20250183182. Microelectronic Assemblie (Unknown Organization)
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES
Abstract: various techniques for alleviating (e.g., mitigating or reducing) stresses between glass core materials and electrically conductive materials deposited in through-glass vias (tgvs) and related devices and methods are disclosed. in one aspect, a microelectronic assembly includes a glass core having a first face and a second face opposite the first face, and a tgv extending through the glass core between the first face and the second face, wherein the tgv includes a conductive material and a buffer layer between the conductive material and the glass core, wherein a cte of the buffer layer is smaller than a cte of the conductive material.
Inventor(s): Bohan Shan, Mahdi Mohammadighaleni, Joshua Stacey, Ehsan Zamani, Aaditya Candadai, Jacob Vehonsky, Daniel Wandera, Mitchell Page, Srinivas Venkata Ramanuja Pietambaram, Gang Duan, Jeremy Ecton, Brandon C. Marin, Onur Ozkan, Vinith Bejugam, Dhruba Pattadar, Amm Hasib, Nicholas Haehn, Makoyi Watson, Sanjay Tharmarajah, Jason M. Gamba, Yuqin Li, Astitva Tripathi, Mohammad Mamunur Rahman, Haifa Hariri, Shayan Kaviani, Logan Myers, Darko Grujicic, Elham Tavakoli, Whitney Bryks, Dilan Seneviratne, Bainye Angoua, Peumie Abeyratne Kuragama, Hongxia Feng, Kyle Jordan Arrington, Bai Nie, Jose Waimin, Ryan Carrazzone, Haobo Chen, Dingying Xu, Ziyin Lin, Yiqun Bai, Xiaoying Guo, Bin Mu, Thomas S. Heaton, Rahul N. Manepalli
CPC Classification: H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (, take precedence; pins attached to insulating substrates )})
Search for rejections for patent application number 20250183182
- Patent Applications
- Unknown Organization
- CPC H01L23/5384
- Bohan Shan of Chandler AZ US
- Mahdi Mohammadighaleni of Phoenix AZ US
- Joshua Stacey of Chandler AZ US
- Ehsan Zamani of Phoenix AZ US
- Aaditya Candadai of Chandler AZ US
- Jacob Vehonsky of Chandler AZ US
- Daniel Wandera of Chandler AZ US
- Mitchell Page of Mesa AZ US
- Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US
- Gang Duan of Chandler AZ US
- Jeremy Ecton of Gilbert AZ US
- Brandon C. Marin of Gilbert AZ US
- Onur Ozkan of Scottsdale AZ US
- Vinith Bejugam of Chandler AZ US
- Dhruba Pattadar of Chandler AZ US
- Amm Hasib of Chandler AZ US
- Nicholas Haehn of Scottsdale AZ US
- Makoyi Watson of Phoenix AZ US
- Sanjay Tharmarajah of Queen Creek AZ US
- Jason M. Gamba of Gilbert AZ US
- Yuqin Li of Chandler AZ US
- Astitva Tripathi of Mesa AZ US
- Mohammad Mamunur Rahman of Gilbert AZ US
- Haifa Hariri of Phoenix AZ US
- Shayan Kaviani of Phoenix AZ US
- Logan Myers of Chandler AZ US
- Darko Grujicic of Chandler AZ US
- Elham Tavakoli of Phoenix AZ US
- Whitney Bryks of Tempe AZ US
- Dilan Seneviratne of Phoenix AZ US
- Bainye Angoua of Chandler AZ US
- Peumie Abeyratne Kuragama of Chandler AZ US
- Hongxia Feng of Chandler AZ US
- Kyle Jordan Arrington of Gilbert AZ US
- Bai Nie of Chandler AZ US
- Jose Waimin of Gilbert AZ US
- Ryan Carrazzone of Chandler AZ US
- Haobo Chen of Chandler AZ US
- Dingying Xu of Chandler AZ US
- Ziyin Lin of Chandler AZ US
- Yiqun Bai of Chandler AZ US
- Xiaoying Guo of Chandler AZ US
- Bin Mu of Tempe AZ US
- Thomas S. Heaton of Mesa AZ US
- Rahul N. Manepalli of Chandler AZ US