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Category:INTEL CORPORATION
Pages in category "INTEL CORPORATION"
The following 155 pages are in this category, out of 155 total.
1
- 18374179. TECHNIQUES FOR USE OF MIXED WORD SIZE MULTIPLICATION FOR FULLY HOMOMORPHIC ENCRYPTION RELINEARIZATION (INTEL CORPORATION)
- 18374198. METHOD AND APPARATUS TO DETECT COMPUTING SYSTEM HARDWARE DEFECTS USING A PORTABLE STORAGE DEVICE (INTEL CORPORATION)
- 18374515. SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374516. SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (INTEL CORPORATION)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION)
- 18374522. BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374528. BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH MATERIALS FOR ROBUST CONNECTIVITY (INTEL CORPORATION)
- 18374530. CROSS-LINKED HYDROPHOBIC COATING WITH PLASMA RESISTANCE FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374532. CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374573. IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (INTEL CORPORATION)
- 18374574. TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE (INTEL CORPORATION)
- 18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION)
- 18374578. IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT (INTEL CORPORATION)
- 18374592. MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS. (INTEL CORPORATION)
- 18374599. TRENCH CONTACT STRUCTURE WITH AIRGAP SPACER (INTEL CORPORATION)
- 18374600. TRENCH CONTACT STRUCTURE WITH ETCH-STOP LAYER (INTEL CORPORATION)
- 18374603. SELECTIVE DIELECTRIC GROWTH FOR DIRECTING CONTACT TO GATE OR CONTACT TO TRENCH CONTACT (INTEL CORPORATION)
- 18374607. MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING (INTEL CORPORATION)
- 18374608. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING SPLIT SOURCE OR DRAIN APPROACHES (INTEL CORPORATION)
- 18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)
- 18374611. INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET WITHOUT TSV (INTEL CORPORATION)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18374618. ANNEALED SHAPE MEMORY ALLOY ON A SUBSTRATE (INTEL CORPORATION)
- 18374683. Micro-Ring Resonator Strain Sensors for In-Situ Stress Monitoring (INTEL CORPORATION)
- 18374696. WIDEBAND CHANNEL SELECTIVE AMPLIFIER STRUCTURES (INTEL CORPORATION)
- 18374758. BARRIER LAYERS FOR INTERCONNECTS (INTEL CORPORATION)
- 18374920. DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS (INTEL CORPORATION)
- 18374929. NBTI REDUCTION AND RELIABILITY IMPROVEMENT FOR SELECTIVE LAYOUTS (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18374943. DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER (INTEL CORPORATION)
- 18374948. THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY (INTEL CORPORATION)
- 18374954. VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE (INTEL CORPORATION)
- 18374967. TUNABLE MULTI-PHASE RESONANT CLOCK GENERATION AND DISTRIBUTION (INTEL CORPORATION)
- 18375031. SWITCHABLE UNDERLAYERS FOR EUV LITHOGRAPHY (INTEL CORPORATION)
- 18375051. TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE (INTEL CORPORATION)
- 18375055. TRANSISTOR COMPRISING A COMPOSITE GATE DIELECTRIC STRUCTURE AND METHOD TO PROVIDE SAME (INTEL CORPORATION)
- 18375060. METHOD OF FABRICATING A 2D CHANNEL TRANSISTOR BY EMPLOYING SELECTIVE METALLIZATION TO FORM A SOURCE OR DRAIN STRUCTURE (INTEL CORPORATION)
- 18375064. INTEGRATED CIRCUIT STRUCTURES WITH INTERNAL SPACERS FOR 2D CHANNEL MATERIALS (INTEL CORPORATION)
- 18375069. DEVICE, METHOD AND SYSTEM FOR COMMUNICATING BETWEEN NETWORKED AGENTS VIA A CREDIT MANAGEMENT BUS (INTEL CORPORATION)
- 18375077. INTEGRATED CIRCUIT STRUCTURES HAVING REGISTRATION MARKS FOR DUAL-SIDED DEVICES (INTEL CORPORATION)
- 18375082. INTEGRATED CIRCUIT STRUCTURES HAVING FIN CUTS (INTEL CORPORATION)
- 18375084. INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING (INTEL CORPORATION)
- 18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)
- 18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375248. IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY (INTEL CORPORATION)
- 18375287. CONTROLLED RECESS OF DUMMY GATE TO TARGET ACTIVE TRANSISTOR PORTION (INTEL CORPORATION)
