Category:Gang Duan of Chandler AZ US
Gang Duan
Gang Duan from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L23/498, H01L23/522 with intel corporation.
Patents
Pages in category "Gang Duan of Chandler AZ US"
The following 93 pages are in this category, out of 93 total.
1
- 18373088. ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES (Intel Corporation)
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18373848. SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY (Intel Corporation)
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374592. MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS. (INTEL CORPORATION)
- 18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)
- 18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation)
- 18470668. MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (Intel Corporation)
- 18473479. INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS (Intel Corporation)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18478250. ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS (INTEL CORPORATION)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
- 18479004. OPTICAL CONNECTOR FERRULE (INTEL CORPORATION)
- 18500132. MOLDING SYSTEM AND MOLDING METHOD (Intel Corporation)
- 18503459. INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS (Intel Corporation)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation)
2
- 20250183182. Microelectronic Assemblie (Unknown Organization)
- 20250218678. Die Within Hole Subst (Intel)
- 20250218880. Microelectronic Assemblies W (Intel)
- 20250218904. Technologies Power S (Intel)
- 20250218905. Component Coupled Condu (Intel)
- 20250218915. Pedestal Structure Passi (Intel)
- 20250218926. Microelectronic Assemblies I (Intel)
- 20250218953. Methods Apparatus Em (Intel)
- 20250218955. Microelectronic Structures I (Intel)
- 20250218957. Methods Apparatus Emb (Intel)
- 20250218958. Pedestals Semiconductor (Intel)
- 20250218960. Methods Apparatus Emb (Intel)
- 20250218962. Technologies Stack (Intel)
- 20250218963. Die Conductive Vias Embe (Intel)
- 20250218964. Technologies Connected C (Intel)
- 20250218982. Technologies Ceramic Com (Intel)
- 20250218984. Encapsulation Techniques (Intel)
- 20250219021. Vertically Embedded Componen (Intel)
- 20250219028. Deep Trench Capacitors Mu (Intel)
- 20250703 Patent Applications Report for July 3rd, 2025
I
- Intel corporation (20250006569). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006570). GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Intel corporation (20250006571). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS
- Intel corporation (20250006609). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006610). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006611). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006612). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006613). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES
- Intel corporation (20250006645). MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION
- Intel corporation (20250006665). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRENCH CAPACITORS
- Intel corporation (20250006671). SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Intel corporation (20250015003). HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250022908). MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANSPARENT SUBSTRATE
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250105119). SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
- Intel corporation (20250105156). INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLASS CORE BY INTERCONNECTS
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250106997). ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Intel corporation (20250110289). OPTICAL CONNECTOR FERRULE
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112100). DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112138). MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTRIC BASED LINER MATERIALS.
- Intel corporation (20250112140). STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112163). THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT
- Intel corporation (20250112165). ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND RELATED METHODS
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250144857). MOLDING SYSTEM AND MOLDING METHOD
- Intel corporation (20250149455). INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH SELF-ALIGNED THROUGH GLASS VIAS