, a second source layer on the first source layer, and a third source layer on the second source layer, a gate stack structure on the source structure, the gate stack structure with alternating insulating patterns and conductive patterns, and a memory channel structure penetrating the gate stack structure. the memory channel structure includes a channel layer and a memory layer surrounding the channel layer. the channel layer penetrates the memory layer and the second source layer, and a bottom surface of the channel layer is in contact with the source structure.
Inventor(s): Min Yong Lee of Suwon-si (KR) for samsung electronics co., ltd., Se Hoon Lee of Suwon-si (KR) for samsung electronics co., ltd., Jun Hyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Ji Young Kim of Suwon-si (KR) for samsung electronics co., ltd., Suk Kang Sung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, G11C16/04, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/41, H10B43/10, H10B43/35, H10B43/40, H10B80/00
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device may include a cell substrate including a first surface and a second surface opposite to the first surface, and a landing pattern including a third surface and a fourth surface opposite to the third surface, with the landing pattern spaced apart from the cell substrate in a horizontal direction. the semiconductor memory device may include a plurality of gate electrodes sequentially stacked on the first surface and the third surface, a channel structure on the cell substrate, the channel structure extending vertically and intersecting the plurality of gate electrodes, an upper insulating film covering the second surface and the fourth surface, an input/output pad on the upper insulating film, the input/output pad overlapping at least a portion of the plurality of gate electrodes in the vertical direction, and a support contact extending through the upper insulating film and connecting the landing pattern and the input/output pad.
Inventor(s): Hyunji Kim of Suwon-si (KR) for samsung electronics co., ltd., Sehee Jang of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27
CPC Code(s): H10B43/27
Abstract: the present disclosure relates to three-dimensional (3d) semiconductor memory devices and electronic systems. an example 3d semiconductor memory device comprises a substrate that includes a cell array region and a connection region, a structure in which a plurality of dielectric layers and a plurality of gate electrodes are alternately stacked on the substrate, a plurality of dummy vertical structures that extend through the structure on the connection region, and a gate contact that extends through the structure on the connection region and is connected to one gate electrode of the plurality of gate electrodes. the gate contact is between the plurality of dummy vertical structures in a plan view. the gate contact includes a first portion and a plurality of second portions that extend between the plurality of dummy vertical structures.
20250071994. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kohji Kanamori of Suwon-si (KR) for samsung electronics co., ltd., Seogoo Kang of Suwon-si (KR) for samsung electronics co., ltd., Kyungdong Kim of Suwon-si (KR) for samsung electronics co., ltd., Seunghyun Lee of Suwon-si (KR) for samsung electronics co., ltd., Junghoon Jun of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd., Taeyoon Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B43/10, H10B43/35, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor device includes a gate electrode structure, a memory channel structure, and a first contact plug. the gate electrode structure is disposed on a substrate, and includes gate electrodes spaced apart from each other in a first direction substantially perpendicular to an upper surface of the substrate. each of the gate electrode extends in a second direction substantially parallel to the upper surface of the substrate. the memory channel structure extends through the gate electrode structure on the substrate. the first contact plug extends in the first direction on the substrate through and contacting a corresponding one of the gate electrodes, and a portion of a sidewall of the first contact plug at substantially the same level as the corresponding one of the gate electrodes is not surrounded by the corresponding one of the gate electrodes.
Inventor(s): Hanbyeol LEE of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd., Younghwan SON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, G11C16/04, H01L23/528, H01L23/532, H01L25/065, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes: a peripheral circuit structure including a substrate and a circuit that is disposed on the substrate; a cell structure disposed on the peripheral circuit structure and including gate electrodes and a channel that extends through the gate electrodes; and a bonding structure located between the peripheral circuit structure and the cell structure, wherein the bonding structure includes: a first insulating layer attached to the peripheral circuit structure; a first bonding pad disposed on the peripheral circuit structure and electrically connected to the circuit; a second insulating layer attached to the cell structure; a second bonding pad disposed on the cell structure and electrically connected to the gate electrodes; and an anisotropic conductive adhesive layer located between the first insulating layer and the second insulating layer and between the first bonding pad and the second bonding pad, and including a plurality of conductive particles.
