18734122. CHIP SYSTEM AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
CHIP SYSTEM AND COMMUNICATION DEVICE
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CHIP SYSTEM AND COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18734122 titled 'CHIP SYSTEM AND COMMUNICATION DEVICE
The abstract describes a chip system with a chip package body and an electromagnetic shielding enclosure. The chip package body is connected to a circuit board through a first connection part and includes a package substrate and at least one chip. The electromagnetic shielding enclosure consists of a first shielding structure connected to the package substrate and a second shielding structure. The first shielding structure has a cavity to accommodate the chip, while the second shielding structure is connected to the circuit board or the first shielding structure to form a second cavity.
- The chip system includes a chip package body and an electromagnetic shielding enclosure.
- The chip package body is connected to a circuit board through a first connection part.
- The package body comprises a package substrate and at least one chip.
- The electromagnetic shielding enclosure consists of a first shielding structure and a second shielding structure.
- The first shielding structure is connected to the package substrate and has a cavity to accommodate the chip.
- The second shielding structure is connected to the circuit board or the first shielding structure to form a second cavity.
Potential Applications: - Electronic devices requiring electromagnetic shielding. - High-frequency communication systems. - Medical devices sensitive to electromagnetic interference.
Problems Solved: - Protection of sensitive electronic components from electromagnetic interference. - Ensuring reliable performance of electronic devices in high-frequency environments.
Benefits: - Enhanced reliability of electronic devices. - Improved performance in high-frequency communication systems. - Protection of sensitive medical equipment from electromagnetic interference.
Commercial Applications: Title: "Electromagnetic Shielding Chip System for Enhanced Device Reliability" This technology can be utilized in the manufacturing of various electronic devices such as smartphones, tablets, and medical equipment to ensure reliable performance in high-frequency environments. The market implications include improved product quality and increased customer satisfaction.
Questions about the technology: 1. How does the electromagnetic shielding enclosure protect electronic components from interference? - The shielding enclosure blocks external electromagnetic fields from affecting the performance of the electronic components. 2. What are the potential challenges in implementing this chip system in different electronic devices? - The main challenge could be the integration of the shielding enclosure without compromising the overall design and functionality of the device.
Original Abstract Submitted
A chip system includes a chip package body and an electromagnetic shielding enclosure. The chip package body is electrically connected to a circuit board through a first connection part. The chip package body includes a package substrate and at least one chip that are electrically connected. The electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. The first shielding structure is connected to the package substrate. A first cavity included in the first shielding structure is configured to accommodate at least one chip. A first end of the second shielding structure is connected to the circuit board or a solder pad of the circuit board; or a second end of the second shielding structure is connected to the first shielding structure to form a second cavity.