TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

Abstract: technologies for components embedded in a substrate core are disclosed. in one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. the power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. the stack may include, e.g., three or more power components. through-silicon vias in some or all of the power components can allow for connections through one power component to another. configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Inventor(s): Mahdi Mohammadighaleni, Yosef Kornbluth, Shayan Kaviani, Ehsan Zamani, Kihyun Kim, Srinivas Venkata Ramanuja Pietambaram, Dilan Seneviratne, Elham Tavakoli, Whitney M. Bryks, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Suddhasattwa Nad

CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))

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