20250218915. Pedestal Structure Passi (Intel)
PEDESTAL STRUCTURE FOR PASSIVE CIRCUIT COMPONENT STRUCTURE
Abstract: an apparatus comprising a package substrate comprising a core layer; a pedestal embedded in the core layer; and a structure comprising a passive circuit component, wherein the structure is above the pedestal and is embedded in the core layer.
Inventor(s): Tolga Acikalin, Soham Agarwal, Benjamin T. Duong, Jeremy D. Ecton, Kari E. Hernandez, Brandon Christian Marin, Pratyush Mishra, Pratyasha Mohapatra, Srinivas V. Pietambaram, Marcel M. Said, Gang Duan, Hiroki Tanaka, Robert A. May, Bai Nie, Sanjay Tharmarajah, Bohan Shan
CPC Classification: H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate )})
Search for rejections for patent application number 20250218915
- Patent Applications
- Intel Corporation
- CPC H01L23/49838
- Tolga Acikalin of San Jose CA US
- Soham Agarwal of Chandler AZ US
- Benjamin T. Duong of Phoenix AZ US
- Jeremy D. Ecton of Gilbert AZ US
- Kari E. Hernandez of Phoenix AZ US
- Brandon Christian Marin of Gilbert AZ US
- Pratyush Mishra of Tempe AZ US
- Pratyasha Mohapatra of Hillsboro OR US
- Srinivas V. Pietambaram of Chandler AZ US
- Marcel M. Said of Beaverton OR US
- Gang Duan of Chandler AZ US
- Hiroki Tanaka of Gilbert AZ US
- Robert A. May of Chandler AZ US
- Bai Nie of Chandler AZ US
- Sanjay Tharmarajah of Queen Creek AZ US
- Bohan Shan of Chandler AZ US