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18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)

From WikiPatents

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

Organization Name

INTEL CORPORATION

Inventor(s)

Brandon C. Marin of Gilbert AZ US

Jesse C. Jones of Chandler AZ US

Yosef Kornbluth of Phoenix AZ US

Mitchell Page of Mesa AZ US

Soham Agarwal of Chandler AZ US

Fanyi Zhu of Gilbert AZ US

Shuren Qu of Gilbert AZ US

Hanyu Song of Chandler AZ US

Srinivas V. Pietambaram of Chandler AZ US

Yonggang Li of Chandler AZ US

Bai Nie of Chandler AZ US

Nicholas Haehn of Scottsdale AZ US

Astitva Tripathi of Mesa AZ US

Mohamed R. Saber of College Station TX US

Sheng Li of Gilbert AZ US

Pratyush Mishra of Tempe AZ US

Benjamin T. Duong of Phoenix AZ US

Kari Hernandez of Phoenix AZ US

Praveen Sreeramagiri of Gilbert AZ US

Yi Li of Chandler AZ US

Ibrahim El Khatib of Chandler AZ US

Whitney Bryks of Tempe AZ US

Mahdi Mohammadighaleni of Phoenix AZ US

Joshua Stacey of Chandler AZ US

Travis Palmer of San Diego CA US

Gang Duan of Chandler AZ US

Jeremy Ecton of Gilbert AZ US

Suddhasattwa Nad of Chandler AZ US

Haobo Chen of Chandler AZ US

Robin Shea Mcree of Chandler AZ US

Mohammad Mamunur Rahman of Gilbert AZ US

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

This abstract first appeared for US patent application 18477638 titled 'MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

Original Abstract Submitted

Various techniques for edge stress reduction in glass cores and related devices and methods are disclosed. In one example, a microelectronic assembly includes a glass core having a bottom surface, a top surface opposite the bottom surface, and one or more sidewalls extending between the bottom surface and the top surface, and further includes a panel of an organic material, wherein the glass core is embedded within the panel. In another example, a microelectronic assembly includes a glass core as in the first example, where an angle between a portion of an individual sidewall and one of the bottom surface or the top surface is greater than 90 degrees. In yet another example, a microelectronic assembly includes a glass core as in the first example, and further includes a pattern of a material on one of the one or more sidewalls.

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