There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L21/308
Subcategories
This category has the following 117 subcategories, out of 117 total.
A
B
C
D
E
F
G
H
I
J
K
M
N
O
R
S
T
V
W
Y
Pages in category "H01L21/308"
The following 200 pages are in this category, out of 327 total.
(previous page) (next page)1
- 17532423. PROCESSOR DIE ALIGNMENT GUIDES simplified abstract (International Business Machines Corporation)
- 17548913. NANOSHEET DEVICE WITH VERTICAL BLOCKER FIN simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17590863. METHODS OF FORMING FIN-ON-NANOSHEET TRANSISTOR STACKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17655321. Integration of Multiple Transistors Having Fin and Mesa Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836452. SELECTIVE ETCHING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17897350. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
- 18059093. SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18090434. DENSIFICATION AND REDUCTION OF SELECTIVELY DEPOSITED Si PROTECTIVE LAYER FOR MASK SELECTIVITY IMPROVEMENT IN HAR ETCHING simplified abstract (Tokyo Electron Limited)
- 18094839. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18110778. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18123095. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18143076. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (United Microelectronics Corp.)
- 18156123. Reduction of Line Wiggling simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18157395. STRUCTURE OF ISOLATION FEATURE OF SEMICONDUCTOR DEVICE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18167741. SWITCHABLE SUBSTRATE FOR EXTREME ULTRAVIOLET OR E-BEAM METALLIC RESIST simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171528. NONLINEAR CHANNEL simplified abstract (International Business Machines Corporation)
- 18171765. SEMICONDUCTOR STRUCTURE WITH DEVICE INCLUDING AT LEAST ONE IN-WELL POROUS REGION simplified abstract (GlobalFoundries U.S. Inc.)
- 18190917. PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18243185. METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18281993. NAPHTHALENE UNIT-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18285141. COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION simplified abstract (NISSAN CHEMICAL CORPORATION)
- 18318854. SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract (Samsung Electronics Co., Ltd.)
- 18355520. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18356322. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18359241. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18367292. GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18373080. METHODS AND STRUCTURES FOR IMPROVING ETCH PROFILE OF UNDERLYING LAYERS (Tokyo Electron Limited)
- 18402563. METHOD OF BREAKING THROUGH ETCH STOP LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18416508. TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18418757. SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM simplified abstract (Tokyo Electron Limited)
- 18419879. HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18427044. PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18434121. Semiconductor Patterning and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18435294. MULTIPLE-STACK THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18435609. DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18436812. SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18477290. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481976. HARD MASK LAYER AND FORMATION METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18483657. FIELD EFFECT TRANSISTOR WITH ALIGNMENT MARK AND RELATED METHODS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18484372. SELECTIVE PASSIVATION OF PHOTORESISTS (Tokyo Electron Limited)
- 18491470. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FINS USING ETCHING MASKS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18496227. METHOD FOR FORMING A REDUCED SIZE FEATURE (NXP USA, Inc.)
- 18499259. Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films (Intel Corporation)
- 18500254. SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract (Micron Technology, Inc.)
- 18500662. PATTERN FORMING METHOD, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18501124. ELEMENT CHIP MANUFACTURING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18511016. THROUGH-SUBSTRATE-VIA WITH REENTRANT PROFILE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18511711. EPITAXIAL FIN STRUCTURES OF FINFET HAVING AN EPITAXIAL BUFFER REGION AND AN EPITAXIAL CAPPING REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525131. METHOD FOR NON-RESIST NANOLITHOGRAPHY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18525473. Semiconductor Device and Method simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18531359. ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract (Intel Corporation)
- 18543934. Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18560422. IN SITU DAMAGE FREE ETCHING OF Ga2O3 USING Ga FLUX FOR FABRICATING HIGH ASPECT RATIO 3D STRUCTURES simplified abstract (Ohio State Innovation Foundation)
- 18581182. SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18591923. GATE-ALL-AROUND FIELD-EFFECT TRANSISTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18593504. FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract (Micron Technology, Inc.)