20250072005. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Kilho LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongjae Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B61/00, B64D47/00, H01L25/065, H10B80/00
CPC Code(s): H10B61/00
Abstract: provided is a semiconductor device including a logic region including a circuit, a first memory region controlled by the logic region and having a first storage capacity, the first memory region including a plurality of first memory cells, and a second memory region controlled by the logic region and having a second storage capacity greater than the first storage capacity, the second memory region including a plurality of second memory cells, wherein each of the plurality of first memory cells and each of the plurality of second memory cells includes a magnetic memory element, and wherein an operating speed of the first memory region is faster than an operating speed of the second memory region.
Inventor(s): Kiyoung LEE of Seoul (KR) for samsung electronics co., ltd., Kookrin CHAR of Seoul (KR) for samsung electronics co., ltd., Byunghoon NA of Suwon-si (KR) for samsung electronics co., ltd., Hahoon LEE of Yongin-si (KR) for samsung electronics co., ltd., Dowon SONG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/30, H01G4/12
CPC Code(s): H01L28/56
Abstract: a thin film laminate structure, an integrated device including the same, and a method of manufacturing the thin film laminate structure are provided. the thin film laminate structure includes two or more dielectric layers, wherein at least one of the dielectric layers of the thin film laminate structure includes a compound represented by formula 1 and having a perovskite-type crystal structure having a b/b′ composition ratio different from that of a remainder of the dielectric layers:
Inventor(s): Kiyoung LEE of Seoul (KR) for samsung electronics co., ltd., Kookrin CHAR of Seoul (KR) for samsung electronics co., ltd., Byunghoon NA of Suwon-si (KR) for samsung electronics co., ltd., Hahoon LEE of Yongin-si (KR) for samsung electronics co., ltd., Dowon SONG of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01G4/30, H01G4/12
CPC Code(s): H01L28/56
Abstract:
abb′o <formula 1>
20250072041. INTEGRATED CIRCUIT DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sungmin Kim of Incheon (KR) for samsung electronics co., ltd., Daewon Ha of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L29/417
CPC Code(s): H01L29/7851
Abstract: an integrated circuit device according to the inventive concept includes: a fin-type active area protruding from a substrate and extending in a first horizontal direction; a stopper layer that is above and spaced apart from the fin-type active area; a gate electrode extending in a second horizontal direction orthogonal to the first horizontal direction, on the fin-type active area, and in a space between the fin-type active area and the stopper layer; and a gate capping layer on upper surfaces of the gate electrode and the stopper layer.
20250072048. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Youngjin YANG of Suwon-si (KR) for samsung electronics co., ltd., Kyunam PARK of Suwon-si (KR) for samsung electronics co., ltd., Jaeho JEON of Suwon-si (KR) for samsung electronics co., ltd., Kyoungmi PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/528, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device includes an insulating base layer, a plurality of semiconductor patterns stacked on the insulating base layer and spaced apart from each other, a gate structure surrounding the plurality of semiconductor patterns, first and second source/drain patterns disposed on the insulating base layer and connected to both side surfaces of the plurality of semiconductor patterns, respectively, a contact structure connected to first source/drain patterns through the insulating base layer, a sidewall insulating film disposed between an upper portion of the contact structure and an upper portion of the insulating base layer and extending onto a region of a portion of the gate structure located below a lowermost semiconductor pattern among the plurality of semiconductor patterns, and a power transmission line disposed on a lower surface of the insulating base layer and connected to the contact structure.
20250072053. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): MYUNG GIL KANG of Suwon-si (KR) for samsung electronics co., ltd., DONG WON KIM of Seongnam-si (KR) for samsung electronics co., ltd., WOO SEOK PARK of Ansan-si (KR) for samsung electronics co., ltd., KEUN HWI CHO of Seoul (KR) for samsung electronics co., ltd., SUNG GI HUR of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/423, H01L27/092, H01L29/06, H01L29/786
CPC Code(s): H01L29/42392
Abstract: semiconductor devices include a first active pattern including a first lower pattern extending in a first direction and a first sheet pattern spaced apart from the first lower pattern; and a first gate electrode on the first lower pattern, the first gate electrode extending in a second direction and surrounding the first sheet pattern, wherein the first lower pattern includes a first sidewall and a second sidewall opposite to each other, each of the first sidewall of the first lower pattern and the second sidewall of the first lower pattern extends in the first direction, the first gate electrode overlaps the first sidewall of the first lower pattern in the second direction by a first depth, the first gate electrode overlaps the second sidewall of the first lower pattern in the second direction by a second depth, and the first depth is different from the second depth.
