TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

Abstract: technologies for connected components embedded in a substrate core are disclosed. in one embodiment, power components such as deep trench capacitors are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. the power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. through-silicon vias in some or all of the power components can allow for connections through one power component to another. configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Inventor(s): Kyle J. Arrington, Bohan Shan, Ryan Joseph Carrazzone, Jose Fernando Waimin Almendares, Dingying Xu, Hiroki Tanaka, Ziyin Lin, Yiqun Bai, Hongxia Feng, Yongki Min, Mohit Gupta, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Clay Bradley Arrington

CPC Classification: H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials }))

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