18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION)
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
Organization Name
Inventor(s)
Adel Elsherbini of Chandler AZ US
Thomas Sounart of Chandler AZ US
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
This abstract first appeared for US patent application 18374577 titled 'PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
Original Abstract Submitted
A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.