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Intel corporation (20250144857). MOLDING SYSTEM AND MOLDING METHOD

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MOLDING SYSTEM AND MOLDING METHOD

Organization Name

intel corporation

Inventor(s)

Zhixin Xie of Chandler AZ US

Yi Li of Chandler AZ US

Jesse Jones of Chandler AZ US

Gang Duan of Chandler AZ US

Andrew Jimenez of Mesa AZ US

Jung Kyu Han of Chandler AZ US

Yekan Wang of Chandler AZ US

MOLDING SYSTEM AND MOLDING METHOD

This abstract first appeared for US patent application 20250144857 titled 'MOLDING SYSTEM AND MOLDING METHOD

Original Abstract Submitted

various aspects may provide a molding system. the molding system may include a molding unit which includes a first mold panel and a second mold panel. the first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. various aspects may also provide a molding method which utilize the molding system.

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