Inventor(s): Kwanghee LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Sangwook KIM of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/02, H01L29/66
CPC Code(s): H01L29/7869
Abstract: the present disclosure relates to oxide semiconductor transistors, methods of manufacturing the same, and/or memory devices including the oxide semiconductor transistors. the oxide semiconductor transistor includes first and second compound layers provided on a substrate, a channel layer in contact with the first and second compound layers, a first electrode facing a portion of the channel layer, a second electrode facing the first compound layer with the channel layer therebetween, and a third electrode facing the second compound layer with the channel layer therebetween. an oxygen concentration of a region of the channel layer facing the first electrode is greater than that of the remaining regions of the channel layer. a buffer layer may further be provided between the channel layer and the second and third electrodes. the first and second compound layers may include oxygen and a metal.
Inventor(s): Hyemi LEE of Seoul (KR) for samsung electronics co., ltd., Seongjae GO of Suwon-si (KR) for samsung electronics co., ltd., Hyeonjoo SONG of Hwaseong-si (KR) for samsung electronics co., ltd., Sunjoong PARK of Hwaseong-si (KR) for samsung electronics co., ltd., Hanyong PARK of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, G11C5/06, H01L25/065, H10B43/10, H10B43/27, H10B43/35, H10B43/40
CPC Code(s): H01L29/0638
Abstract: a semiconductor device including a peripheral circuit layer on a substrate; a lower stack and upper stack on the substrate; a stopper layer on the upper stack and including an insulating material; an upper mold layer on the stopper layer; a cell channel structure extending through the layers, a side surface of the cell channel structure contacting the stopper layer; first and second capping layers; a word line separation structure including a protrusion protruding toward the stopper layer; and a bit line contact plug connected to the cell channel structure, wherein an inner side surface of the stopper layer is offset from an inner side surface of the upper stack, and in contact with the word line separation structure.
20250072066. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Wooseok PARK of Suwon-si (KR) for samsung electronics co., ltd., Wookhwan SONG of Suwon-si (KR) for samsung electronics co., ltd., Donghoon HWANG of Suwon-si (KR) for samsung electronics co., ltd., Myungil KANG of Suwon-si (KR) for samsung electronics co., ltd., Taehyun RYU of Suwon-si (KR) for samsung electronics co., ltd., Namhyun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/06, H01L29/417, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/0673
Abstract: a semiconductor device may include a first active pattern, a second active pattern spaced apart at a first distance from the first active pattern, a third active pattern spaced apart at a second distance from the second active pattern, a first device isolation layer between the first and second active patterns, a second device isolation layer between the second and third active patterns, a first channel structure overlapping the first active pattern, a second channel structure overlapping the second active pattern, a third channel structure overlapping the third active pattern, and a separation dielectric layer between the first and second channel structures. the separation dielectric layer may overlap the first device isolation layer. a level of a top surface of the first device isolation layer may be higher than a level of a top surface of the second device isolation layer.
Inventor(s): Kyungwook PARK of Suwon-si (KR) for samsung electronics co., ltd., Sangmin KANG of Suwon-si (KR) for samsung electronics co., ltd., Changwoo SEO of Suwon-si (KR) for samsung electronics co., ltd., Suyoun SONG of Suwon-si (KR) for samsung electronics co., ltd., Dain LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/528
CPC Code(s): H01L29/41766
Abstract: a semiconductor device may include first and second active patterns, each including a center portion and an edge portion, the center portion of the first active pattern and the edge portion of the second active pattern adjacent to each other, a device isolation pattern between the first and second active patterns, a bit line node contact on the center portion of the first active pattern, a bit line on the bit line node contact, a storage node contact on the edge portion of the second active pattern, a bit line spacer between the bit line and the storage node contact, and a gapfill insulating pattern between a lower portion of the bit line spacer and the storage node contact. the center portion of the first active pattern may include a center oxide region in an upper portion thereof.