- 18375306. MAGNETIC AND ELECTRIC STRUCTURES IN TECHNOLOGIES WITH THROUGH-SILICON VIAS AND FRONT- AND BACK-END METAL LAYERS (INTEL CORPORATION)
- 18375314. MULTI-THRESHOLD SCHEME USING DUAL DIPOLE PATTERNING IN COMPLEMENTARY TRANSISTOR DIELECTRICS (INTEL CORPORATION)
- 18375317. MULTI-SCHEME HASH-BASED DIGITAL SIGNATURE VERIFICATION PROCESSORS, METHODS, AND SYSTEMS (INTEL CORPORATION)
- 18375320. EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE (INTEL CORPORATION)
- 18375327. SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY FOR ADVANCED TECHNOLOGIES (INTEL CORPORATION)
- 18375337. FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PACKAGES (INTEL CORPORATION)
- 18375348. BIDIRECTIONAL LINK WITH HYBRID SUPPRESSION CIRCUIT (INTEL CORPORATION)
- 18375349. GENERATING SYNTHESIZABLE REGISTER TRANSFER LEVEL DESIGNS (INTEL CORPORATION)
- 18375421. ON-DIE KEY GENERATOR FOR FULLY-HOMOMORPHIC ENCRYPTION RELINEARIZATION PUBLIC KEYS (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18375486. OFFLOADING FUNCTION STREAMS (INTEL CORPORATION)
- 18395390. CIRCUITRY AND METHODS FOR ENHANCED SELECTION OF PERFORMANCE MONITORING (INTEL CORPORATION)
- 18476347. TOKENIZED VOXELS FOR REPRESENTING A WORKSPACE USING MULTI-LEVEL NETS (INTEL CORPORATION)
- 18476561. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES (INTEL CORPORATION)
- 18476624. STACKED TRANSISTORS WITH STRAIN MATERIALS ON SOURCE AND DRAIN (INTEL CORPORATION)
- 18477098. TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE (INTEL CORPORATION)
- 18477207. DYNAMIC CACHE FILL PRIORIZATION (INTEL CORPORATION)
- 18477335. CIRCUITRY AND METHODS FOR EFFICIENT REPLAY PROTECTION OF COMPUTER MEMORY (INTEL CORPORATION)
- 18477360. METHODS, SYSTEMS, ARTICLES OF MANUFACTURE, AND APPARATUS FOR IMPROVED THERMAL TESTS OF INTEGRATED CIRCUIT DEVICES (INTEL CORPORATION)
- 18477414. METHODS FOR DOPING 2D TRANSISTOR DEVICES AND RESULTING ARCHITECTURES (INTEL CORPORATION)
- 18477568. OMNI-DIRECTIONAL, MINIATURIZED ANTENNA SYSTEM (INTEL CORPORATION)
- 18477636. APPARATUS AND METHOD FOR A DEFORMABLE EMI SHIELDING STRUCTURE (INTEL CORPORATION)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18477790. SUPPORTING 8-BIT FLOATING POINT FORMAT FOR PARALLEL COMPUTING AND STOCHASTIC ROUNDING OPERATIONS IN A GRAPHICS ARCHITECTURE (INTEL CORPORATION)
- 18477813. HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS (INTEL CORPORATION)
- 18477836. TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE (INTEL CORPORATION)
- 18477838. VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION (INTEL CORPORATION)
- 18477865. CONVERSION OPERATIONS AND SPECIAL VALUE USE CASES SUPPORTING 8-BIT FLOATING POINT FORMAT IN A GRAPHICS ARCHITECTURE (INTEL CORPORATION)
- 18477906. BACKSIDE POWER GATING (INTEL CORPORATION)
- 18477947. METAL GATE CUT WITH REDUCED OXIDATION AND PARASITIC CAPACITANCE (INTEL CORPORATION)
- 18477966. SELF-DIFFUSING LIQUID METAL INTERCONNECT ARCHITECTURES ENABLING SNAP-ON ROOM TEMPERATURE ASSEMBLY (INTEL CORPORATION)
- 18478077. POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE (INTEL CORPORATION)
- 18478165. NEURAL INDIRECT ILLUMINATION WITH LIGHT METADATA ENCODING FOR DYNAMIC LIGHTING ENVIRONMENTS (INTEL CORPORATION)
- 18478222. BRIDGES OVER METAL VOIDS IN INTEGRATED CIRCUIT PACKAGES (INTEL CORPORATION)
- 18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
- 18478391. ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (INTEL CORPORATION)
- 18478499. METHODS AND APPARATUS TO QUANTIFY EFFECTIVENESS OF CLOCK GATING IMPLEMENTATIONS IN ELECTRONIC DESIGN AUTOMATION (INTEL CORPORATION)
- 18478529. METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRATED CIRCUIT PACKAGES (INTEL CORPORATION)
- 18478537. Simultaneous Configuration of Programmable Logic Fabric and Disaggregated Dies (INTEL CORPORATION)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
- 18478545. STACKED NANOWIRE TRANSISTOR STRUCTURES WITH ISOLATION REGIONS BOUND BY GATE CUTS (INTEL CORPORATION)
- 18478607. ARCHITECTURES AND METHODS FOR ATTACHING PHOTONIC INTEGRATED CIRCUITS (PICs) TO OPTICAL CONNECTORS (INTEL CORPORATION)
- 18478626. DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING DIFFUSION BONDING LAYERS (INTEL CORPORATION)
- 18478686. SELECTIVE LAYER TRANSFER WITH GLASS PANELS (INTEL CORPORATION)
