18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
Organization Name
Inventor(s)
Kyle Arrington of Gilbert AZ US
Ryan Carrazzone of Chandler AZ US
Hongxia Feng of Chandler AZ US
Srinivas Pietambaram of Chandler AZ US
Seyyed Yahya Mousavi of Chandler AZ US
Brandon C. Marin of Gilbert AZ US
Xiaoying Guo of Chandler AZ US
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
This abstract first appeared for US patent application 18375244 titled 'APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
Original Abstract Submitted
An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.
- INTEL CORPORATION
- Bohan Shan of Chandler AZ US
- Ziyin Lin of Chandler AZ US
- Haobo Chen of Chandler AZ US
- Yiqun Bai of Chandler AZ US
- Kyle Arrington of Gilbert AZ US
- Jose Waimin of Gilbert AZ US
- Ryan Carrazzone of Chandler AZ US
- Hongxia Feng of Chandler AZ US
- Dingying Xu of Chandler AZ US
- Srinivas Pietambaram of Chandler AZ US
- Minglu Liu of Chandler AZ US
- Seyyed Yahya Mousavi of Chandler AZ US
- Xinyu Li of Chandler AZ US
- Gang Duan of Chandler AZ US
- Wei Li of Chandler AZ US
- Bin Mu of Tempe AZ US
- Mohit Gupta of Chandler AZ US
- Jeremy Ecton of Gilbert AZ US
- Brandon C. Marin of Gilbert AZ US
- Xiaoying Guo of Chandler AZ US
- Ashay Dani of Chandler AZ US
- H01L21/762
- H01L21/768
- H01L23/00
- H01L23/498
- H01L23/538
- H01L25/065
- CPC H01L21/76224
