18374758. BARRIER LAYERS FOR INTERCONNECTS (INTEL CORPORATION)
BARRIER LAYERS FOR INTERCONNECTS
Organization Name
Inventor(s)
Gowtham Sriram Jawaharram of Hillsboro OR US
BARRIER LAYERS FOR INTERCONNECTS
This abstract first appeared for US patent application 18374758 titled 'BARRIER LAYERS FOR INTERCONNECTS
Original Abstract Submitted
Barrier layers comprised of alloys of vanadium in tantalum are provided. The barrier layers are useful for conducting interconnects, such as copper interconnects, for semiconductor devices. Interconnects can be in dielectric layers which can be back-end metallization layers.