18373848. SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY (Intel Corporation)
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
Organization Name
Inventor(s)
Sandrine Lteif of Phoenix AZ US
Srinivas V. Pietambaram of Chandler AZ US
Suresh Tanaji Narute of Chandler AZ US
Pramod Malatkar of Chandler AZ US
Khaled Ahmed of San Jose CA US
SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
This abstract first appeared for US patent application 18373848 titled 'SELF-HEALING LINER FOR THROUGH GLASS VIA RELIABILITY
Original Abstract Submitted
Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.
- Intel Corporation
- Yuqin Li of Chandler AZ US
- Jesse Jones of Chandler AZ US
- Sandrine Lteif of Phoenix AZ US
- Srinivas V. Pietambaram of Chandler AZ US
- Suresh Tanaji Narute of Chandler AZ US
- Pramod Malatkar of Chandler AZ US
- Gang Duan of Chandler AZ US
- Khaled Ahmed of San Jose CA US
- H01L23/498
- H01L21/48
- H01L23/00
- H01L23/15
- CPC H01L23/49827