18477813. HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS (INTEL CORPORATION)
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
Organization Name
Inventor(s)
Omkar G. Karhade of Chandler AZ US
Nitin A. Deshpande of Chandler AZ US
Gwang-Soo Kim of Portland OR US
Harini Kilambi of Portland OR US
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
This abstract first appeared for US patent application 18477813 titled 'HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
Original Abstract Submitted
Alignment markers are created on a carrier wafer prior to attachment of integrated circuit dies to the carrier wafer. The alignment markers can be used in aligning integrated circuit dies to the carrier wafer during attachment of the integrated circuit dies to the carrier wafer. A reconstituted wafer can be created from the integrated circuit dies attached to the carrier wafer and the alignment markers are part of the reconstituted wafer. The alignment markers can further be used to align a wafer bonding layer to the reconstituted wafer. The wafer bonding layer can be used in attaching the reconstituted wafer to an interposer, another wafer, or another microelectronic structure. The alignment markers are located outside an outer lateral boundary of the integrated circuit dies (such as between integrated circuit dies) and are not connected to any metal lines in the integrated circuit dies in the reconstituted wafer.