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18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)

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GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

Organization Name

INTEL CORPORATION

Inventor(s)

Bohan Shan of Chandler AZ US

Jesse Jones of Chandler AZ US

Zhixin Xie of Chandler AZ US

Bai Nie of Chandler AZ US

Shaojiang Chen of Chandler AZ US

Joshua Stacey of Chandler AZ US

Mitchell Page of Mesa AZ US

Brandon C. Marin of Gilbert AZ US

Jeremy D. Ecton of Gilbert AZ US

Nicholas S. Haehn of Scottsdale AZ US

Astitva Tripathi of Mesa AZ US

Yuqin Li of Chandler AZ US

Edvin Cetegen of Chandler AZ US

Jason M. Gamba of Gilbert AZ US

Jacob Vehonsky of Chandler AZ US

Jianyong Mo of Chandler AZ US

Makoyi Watson of Phoenix AZ US

Shripad Gokhale of Gilbert AZ US

Mine Kaya of Scottsdale AZ US

Kartik Srinivasan of Gilbert AZ US

Haobo Chen of Chandler AZ US

Ziyin Lin of Chandler AZ US

Kyle Arrington of Gilbert AZ US

Jose Waimin of Gilbert AZ US

Ryan Carrazzone of Chandler AZ US

Hongxia Feng of Chandler AZ US

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US

Gang Duan of Chandler AZ US

Dingying David Xu of Chandler AZ US

Hiroki Tanaka of Gilbert AZ US

Ashay Dani of Chandler AZ US

Praveen Sreeramagiri of Gilbert AZ US

Yi Li of Chandler AZ US

Ibrahim El Khatib of Chandler AZ US

Aaron Garelick of Chandler AZ US

Robin Mcree of Chandler AZ US

Hassan Ajami of Chandler AZ US

Yekan Wang of Chandler AZ US

Andrew Jimenez of Mesa AZ US

Jung Kyu Han of Chandler AZ US

Hanyu Song of Chandler AZ US

Yonggang Yong Li of Chandler AZ US

Mahdi Mohammadighaleni of Phoenix AZ US

Whitney Bryks of Tempe AZ US

Shuqi Lai of Phoenix AZ US

Jieying Kong of Chandler AZ US

Thomas Heaton of Gilbert AZ US

Dilan Seneviratne of Phoenix AZ US

Yiqun Bai of Chandler AZ US

Bin Mu of Tempe AZ US

Mohit Gupta of Chandler AZ US

Xiaoying Guo of Chandler AZ US

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

This abstract first appeared for US patent application 18374937 titled 'GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

Original Abstract Submitted

Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.

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