18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
Organization Name
Inventor(s)
Pratyush Mishra of Tempe AZ US
Pratyasha Mohapatra of Hillsboro OR US
Srinivas Pietambaram of Chandler AZ US
Mahdi Mohammadighaleni of Phoenix AZ US
Joshua Stacey of Chandler AZ US
Travis Palmer of San Diego CA US
Yosef Kornbluth of Phoenix AZ US
Astitva Tripathi of Mesa AZ US
Rengarajan Shanmugam of Tempe AZ US
Darko Grujicic of Chandler AZ US
Jieying Kong of Chandler AZ US
Nicholas Haehn of Scottsdale AZ US
Jacob Vehonsky of Chandler AZ US
Vincent Obiozo Eze of Chandler AZ US
Daniel Wandera of Chandler AZ US
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
This abstract first appeared for US patent application 18375203 titled 'THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
Original Abstract Submitted
An IC die package includes a substrate comprising glass and a plurality of holes extending through the glass. A via metallization is present within the holes. A liner is between the via metallization and the glass. The liner can comprise a beta-titanium alloy layer, polymer hydrogel layer and an MXene seed layer, an organic material layer and a metal layer, or an organic material layer between first and second metal layers. A polymer layer may be formed by electrodeposition of charged nanoparticles.
- INTEL CORPORATION
- Pratyush Mishra of Tempe AZ US
- Pratyasha Mohapatra of Hillsboro OR US
- Srinivas Pietambaram of Chandler AZ US
- Whitney Bryks of Tempe AZ US
- Mahdi Mohammadighaleni of Phoenix AZ US
- Joshua Stacey of Chandler AZ US
- Travis Palmer of San Diego CA US
- Yosef Kornbluth of Phoenix AZ US
- Kuang Liu of Quen Creek AZ US
- Astitva Tripathi of Mesa AZ US
- Yuqin Li of Chandler AZ US
- Rengarajan Shanmugam of Tempe AZ US
- Xing Sun of Chandler AZ US
- Brian Balch of Chandler AZ US
- Darko Grujicic of Chandler AZ US
- Jieying Kong of Chandler AZ US
- Nicholas Haehn of Scottsdale AZ US
- Jacob Vehonsky of Chandler AZ US
- Mitchell Page of Mesa AZ US
- Vincent Obiozo Eze of Chandler AZ US
- Daniel Wandera of Chandler AZ US
- Sameer Paital of Mesa AZ US
- Gang Duan of Chandler AZ US
- H01L23/538
- H01L21/48
- H01L23/15
- H01L25/065
- CPC H01L23/5384
