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18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)

From WikiPatents

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

Organization Name

INTEL CORPORATION

Inventor(s)

Rahul Bhure of Mesa AZ US

Mitchell Page of Mesa AZ US

Joseph Peoples of Gilbert AZ US

Jieying Kong of Chandler AZ US

Nicholas S. Haehn of Scottsdale AZ US

Astitva Tripathi of Mesa AZ US

Bainye Francoise Angoua of Phoenix AZ US

Yosef Kornbluth of Phoenix AZ US

Daniel Rosales-yeomans of Gilbert AZ US

Joshua Stacey of Chandler AZ US

Aaditya Anand Candadai of Chandler AZ US

Yonggang Yong Li of Chandler AZ US

Tchefor Ndukum of Chandler AZ US

Scott Coatney of Chandler AZ US

Gang Duan of Chandler AZ US

Jesse Jones of Chandler AZ US

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US

Dilan Seneviratne of Phoenix AZ US

Matthew Anderson of Chandler AZ US

STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

This abstract first appeared for US patent application 18374609 titled 'STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES

Original Abstract Submitted

Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.

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