18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
Organization Name
Inventor(s)
Hiroki Tanaka of Gilbert AZ US
Benjamin Duong of Phoenix AZ US
Brandon Marin of Gilbert AZ US
Srinivas Pietambaram of Chandler AZ US
Suddhasattwa Nad of Chandler AZ US
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
This abstract first appeared for US patent application 18375209 titled 'DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
Original Abstract Submitted
An IC die package includes first and second IC die on a first surface of a glass layer, a bridge under the first and second IC die within an opening in the glass layer, and first and second package conductive features on a second surface of the glass layer opposite the first side. First interconnects comprising solder couple the bridge with the first and second IC die. Second interconnects excluding solder couple the first and second IC die with vias extending through the glass layer to the first package conductive features. Third interconnects excluding solder couple the bridge with the second package conductive features. The bridge couples the first and second IC die with each other, and the first and second IC die with the second package conductive features. A pitch of conductive features in the first interconnects is less than a pitch of conductive features in the second interconnects.
- INTEL CORPORATION
- Robert May of Chandler AZ US
- Hiroki Tanaka of Gilbert AZ US
- Tarek Ibrahim of Mesa AZ US
- Lilia May of Chandler AZ US
- Jason Gamba of Gilbert AZ US
- Benjamin Duong of Phoenix AZ US
- Brandon Marin of Gilbert AZ US
- Srinivas Pietambaram of Chandler AZ US
- Gang Duan of Chandler AZ US
- Suddhasattwa Nad of Chandler AZ US
- Jeremy Ecton of Gilbert AZ US
- H01L23/29
- H01L23/00
- H01L23/31
- H01L25/00
- H01L25/065
- CPC H01L23/291