Inventor(s): Gi Woong SHIM of Suwon-si (KR) for samsung electronics co., ltd., Seong Heum CHOI of Suwon-si (KR) for samsung electronics co., ltd., Do Sun LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyo Seok CHOI of Suwon-si (KR) for samsung electronics co., ltd., Rak Hwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Chung Hwan SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/8234, H01L21/308, H01L21/768, H01L27/088, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786
CPC Code(s): H01L21/823418
Abstract: a method of fabricating a semiconductor device includes: forming an active pattern on a substrate, forming a source/drain pattern on the active pattern, forming a contact hole on the source/drain pattern, forming a contact barrier layer, which has an upper surface of a first height based on a bottom surface of the contact hole, in the contact hole, forming a passivation layer on the contact barrier layer in the contact hole, forming a mask layer on the passivation layer in the contact hole, removing an upper portion of the contact barrier layer so that an upper surface of the contact barrier layer has a second height lower than the first height, removing the passivation layer and the mask layer, and forming a contact filling layer, which covers the upper surface of the contact barrier layer and fills the contact hole, in the contact hole.
Inventor(s): Mehdi Saremi of Danville CA (US) for samsung electronics co., ltd., Ming He of San Jose CA (US) for samsung electronics co., ltd., Aravindh Kumar of Mountain View CA (US) for samsung electronics co., ltd., Muhammed Ahosan Ul Karim of San Jose CA (US) for samsung electronics co., ltd., Rebecca Park of Mountain View CA (US) for samsung electronics co., ltd., Harsono Simka of Saratoga CA (US) for samsung electronics co., ltd.
IPC Code(s): H01L21/8238, H01L29/08
CPC Code(s): H01L21/823814
Abstract: a method of manufacturing a three-dimensional field-effect transistor including an upper field-effect transistor stacked on a lower field-effect transistor. the method includes epitaxially growing source/drain regions of the lower field-effect effect transistor, growing a sacrificial layer on an upper surface of the source/drain regions, and epitaxially growing source/drain regions of the upper field-effect transistor on the sacrificial layer. the sacrificial layer is a seed layer for the source/drain regions of the upper field-effect transistor. the method also includes selectively etching the sacrificial layer to form a gap between the source/drain regions of the lower field-effect transistor and the source/drain regions of the upper field-effect transistor, and depositing an oxide layer in the gap.
Inventor(s): Jisoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Byungju KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaehyoung LIM of Suwon-si (KR) for samsung electronics co., ltd., Kwanyoung CHUN of Suwon-si (KR) for samsung electronics co., ltd., Subin CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L23/528, H01L29/06, H01L29/417, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L27/0922
Abstract: a three-dimensional semiconductor device may include a back-side metal layer, a lower channel pattern on the back-side metal layer, first and second lower source/drain patterns, which are spaced apart from each other in a first direction with the lower channel pattern interposed therebetween, the first lower source/drain pattern being connected to the lower channel pattern, an upper channel pattern on the lower channel pattern, a first upper source/drain pattern on the first lower source/drain pattern, the first upper source/drain pattern being connected to the upper channel pattern, a second upper source/drain pattern on the second lower source/drain pattern, and a wide via electrically connecting the first upper source/drain pattern to the second lower source/drain pattern. the wide via may include first and second via portions having first and second top surfaces, and here, the second top surface may be located at a level lower than the first top surface.
Inventor(s): SUNGIL PARK of Suwon-si (KR) for samsung electronics co., ltd., JAE HYUN PARK of Hwaseong-si (KR) for samsung electronics co., ltd., DAEWON HA of Seoul (KR) for samsung electronics co., ltd., KYUMAN HWANG of Daejeon (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/02, H01L21/822, H01L21/8238, H01L29/06, H01L29/423, H01L29/66, H01L29/78, H01L29/786
CPC Code(s): H01L27/0922
Abstract: provided is a three-dimensional semiconductor device and its fabrication method. the semiconductor device includes a first active region on a substrate and including a plurality of lower channel patterns and a plurality of lower source/drain patterns that are alternately arranged along a first direction, a second active region on the first active region and including a plurality of upper channel patterns and a plurality of upper source/drain patterns that are alternately arranged along the first direction, a first gate electrode on a first lower channel pattern of the lower channel patterns and on a first upper channel pattern of the upper channel patterns, and a second gate electrode on a second lower channel pattern of the lower channel patterns and on a second upper channel pattern of the upper channel patterns. the second gate electrode may include lower and upper gate electrodes with an isolation pattern interposed therebetween.
