METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

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METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18620327 titled 'METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

The method described in the patent application involves separating dies from a semiconductor substrate by using laser irradiation to create modifications within the substrate.

The substrate is attached to a carrier through its first surface.
Laser irradiation is introduced into the substrate's interior through the second surface to create first modifications that surround the dies.
Second modifications are generated to divide the substrate into two parts.
The parts are separated along a first separation area defined by the second modifications, and the dies are separated along a second separation area defined by the first modifications.

Potential Applications: - Semiconductor manufacturing - Electronics industry - Microchip production

Problems Solved: - Efficient separation of dies from a semiconductor substrate - Precision in dividing the substrate into parts

Benefits: - Improved manufacturing process - Enhanced accuracy in die separation - Cost-effective method

Commercial Applications: Title: Semiconductor Die Separation Method for Enhanced Manufacturing Efficiency This technology can be used in semiconductor fabrication facilities to streamline the process of separating dies from substrates, leading to increased productivity and cost savings.

Questions about Semiconductor Die Separation Method: 1. How does this method compare to traditional die separation techniques? This method offers a more precise and controlled way of separating dies from substrates compared to traditional mechanical methods, reducing the risk of damage to the dies.

2. What are the potential challenges in implementing this technology in large-scale semiconductor manufacturing facilities? Large-scale implementation may require specialized equipment and training to ensure consistent and accurate results across a high volume of substrates.

Original Abstract Submitted

A method for separating dies from a semiconductor substrate having dies adjoining a first surface of the substrate includes: attaching the substrate to a carrier via the first surface; generating first modifications by introducing laser irradiation into an interior of the substrate via a second surface of the substrate, the first modifications extending between the first surface and a vertical level in the interior that is being spaced from the second surface, the first modifications laterally surrounding the dies; generating second modifications by introducing laser irradiation into the interior via the second surface, the second modifications sub-dividing the substrate into a first part between the first surface and the second modifications, and a second part between the second surface and the second modifications; separating the parts along a first separation area defined by the second modifications; and separating the dies along a second separation area defined by the first modifications.