18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
Organization Name
Inventor(s)
Brandon Marin of Gilbert AZ US
Hiroki Tanaka of Gilbert AZ US
Srinivas Pietambaram of Chandler AZ US
Suddhasattwa Nad of Chandler AZ US
Numair Ahmed of Chandler AZ US
Benjamin Taylor Duong of Phoenix AZ US
Shruti Sharma of Chandler AZ US
Mollie Stewart of Lake Oswego OR US
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
This abstract first appeared for US patent application 18478250 titled 'ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
Original Abstract Submitted
Anisotropic conductive connections for interconnect bridges and related methods are disclosed herein. An example a package substrate for an integrated circuit package, the package substrate comprising a first pad disposed at a first end of an interconnect within the package substrate, the first pad disposed in a cavity in the package substrate, an interconnect bridge disposed in the cavity, the interconnect bridge including a second pad, and a third pad, and a layer disposed between the first pad and the second pad, the layer having a first conductivity between the first pad and the second pad, the layer having a second conductivity between the second pad and the third pad, the first conductivity greater than the second conductivity.
- INTEL CORPORATION
- Brandon Marin of Gilbert AZ US
- Hiroki Tanaka of Gilbert AZ US
- Robert May of Chandler AZ US
- Srinivas Pietambaram of Chandler AZ US
- Gang Duan of Chandler AZ US
- Suddhasattwa Nad of Chandler AZ US
- Numair Ahmed of Chandler AZ US
- Jeremy Ecton of Gilbert AZ US
- Benjamin Taylor Duong of Phoenix AZ US
- Bai Nie of Chandler AZ US
- Haobo Chen of Chandler AZ US
- Xiao Liu of Chandler AZ US
- Bohan Shan of Chandler AZ US
- Shruti Sharma of Chandler AZ US
- Mollie Stewart of Lake Oswego OR US
- H01L23/538
- H01L21/48
- H01L23/00
- CPC H01L23/5385
