18374920. DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS (INTEL CORPORATION)
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
Organization Name
Inventor(s)
Thomas Wagner of Regelsbach DE
Pouya Talebbeydokhti of Mesa AZ US
Stephan Stoeckl of Schwandorf DE
Lizabeth Keser of San Diego CA US
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
This abstract first appeared for US patent application 18374920 titled 'DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
Original Abstract Submitted
A semiconductor package comprises an interposer with at least one open area through the interposer. A first die is connected to a first side of the interposer. A second die is connected to a second side of the interposer. At least one metal pillar is connected to the first die that extends through the open area of the interposer and connects to the second die to provide a direct die-to-die connection through the interposer.