20250072142. IMAGE SENSOR_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gyunha PARK of Suwon-si (KR) for samsung electronics co., ltd., JONGHYUN GO of Suwon-si (KR) for samsung electronics co., ltd., JI-YOUN SONG of Suwon-si (KR) for samsung electronics co., ltd., KEUN YEONG CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146
CPC Code(s): H01L27/14623
Abstract: an image sensor may include: a pixel array in which a plurality of pixels are arranged in a matrix, including a first pixel and a second pixel disposed adjacent to each other, each of the plurality of pixels includes: at least one photoelectric conversion device; at least one floating diffusion region to which charges of the at least one photoelectric conversion device are configured to be transferred; a reset transistor configured to transfer a voltage at a reset node to the at least one floating diffusion region; a source follower transistor having one end connected to a pixel voltage node and configured to output a sampling voltage corresponding to charges of the at least one floating diffusion region; and a select transistor having one end connected to the source follower transistor and configured to output the sampling voltage to an output node.
SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- A47L7/00
- A47L11/40
- CPC A47L7/0023
- Samsung electronics co., ltd.
- A47L9/00
- A47L9/28
- G06V10/12
- G06V20/58
- CPC A47L9/009
- CPC A47L9/2821
- A61B5/145
- A61B5/00
- CPC A61B5/14532
- B24B37/27
- B24B37/34
- B24B51/00
- CPC B24B37/27
- B65H49/32
- B65H69/02
- B65H69/04
- B65H69/08
- H01L23/00
- CPC B65H49/32
- C07D519/00
- C07D487/14
- H10K50/11
- H10K50/12
- H10K71/00
- H10K85/60
- H10K101/00
- H10K101/10
- H10K101/30
- H10K101/40
- CPC C07D519/00
- C07F15/00
- H10K50/15
- H10K50/16
- H10K50/17
- H10K50/18
- H10K85/30
- CPC C07F15/0033
- CPC C07F15/0086
- C09G1/04
- CPC C09G1/04
- C09J11/04
- B22F1/052
- B22F1/17
- B23K35/02
- B23K35/26
- B23K103/08
- CPC C09J11/04
- C30B29/38
- H01L21/02
- CPC C30B29/38
- D06F34/04
- D06F19/00
- D06F33/36
- D06F33/38
- D06F33/40
- D06F35/00
- D06F39/40
- D06F58/38
- D06F101/20
- D06F103/04
- D06F105/58
- CPC D06F34/04
- D06F34/18
- D06F34/20
- D06F34/32
- D06F39/14
- D06F103/02
- D06F103/40
- CPC D06F34/18
- D06F34/28
- D06F34/14
- D06F103/06
- CPC D06F34/28
- D06F25/00
- D06F33/68
- D06F33/70
- D06F34/30
- D06F101/14
- D06F105/56
- CPC D06F34/32
- D06F39/02
- D06F39/08
- D06F39/12
- CPC D06F35/00
- CPC D06F39/088
- D06F39/10
- B01D29/11
- B01D29/64
- B01D35/143
- B01D35/157
- D06F23/02
- D06F37/26
- D06F103/42
- D06F103/44
- D06F105/02
