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Category:H01L21/324
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This category has the following 43 subcategories, out of 43 total.
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Pages in category "H01L21/324"
The following 113 pages are in this category, out of 113 total.
1
- 17459043. Systems, Methods, and Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18040669. THERMAL TREATMENT APPARATUS, THERMAL TREATMENT METHOD, AND STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18100302. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18131321. Atmospheric Pressure Plasma for Substrate Annealing simplified abstract (Applied Materials, Inc.)
- 18151412. METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18177210. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18201251. METHOD OF FORMING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18237669. SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 18367321. MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS (Applied Materials, Inc.)
- 18418757. SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18420777. SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME simplified abstract (SK hynix Inc.)
- 18433867. SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18437058. METHODS, SYSTEMS, AND APPARATUS FOR CONDUCTING A RADICAL TREATMENT OPERATION PRIOR TO CONDUCTING AN ANNEALING OPERATION simplified abstract (Applied Materials, Inc.)
- 18508788. MELT ANNEAL SOURCE AND DRAIN REGIONS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18526317. FinFET Device and Method of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18531359. ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract (Intel Corporation)
- 18543769. REDUCED ESR IN TRENCH CAPACITOR simplified abstract (Texas Instruments Incorporated)
- 18545082. SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18589254. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18589845. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18594219. SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE (KABUSHIKI KAISHA TOSHIBA)
- 18597813. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18600197. GRAPHENE BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18608005. SELECTIVE COBALT DEPOSITION ON COPPER SURFACES simplified abstract (Applied Materials, Inc.)
- 18620327. METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE simplified abstract (Infineon Technologies AG)
- 18626475. HEAT TREATMENT DEVICE AND TREATMENT METHOD simplified abstract (Tokyo Electron Limited)
- 18640481. WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18666710. HEATER LIFT ASSEMBLY SPRING DAMPER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667032. TRENCH GATE TRENCH FIELD PLATE VERTICAL MOSFET simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18674006. THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract (Texas Instruments Incorporated)
- 18674953. SEMICONDUCTOR STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18753610. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- 18754277. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING ION IMPLANTATION PROCESSES (Infineon Technologies AG)
- 18754620. METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18754653. FABRICATION METHOD OF METAL-FREE SOI WAFER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18811911. SUBSTRATE DEGAS STATION (Applied Materials, Inc.)
- 18882906. SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD (SEMES CO., LTD.)
- 18954712. APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS WITH SELECTIVE EPITAXIAL DEPOSITION (Applied Materials, Inc.)
- 18956416. SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (SK hynix Inc.)
- 18962363. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18962850. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (FUJI ELECTRIC CO., LTD.)
A
- Applied materials, inc. (20240339324). Atmospheric Pressure Plasma for Substrate Annealing simplified abstract
- Applied materials, inc. (20250006499). INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Applied materials, inc. (20250006507). Interfacial Layer for Anneal Capping Layer
- Applied materials, inc. (20250069915). SUBSTRATE DEGAS STATION
- Applied materials, inc. (20250087485). APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS WITH SELECTIVE EPITAXIAL DEPOSITION
- Applied materials, inc. (20250087505). MICROWAVE ANNEALING FOR LOW THERMAL BUDGET APPLICATIONS
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on March 6th, 2025
- Applied Materials, Inc. patent applications on October 10th, 2024
I
K
- Kabushiki kaisha toshiba (20250098231). SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- KABUSHIKI KAISHA TOSHIBA patent applications on March 14th, 2024
- KABUSHIKI KAISHA TOSHIBA patent applications on March 20th, 2025
- Kioxia corporation (20240297146). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract
- KIOXIA CORPORATION patent applications on September 5th, 2024
M
- Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract
- Micron technology, inc. (20240411090). METHOD OF FORMING PHOTONICS STRUCTURES
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on December 12th, 2024
P
S
- Samsung electronics co., ltd. (20240282586). WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD USING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- Semiconductor energy laboratory co., ltd. (20240258119). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD. patent applications on August 1st, 2024
- Sk hynix inc. (20240121953). SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Sk hynix inc. (20250089246). SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- SK hynix Inc. patent applications on April 11th, 2024
- SK hynix Inc. patent applications on March 13th, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240097036). FinFET Device and Method of Forming Same simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250173). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250098279). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240213097). SEMICONDUCTOR DEVICE HAVING CUT GATE DIELECTRIC simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213157). GRAPHENE BARRIER LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258174). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290630). Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290652). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304471). HEATER LIFT ASSEMBLY SPRING DAMPER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347355). METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNEALING A WAFER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347377). FABRICATION METHOD OF METAL-FREE SOI WAFER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379350). FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379380). SYSTEMS AND METHODS FOR PROCESSING A SUBSTRATE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379381). PERFORMING ANNEALING PROCESS TO IMPROVE FIN QUALITY OF A FINFET SEMICONDUCTOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379394). SEMICONDUCTOR SUBSTRATE BOAT AND METHODS OF USING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379793). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250063778). GATE STRUCTURE IN SEMICONDUCTOR METHOD AND METHOD OF FORMING THE SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
- Texas instruments incorporated (20240312862). THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING simplified abstract
- Texas Instruments Incorporated patent applications on September 19th, 2024
- Tokyo electron limited (20240249940). HEAT TREATMENT DEVICE AND TREATMENT METHOD simplified abstract
- Tokyo electron limited (20240249951). SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract
- Tokyo Electron Limited patent applications on July 25th, 2024
