PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRATES AND RELATED METHODS

Abstract: pedestals for semiconductors embedded in package substrates and related methods are disclosed. an example package substrate for an integrated circuit package disclosed herein includes core having a first surface, a second surface, and a cavity formed in the first surface, a semiconductor component disposed in the cavity, and a pedestal disposed in the cavity, the pedestal having a third surface coupled to the semiconductor component, and a fourth surface adjacent to the first surface, the pedestal dimensioned such that a first thickness of the pedestal and semiconductor is substantially equal to a second thickness of the core.

Inventor(s): Brandon Christian Marin, Bohan Shan, Joseph Allen Van Nausdle, Leonel Arana, Kyle Jordan Arrington, Xavier F. Brun, Ryan Joseph Carrazzone, Ashay Dani, Gang Duan, Hongxia Feng, Mohit Gupta, Wei Li, Ziyin Lin, Yongki Min, Tyler Osborn, Srinivas Venkata Ramanuja Pietambaram, Teng Sun, Jose Fernando Waimin Almendares, Dingying Xu

CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))

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