- D06F105/06
- D06F105/08
- D06F105/54
- CPC D06F39/10
- D06F43/00
- D06F43/08
- D06F45/16
- D06F51/00
- CPC D06F43/002
- F25C1/24
- B67D1/00
- B67D1/12
- F25C1/25
- CPC F25C1/24
- F25D23/02
- H04R1/02
- H04R1/40
- CPC F25D23/028
- F25D23/06
- CPC F25D23/063
- G01R31/319
- G01R31/30
- G05B19/042
- CPC G01R31/31924
- G01R31/52
- G01R31/378
- G01R31/3835
- H01M10/42
- CPC G01R31/52
- G01S7/481
- G02F1/29
- CPC G01S7/4817
- CPC G01S7/4818
- G02B3/00
- H04N9/64
- H04N23/84
- CPC G02B3/0056
- G02B6/122
- G02B6/12
- CPC G02B6/122
- G02B7/28
- G02B27/10
- G02B27/12
- G03B13/36
- H04N9/01
- H04N25/704
- CPC G02B7/28
- G02B27/01
- G06Q50/10
- G06T19/00
- H04N13/332
- H04N13/366
- H04N13/383
- H04N21/414
- H04N21/442
- H04N21/81
- CPC G02B27/0179
- G02F1/1362
- G02F1/1333
- G02F1/1335
- G02F1/1368
- CPC G02F1/136204
- G03B21/14
- H04N9/31
- CPC G03B21/145
- G03F1/24
- CPC G03F1/24
- G05D1/648
- G05D1/622
- G05D101/20
- G05D105/10
- CPC G05D1/6484
- G06F1/16
- CPC G06F1/1681
- G06F1/3234
- G11C7/22
- CPC G06F1/3234
- G06F3/01
- CPC G06F3/013
- G02B27/00
- G06V20/20
- G06V20/64
- G06F3/046
- G06F3/0354
- G06F3/041
- CPC G06F3/046
- G06F3/04845
- G06F3/04842
- CPC G06F3/04845
- G06F3/06
- CPC G06F3/0613
- G11C16/04
- G11C16/08
- G11C16/26
- H10B43/27
- CPC G06F3/0619
- CPC G06F3/0631
- CPC G06F3/0655
- CPC G06F3/0656
- G06F3/16
- G10L21/028
- G10L25/63
- CPC G06F3/165
- G06F9/455
- CPC G06F9/45558
- G06F11/10
- G06F11/07
- G06F11/14
- CPC G06F11/1044
- CPC G06F11/1068
- G06F12/02
- CPC G06F12/0246
- G06F13/16
- G06F9/50
- CPC G06F13/1668
- G06F13/42
- CPC G06F13/42
- G06F16/17
- CPC G06F16/1724
- G06F16/2455
- G06F16/2457
- CPC G06F16/24553
- G06F16/28
- G06F16/245
- CPC G06F16/285
- G06F21/44
- G06F21/60
- G06F21/71
- CPC G06F21/445
- G06N5/04
- CPC G06F21/602
- G06F21/84
- G06F21/62
- CPC G06F21/84
- G06F30/25
- CPC G06F30/25
- G06F30/398
- G06F30/392
- G06F115/02
- G06F119/06
- CPC G06F30/398
- G06F40/35
- CPC G06F40/35
- G06N3/048
- CPC G06N3/048
- G06N3/0499
- G06N3/045
- G06N3/0895
- G16C20/10
- G16C20/70
- CPC G06N3/0499
- G06N3/126
- CPC G06N3/126
- G06N5/022
- G06F1/3203
- G06N3/04
- CPC G06N5/022
- CPC G06N5/04
- G06N20/20
- CPC G06N20/20
- G06Q30/0242
- G06Q30/0251
- CPC G06Q30/0245
- G06T5/60
- G06T5/50
- G06T7/00
- CPC G06T5/60
- H04N5/265
- H04N23/67
- CPC G06T7/0002
- G06T7/246
- G06T3/18
- G06T7/70
- G06V40/20
- CPC G06T7/246
- G06F3/0338
- CPC G06T7/248
- G06T7/55
- CPC G06T7/55
- G06T7/579
- G06T7/194
- CPC G06T7/579
- G06T7/73
- B60W60/00
- G06V10/762
- G06V10/774
- G06V10/776
- CPC G06T7/73
- G06T9/00
- H04N19/436
- CPC G06T9/002
- G06T15/00
