18478770. PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (INTEL CORPORATION)
PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
Organization Name
Inventor(s)
Andrey Vyatskikh of Hillsboro OR US
Tushar Kanti Talukdar of Wilsonville OR US
Thomas L. Sounart of Chandler AZ US
Jeffery D. Bielefeld of Forest Grove OR US
Grant M. Kloster of Lake Oswego OR US
Carlos Bedoya Arroyave of Portland OR US
Golsa Naderi of Portland OR US
Adel Elsherbini of Chandler AZ US
PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
This abstract first appeared for US patent application 18478770 titled 'PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
Original Abstract Submitted
An embodiment discloses a method comprising receiving a substrate comprising a first layer, a second layer over the first layer, and a third layer over the second layer, the third layer comprising a plurality of integrated circuit (IC) components, and applying a laser to ablate portions of the first layer, wherein the second layer protects the third layer from cracking during application of the laser.
- INTEL CORPORATION
- Andrey Vyatskikh of Hillsboro OR US
- Feras Eid of Chandler AZ US
- Tushar Kanti Talukdar of Wilsonville OR US
- Kimin Jun of Portland OR US
- Thomas L. Sounart of Chandler AZ US
- Jeffery D. Bielefeld of Forest Grove OR US
- Grant M. Kloster of Lake Oswego OR US
- Carlos Bedoya Arroyave of Portland OR US
- Golsa Naderi of Portland OR US
- Adel Elsherbini of Chandler AZ US
- B23K26/40
- B23K26/53
- B23K101/40
- B23K103/00
- CPC B23K26/40
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