18802281. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Realtek Semiconductor Corp.)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

Realtek Semiconductor Corp.

Inventor(s)

Nai-Jen Hsuan of Hsinchu (TW)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18802281 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

A semiconductor device includes a plurality of leads, a lower die, a plurality of bumps, a plurality of flip-chip solder pads, an upper die, a plurality of metal connecting pillars, and a metal wire bonding layer. Each of the leads has a first end and a second end. The leads include a plurality of first leads, a plurality of second leads, and a plurality of third leads. The first ends of the first leads are defined as a die-bonding region. The lower die is correspondingly disposed on the die-bonding region. The flip-chip solder pads are respectively disposed on the first ends of the first leads. The upper die is disposed on the lower die. The metal connecting pillars respectively stand on the first ends of the second leads. The metal wire bonding layer is disposed between the upper die and the lower die.