TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

Abstract: technologies for components embedded in a substrate core are disclosed. in one embodiment, power components such as deep trench capacitors and multi-layer ceramic capacitors (mlccs) are disposed in a cavity defined in a substrate core for a circuit board of an integrated circuit package, such as a processor. the power components are stacked on top of each other, allowing for the stack of power components to match the height of the substrate core, even when the height of the individual power components is less than the height of the substrate core. configuring the power components in this manner can provide mechanical stability to the power components and substrate core and provide power to a semiconductor die mounted on the circuit board.

Inventor(s): Suddhasattwa Nad, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Srinivas Venkata Ramanuja Pietambaram

CPC Classification: H01L23/642 ({Capacitive arrangements (, , , take precedence; capacitive effects between wiring layers on the semiconductor body )})

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