18500132. MOLDING SYSTEM AND MOLDING METHOD (Intel Corporation)
MOLDING SYSTEM AND MOLDING METHOD
Organization Name
Inventor(s)
Jung Kyu Han of Chandler AZ US
MOLDING SYSTEM AND MOLDING METHOD
This abstract first appeared for US patent application 18500132 titled 'MOLDING SYSTEM AND MOLDING METHOD
Original Abstract Submitted
Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.