- G06T7/20
- G06V10/44
- CPC G06T15/00
- G06T15/20
- G06T15/06
- CPC G06T15/205
- CPC G06T19/006
- G06V10/75
- G06T7/231
- CPC G06V10/751
- G06V10/771
- G06T7/90
- G06V10/56
- CPC G06V10/771
- G06V20/40
- G06F40/20
- G06V10/25
- G11B27/031
- CPC G06V20/46
- G09G3/20
- G06T11/00
- CPC G09G3/20
- CPC G09G3/2092
- G09G3/32
- G09G3/3275
- CPC G09G3/2096
- G09G5/00
- CPC G09G5/006
- G11C11/406
- G11C11/4076
- CPC G11C11/40615
- G11C16/10
- G11C29/52
- CPC G11C16/08
- G11C16/12
- G11C16/32
- CPC G11C16/12
- G11C29/00
- G11C29/56
- CPC G11C29/76
- H01F27/28
- H03H7/38
- H04B1/04
- CPC H01F27/28
- H01J37/244
- H01J37/32
- H02J50/20
- H02J50/40
- H02J50/90
- CPC H01J37/244
- CPC H01J37/32669
- CPC H01J37/32917
- G01J3/28
- H01L21/66
- CPC H01J37/32972
- H01L21/48
- G03F7/00
- G03F7/20
- H01L23/31
- H01L23/538
- H01L25/00
- CPC H01L21/481
- H01L21/67
- H01L21/673
- H01L33/00
- CPC H01L21/67144
- H01L23/48
- H01L25/18
- H10B80/00
- CPC H01L22/32
- G01R31/28
- H01L23/29
- H01L23/498
- H01L25/065
- CPC H01L23/295
- CPC H01L23/31
- CPC H01L23/3107
- H01L23/367
- H01L21/56
- H01L23/552
- CPC H01L23/3675
- H01L23/522
- H01L23/528
- H01L23/532
- CPC H01L23/49816
- H01L23/13
- H01L23/42
- H01L25/10
- CPC H01L23/49838
- H01L23/525
- G11C17/16
- G11C17/18
- CPC H01L23/5256
- H01L27/092
- H01L29/06
- H01L29/423
- H01L29/775
- H01L29/786
- CPC H01L23/5283
- H10B12/00
- H01L23/535
- H01L21/768
- H10B41/27
- H10B41/35
- H10B41/41
- H10B43/35
- H10B43/40
- CPC H01L23/535
- H01L21/683
- CPC H01L23/5385
- CPC H01L23/5389
- H01L23/544
- CPC H01L23/544
- H01L23/28
- H01L25/16
- CPC H01L23/562
- CPC H01L24/32
- B32B43/00
- H01L21/78
- CPC H01L24/80
- CPC H01L25/0652
- CPC H01L25/0657
- H01L25/075
- CPC H01L25/0753
- H01M10/0585
- H01M4/02
- H01M4/133
- H01M4/36
- H01M4/38
- H01M4/587
- H01M4/66
- H01M10/0525
- H01M10/0562
- H01M10/44
- CPC H01M10/0585
- H01Q1/24
- H01Q1/38
- H04M1/02
- CPC H01Q1/243
- H02J7/00
- CPC H02J7/00032
- H03F1/02
- H03F3/24
- CPC H03F1/0233
- H03F3/45
- CPC H03F3/245
- H03H11/24
- H03F1/12
- H03G3/00
- H03H17/00
- CPC H03H11/24
- H03K3/037
- CPC H03K3/0372
- H03K3/356
- G11C7/06
- CPC H03K3/356113
- H03K3/3562
- H03K3/012
- CPC H03K3/35625
- H03L7/197
- H03L7/097
- H03L7/099
- CPC H03L7/1976
- H03M1/68
- CPC H03M1/687
- H04B1/00
- H05K7/14
- CPC H04B1/0053
- H04B1/3888
- H04B5/26
- H04B5/48
- CPC H04B1/3888
- H04B7/06
- H04B7/0456
- H04W72/044
- CPC H04B7/0626
- CPC H04B7/06952
- H04W52/02
- H04W76/28
- CPC H04B7/06968
- H04B7/155
- H04W28/02
- H04W74/0816
- CPC H04B7/155
- H04B7/185
- H04W48/16
- CPC H04B7/18513
- H04L1/00
- H04L1/20
- CPC H04L1/0002
