18616674. SEMICONDUCTOR DEVICE AND METHODS OF FORMATION (Taiwan Semiconductor Manufacturing Co., Ltd.)
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Sheng-Chau Chen of Tainan City TW
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
This abstract first appeared for US patent application 18616674 titled 'SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
Original Abstract Submitted
A semiconductor device is formed by bonding a first semiconductor die and a second semiconductor die at bonding pads in the first semiconductor die with bonding vias in the second semiconductor die, and by bonding dielectric layers in the first semiconductor die and in the second semiconductor die. Omitting bonding pads from the second semiconductor device, and instead using the bonding vias to bond the first and second semiconductor dies, provides a greater amount of spacing between the bonding vias of the second semiconductor die in that the bonding vias have lesser widths than bonding pads. This enables a greater amount of dielectric material of the dielectric layers of the second semiconductor device to be placed between the bonding vias without (or with minimally) increasing the lateral size of the second semiconductor die.