Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
Organization Name
Inventor(s)
Aleksandar Aleksov of Chandler AZ US
Benjamin Duong of Phoenix AZ US
Hongxia Feng of Chandler AZ US
Brandon C. Marin of Gilbert AZ US
Tchefor Ndukum of Chandler AZ US
Srinivas Pietambaram of Chandler AZ US
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
This abstract first appeared for US patent application 20250112124 titled 'DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
Original Abstract Submitted
deep cavity arrangements on integrated circuit packaging an electronic package, comprises a substrate core; dielectric material of one or more dielectric material layers over the substrate core, and having a plurality of metallization layers comprising an upper-most metallization layer; and an integrated circuit (ic) die embedded within the dielectric material and below the upper-most metallization layer. the package also has a metallization pattern within the dielectric material and below the ic die; and a gap within the dielectric material and extending around the metallization pattern.
- Intel corporation
- Jeremy Ecton of Gilbert AZ US
- Aleksandar Aleksov of Chandler AZ US
- Leonel Arana of Phoenix AZ US
- Gang Duan of Chandler AZ US
- Benjamin Duong of Phoenix AZ US
- Hongxia Feng of Chandler AZ US
- Tarek Ibrahim of Mesa AZ US
- Brandon C. Marin of Gilbert AZ US
- Tchefor Ndukum of Chandler AZ US
- Bai Nie of Chandler AZ US
- Srinivas Pietambaram of Chandler AZ US
- Bohan Shan of Chandler AZ US
- Matthew Tingey of Mesa AZ US
- H01L23/482
- H01L23/00
- H01L23/31
- H01L23/498
- H01L25/065
- CPC H01L23/4821