- CPC H04L1/0009
- H04L25/03
- CPC H04L1/0042
- CPC H04L1/0057
- H04L5/00
- H04W72/23
- CPC H04L5/0048
- H04W72/0446
- CPC H04L5/0055
- H04L25/02
- CPC H04L25/0272
- H04L27/36
- CPC H04L27/36
- H04L45/02
- CPC H04L45/02
- H04M1/03
- CPC H04M1/03
- H04N7/15
- G06T19/20
- CPC H04N7/157
- CPC H04N9/3173
- H04N19/176
- H04N19/159
- H04N19/177
- CPC H04N19/176
- H04N19/423
- H04N19/17
- H04N19/186
- H04N19/625
- H04N19/80
- H04N19/86
- H04N19/91
- CPC H04N19/423
- H04N19/70
- H04N19/124
- H04N19/52
- H04N19/593
- H04N19/60
- CPC H04N19/70
- H04N23/63
- H04N5/262
- H04N23/51
- H04N23/62
- CPC H04N23/632
- H04N23/60
- H04N23/45
- H04N23/667
- H04N23/71
- H04N23/73
- H04N23/81
- CPC H04N23/64
- G02B7/10
- G02B7/36
- G06T5/20
- G06T5/73
- H04N23/611
- CPC H04N23/675
- H04N23/68
- G02B13/00
- G02B13/02
- G02B15/14
- CPC H04N23/687
- H01L27/146
- H04N25/531
- H04N25/532
- CPC H04N23/73
- H04N25/77
- CPC H04N25/77
- H04R1/34
- CPC H04R1/345
- H04R5/04
- H04R3/12
- H04R5/02
- H04S1/00
- H05K5/02
- CPC H04R5/04
- H04W4/021
- CPC H04W4/021
- H04W8/00
- CPC H04W8/005
- H04W8/08
- H04W64/00
- CPC H04W8/08
- H04W12/069
- H04W12/041
- H04W60/00
- CPC H04W12/069
- H04W16/18
- H01Q15/00
- H04W24/08
- CPC H04W16/18
- H04W24/10
- CPC H04W28/0289
- H04W28/06
- H04W28/18
- CPC H04W28/06
- H04W72/21
- CPC H04W48/16
- H04W48/18
- H04W4/90
- H04W8/04
- H04W84/04
- CPC H04W48/18
- H04W48/08
- H04W52/22
- H04W52/36
- CPC H04W52/228
- H04W56/00
- G06F1/12
- CPC H04W56/0045
- H04W68/02
- H04W8/02
- CPC H04W68/02
- CPC H04W72/046
- CPC H04W72/23
- H04W72/00
- H04W72/0453
- H04W72/541
- CPC H04W72/541
- H04W72/563
- H04L1/1829
- H04W72/25
- CPC H04W72/563
- H04W76/15
- H04W76/11
- CPC H04W76/15
- H04W76/18
- CPC H04W76/18
- H04W76/19
- H04W76/20
- CPC H04W76/19
- CPC H04W76/28
- H05B3/82
- H05B3/03
- H05B3/14
- H05B3/40
- CPC H05B3/82
- H05K1/02
- H05K1/11
- H05K1/14
- CPC H05K1/0283
- H05K1/18
- CPC H05K1/181
- F16C11/04
- F16M11/08
- F16M11/22
- F16M13/02
- H05K5/00
- CPC H05K5/0226
- H01R13/62
- H01R13/629
- CPC H05K5/0021
- CPC H10B12/0335
- H01L21/027
- H01L21/311
- CPC H10B12/315
- CPC H10B12/50
- H10B43/10
- H10B51/10
- H10B51/20
- CPC H10B43/27
- H10B41/10
- CPC H10B43/40
- H10B61/00
- B64D47/00
- CPC H10B61/00
- H01G4/30
- H01G4/12
- CPC H01L28/56
- H01L29/78
- H01L29/417
- CPC H01L29/7851
- CPC H01L29/41733
- CPC H01L29/42392
- H01L29/66
- CPC H01L29/7869
- G11C5/06
- CPC H01L29/0638
- CPC H01L29/0673
- CPC H01L29/41766
- H01L21/8234
- H01L21/308
- H01L27/088
- CPC H01L21/823418
- H01L21/8238
- H01L29/08
- CPC H01L21/823814
- H01L21/822
- CPC H01L27/0922
- CPC H01L27/14623