ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF A PACKAGE SUBSTRATE

Abstract: in embodiments herein, a circuit component (e.g., a deep trench capacitor) is embedded within a core layer of a substrate. the circuit component may be encapsulated by multiple (e.g., two) layers of dielectrics or by a polymer material.

Inventor(s): Zhixin Xie, Andrew Matthew Jimenez, Liang He, Jung Kyu Han, Gang Duan

CPC Classification: H01L23/645 ({Inductive arrangements (, take precedence)})

Search for rejections for patent application number 20250218984