18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION)
SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
Organization Name
Inventor(s)
Brandon M. Rawlings of Chandler AZ US
Adel Elsherbini of Chandler AZ US
Thomas L. Sounart of Chandler AZ US
Tushar Kanti Talukdar of Wilsonville OR US
Johanna Swan of Scottsdale AZ US
Richard F. Vreeland of Beaverton OR US
SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
This abstract first appeared for US patent application 18478831 titled 'SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS
Original Abstract Submitted
In one embodiment, a selective layer transfer process includes forming a layer of integrated circuit (IC) components on a first substrate, forming first bonding structures on a second substrate, and partially bonding the first substrate to the second substrate, which includes bonding a first subset of IC components on the first substrate to respective bonding structures on the second substrate. The process also includes forming second bonding structures on a third substrate, where the second bonding structures are arranged in a layout that is offset from the layout of the second substrate. The process further includes partially bonding the first substrate to the third substrate, which includes bonding a second subset of IC components on the first substrate to respective bonding structures on the third substrate.
- INTEL CORPORATION
- Brandon M. Rawlings of Chandler AZ US
- Adel Elsherbini of Chandler AZ US
- Thomas L. Sounart of Chandler AZ US
- Feras Eid of Chandler AZ US
- Tushar Kanti Talukdar of Wilsonville OR US
- Kimin Jun of Portland OR US
- Johanna Swan of Scottsdale AZ US
- Richard F. Vreeland of Beaverton OR US
- H01L25/00
- H01L21/683
- H01L25/075
- CPC H01L25/50