- 18478691. TRANSITION METAL DICHALCOGENIDE MONOLAYER TRANSFER USING LOW STRAIN TRANSFER PROTECTIVE LAYER (INTEL CORPORATION)
- 18478727. TECHNIQUES TO ENABLE SMART BATTERY CHARGING (INTEL CORPORATION)
- 18478770. PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (INTEL CORPORATION)
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION)
- 18478840. CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE (INTEL CORPORATION)
- 18478843. SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (INTEL CORPORATION)
- 18478855. DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TECHNOLOGY (INTEL CORPORATION)
- 18478871. OPTICAL CO-PACKAGING ON A GLASS SUBSTRATE WITH 3D DIE-STACKING (INTEL CORPORATION)
- 18478875. PARTITIONED HOME SNOOP FILTER (INTEL CORPORATION)
- 18478923. FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS, AND PASSIVES (INTEL CORPORATION)
- 18478932. FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES (INTEL CORPORATION)
- 18478937. FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES (INTEL CORPORATION)
- 18478950. DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING (INTEL CORPORATION)
- 18478963. REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER (INTEL CORPORATION)
- 18478967. TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD (INTEL CORPORATION)
- 18479004. OPTICAL CONNECTOR FERRULE (INTEL CORPORATION)
- 18479011. RADAR APPARATUS, SYSTEM, AND METHOD (INTEL CORPORATION)
- 18479012. TECHNOLOGIES FOR AN OPTICAL INTERPOSER WITH ACTUATOR BEAMS (INTEL CORPORATION)
- 18479015. TECHNOLOGIES FOR DIAMOND COMPOSITE MATERIALS MANUFACTURED VIA FIELD-ASSISTED SINTERING TECHNOLOGY (INTEL CORPORATION)
- 18479027. INSTRUCTION BLOCK BASED PERFORMANCE MONITORING (INTEL CORPORATION)
- 18513045. TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD (INTEL CORPORATION)
- 18727194. EIGHT PORT UPLINK TRANSMISSION ENHANCEMENTS (INTEL CORPORATION)
- 18817279. SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA (INTEL CORPORATION)
- 18817284. METHODS AND DEVICES TO PERFORM SPECTRUM SENSING (INTEL CORPORATION)
- 18818652. Transmitter and method to generate a transmit signal (INTEL CORPORATION)
- 18827415. PROCESSOR HAVING MULTIPLE CORES, SHARED CORE EXTENSION LOGIC, AND SHARED CORE EXTENSION UTILIZATION INSTRUCTIONS (INTEL CORPORATION)
- 18893499. POOLED MEMORY ADDRESS TRANSLATION (INTEL CORPORATION)
- 18915640. SPECULATIVE EXECUTION OF HIT AND INTERSECTION SHADERS ON PROGRAMMABLE RAY TRACING ARCHITECTURES (INTEL CORPORATION)
- 18976320. METHOD AND APPARATUS FOR DISTRIBUTED AND COOPERATIVE COMPUTATION IN ARTIFICIAL NEURAL NETWORKS (INTEL CORPORATION)
- 18977434. MULTI-ENTITY RESOURCE, SECURITY, AND SERVICE MANAGEMENT IN EDGE COMPUTING DEPLOYMENTS (INTEL CORPORATION)
- 18978180. HARDWARE ACCELERATION OF DICTIONARY COMPRESSION (INTEL CORPORATION)
- 18978334. SECURING AUDIO COMMUNICATIONS (INTEL CORPORATION)
- 18978437. MULTI-SCALE NEURAL NETWORK FOR ANOMALY DETECTION (INTEL CORPORATION)
- 18978616. FINS FOR METAL OXIDE SEMICONDUCTOR DEVICE STRUCTURES (INTEL CORPORATION)
- 18979047. METHODS AND APPARATUS TO SECURELY PERFORM CONFIGURATION UPDATES (INTEL CORPORATION)
- 18979203. FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES (INTEL CORPORATION)
- 18979229. METHODS AND APPARATUS TO REDUCE MEMORY POWER CONSUMPTION (INTEL CORPORATION)
- 18979399. TECHNOLOGIES TO STORE COMPRESSED DATA (INTEL CORPORATION)
- 18980295. SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE (INTEL CORPORATION)
- 18980411. SEMICONDUCTOR PACKAGE CARRIER, AND A CORRESPONDING SYSTEM AND METHOD OF USE (INTEL CORPORATION)
- 18980933. CONGESTION DETECTION IN INTERCONNECTION NETWORKS (INTEL CORPORATION)
- 18980999. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NANOWIRES WITH TIGHT VERTICAL SPACING (INTEL CORPORATION)
- 18981500. MULTI-FIBER CABLE CONNECTIVITY (INTEL CORPORATION)
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- INTEL CORPORATION (20250112756). SECURING AUDIO COMMUNICATIONS
- INTEL CORPORATION (20250112825). MULTI-ENTITY RESOURCE, SECURITY, AND SERVICE MANAGEMENT IN EDGE COMPUTING DEPLOYMENTS
- INTEL CORPORATION Patent Application Trends in 2025
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- IoT/Sensors patent applications on February 8th, 2024
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