18817279. SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA (INTEL CORPORATION)
SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA
Organization Name
Inventor(s)
Tae Young Yang of Portland OR US
Shuhei Yamada of Vancouver WA US
Tolga Acikalin of San Jose CA US
Kenneth Foust of Beaverton OR US
Bryce Horine of Portland OR US
SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA
This abstract first appeared for US patent application 18817279 titled 'SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA
Original Abstract Submitted
The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.
Categories:
- INTEL CORPORATION
- Zhen Zhou of Chandler AZ US
- Tae Young Yang of Portland OR US
- Shuhei Yamada of Vancouver WA US
- Tolga Acikalin of San Jose CA US
- Renzhi Liu of Portland OR US
- Kenneth Foust of Beaverton OR US
- Bryce Horine of Portland OR US
- H01Q1/22
- H01L23/31
- H01L23/538
- H01L25/00
- H01L25/065
- H01Q1/48
- H01Q5/40
- H01Q9/04
- CPC H01Q1/2283