- 18594816. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18599374. FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC CIRCUIT simplified abstract (Huawei Technologies Co., Ltd.)
- 18601541. Method For Forming Resist Underlayer Film And Patterning Process simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18604167. WET ANISOTROPIC ETCHING OF SILICON simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18606375. METHODS OF FABRICATING SEMICONDUCTOR DEVICES (SAMSUNG ELECTRONICS CO., LTD.)
- 18608191. Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same simplified abstract (Lodestar Licensing Group LLC)
- 18608294. SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD OF FORMING SEMICONDUCTOR BODIES OF VARYING WIDTH simplified abstract (Intel Corporation)
- 18608940. HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATING METHOD OF THE SAME simplified abstract (UNITED MICROELECTRONICS CORP.)
- 18624386. Isolation Structures Of Semiconductor Devices simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18625348. GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES simplified abstract (Intel Corporation)
- 18631884. METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18634408. CLEANING SOLUTION AND METHOD OF CLEANING WAFER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18639575. METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18649086. PHOTORESIST LAYER OUTGASSING PREVENTION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18662772. SEMICONDUCTOR DEVICE HAVING PLANAR TRANSISTOR AND FINFET simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18667981. METHODS OF FORMING PHOTONIC DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18676056. Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract (Micron Technology, Inc.)
- 18731392. HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME simplified abstract (United Microelectronics Corp.)
- 18735002. SEMICONDUCTOR STORAGE DEVICE COMPRISING STAIRCASE PORTION simplified abstract (Kioxia Corporation)
- 18747951. SUBSTRATE PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18749534. METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18761797. METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18815864. HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME (UNITED MICROELECTRONICS CORP.)
- 18817618. Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, And Patterning Process (Shin-Etsu Chemical Co., Ltd.)
- 18824037. BLOCK COPOLYMERS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME (KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY)
- 18824037. BLOCK COPOLYMERS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18886036. METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-CONTAINING PATTERN (NANYA TECHNOLOGY CORPORATION)
- 18887371. METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURALITY OF FINS AND POWER SEMICONDUCTOR COMPONENT PRODUCED THEREFROM (Robert Bosch GmbH)
- 18894659. ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING (Applied Materials, Inc.)
- 18896042. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (Rohm Co., Ltd.)
- 18908930. Composition For Forming Resist Underlayer Film, Resist Underlayer Film, Method For Manufacturing Resist Underlayer Film, Patterning Process, And Method For Manufacturing Semiconductor Device (SHIN-ETSU CHEMICAL CO., LTD.)
- 18912771. COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND POLYMER (SHIN-ETSU CHEMICAL CO., LTD.)
- 18940382. HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
- 18940439. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18941798. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18948225. METHODS OF MANUFACTURING RESISTOR DEVICES (Micron Technology, Inc.)
- 18961425. MEMORY STRUCTURE AND METHOD OF FORMING THEREOF (NANYA TECHNOLOGY CORPORATION)
- 18966327. SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER (SAMSUNG ELECTRONICS CO., LTD.)
- 18967679. SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18970265. PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
- 18999567. DEEP TRENCH INTERSECTIONS (TEXAS INSTRUMENTS INCORPORATED)
- 18999923. EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
- 19008393. DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
- 19009060. Integrated Assemblies and Methods of Forming Integrated Assemblies (Micron Technology, Inc.)
- 19010921. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 19011229. Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry (Micron Technology, Inc.)
