MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

Abstract: microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a substrate having a material and conductive pathways through the material, wherein the material includes an organic dielectric material; and a microelectronic component having a first surface and an opposing second surface, wherein the first surface of the microelectronic component is electrically coupled to the conductive pathways in the material by interconnects, wherein the interconnects include solder and are surrounded by a capillary underfill material, and wherein the microelectronic component and the capillary underfill material are surrounded by the material of the substrate.

Inventor(s): Minglu Liu, Bohan Shan, Ziyin Lin, Haobo Chen, Yiqun Bai, Kyle Jordan Arrington, Jose Waimin, Ryan Carrazzone, Hongxia Feng, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Dingying Xu, Bin Mu, Mohit Gupta, Jeremy Ecton, Brandon C. Marin, Xiaoying Guo, Ashay Dani, Yosuke Kanaoka

CPC Classification: H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )})

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