- 19019016. SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 19019071. SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUCTURES (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
A
- Advanced Materials patent applications on 9th May 2025
- Applied materials, inc. (20250132163). ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
- Applied Materials, Inc. patent applications on April 24th, 2025
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on February 20th, 2025
- Applied Materials, Inc. patent applications on February 6th, 2025
B
F
H
I
- Innolux corporation (20240295823). METHOD FOR MANUFACTURING ELECTRONIC DEVICE simplified abstract
- InnoLux Corporation patent applications on September 5th, 2024
- Intel corporation (20240105520). TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240120206). ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES simplified abstract
- Intel corporation (20240162332). TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240178071). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240186403). DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20240222509). SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD OF FORMING SEMICONDUCTOR BODIES OF VARYING WIDTH simplified abstract
- Intel corporation (20240249946). GATE SPACING IN INTEGRATED CIRCUIT STRUCTURES simplified abstract
- Intel corporation (20240290789). TECHNIQUES FOR ACHIEVING MULTIPLE TRANSISTOR FIN DIMENSIONS ON A SINGLE DIE simplified abstract
- Intel corporation (20240332399). GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- Intel corporation (20250022939). CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Intel corporation (20250072078). HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Intel corporation (20250098258). PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Intel corporation (20250126869). EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Intel corporation (20250140543). Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films
- Intel corporation (20250142939). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
- Intel Corporation patent applications on April 11th, 2024
- Intel Corporation patent applications on April 17th, 2025
- Intel Corporation patent applications on August 29th, 2024
- Intel Corporation patent applications on February 27th, 2025
- INTEL CORPORATION patent applications on February 8th, 2024
- Intel Corporation patent applications on January 16th, 2025
- Intel Corporation patent applications on July 25th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 20th, 2025
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on May 16th, 2024
- Intel Corporation patent applications on May 1st, 2025
- Intel Corporation patent applications on May 30th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- International business machines corporation (20240178156). SUPPORT DIELECTRIC FIN TO PREVENT GATE FLOP-OVER IN NANOSHEET TRANSISTORS simplified abstract
- International business machines corporation (20240282860). NONLINEAR CHANNEL simplified abstract
- International Business Machines Corporation patent applications on August 22nd, 2024
- International Business Machines Corporation patent applications on February 20th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024
K
M
- Micron technology, inc. (20240178272). SEMICONDUCTOR STRUCTURE WITH CURVED SURFACES simplified abstract
- Micron technology, inc. (20240297124). FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract
- Micron technology, inc. (20240315018). Integrated Assemblies and Methods of Forming Integrated Assemblies simplified abstract
- Micron technology, inc. (20240429104). DEVICES COMPRISING VERTICAL TRANSISTORS INCLUDING A CHANNEL REGION COMPRISING AN OXIDE SEMICONDUCTOR MATERIAL
- Micron technology, inc. (20250072014). METHODS OF MANUFACTURING RESISTOR DEVICES
- Micron technology, inc. (20250142820). Integrated Assemblies and Methods of Forming Integrated Assemblies
- Micron technology, inc. (20250142875). Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated Circuitry
- Micron Technology, Inc. patent applications on December 26th, 2024
- Micron Technology, Inc. patent applications on February 27th, 2025
- Micron Technology, Inc. patent applications on February 29th, 2024
- Micron Technology, Inc. patent applications on February 8th, 2024
- Micron Technology, Inc. patent applications on May 1st, 2025
- Micron Technology, Inc. patent applications on May 30th, 2024
- Micron Technology, Inc. patent applications on September 19th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
R
S
- Samsung electronics co., ltd. (20240105842). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240162225). SEMICONDUCTOR DEVICE AND METHODS OF FORMING PATTERNS simplified abstract
- Samsung electronics co., ltd. (20240186321). SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER simplified abstract
- Samsung electronics co., ltd. (20240194488). METHOD FOR MANUFACTURING MASK PATTERN AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE MASK PATTERN simplified abstract
- Samsung electronics co., ltd. (20240222123). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240250031). SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240266170). PATTERN FORMING METHOD, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240290626). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240332059). METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240339334). SUBSTRATE PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240411227). PHOTOLITHOGRAPHY METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
- Samsung electronics co., ltd. (20240429052). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250008722). METHOD OF FORMING PATTERNS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
- Samsung electronics co., ltd. (20250020998). PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME
- Samsung electronics co., ltd. (20250022716). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250063804). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250072096). METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Samsung electronics co., ltd. (20250098292). SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER
- Samsung electronics co., ltd. (20250101145). BLOCK COPOLYMERS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME
- Samsung electronics co., ltd. (20250140558). METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024