Samsung electronics co., ltd. (20240290626). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290626 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The method described in the patent application involves manufacturing a semiconductor device by forming an etch target layer in a cell region, which includes a cell center region and a cell edge region. An edge mask pattern is then formed on the surface of the cell edge region using a quadruple patterning process on the etch target layer. Additionally, a plurality of center mask patterns are spaced apart from each other on the cell center region. Subsequently, a first etch pattern is formed on the cell edge region by etching the etch target layer using the edge mask pattern and the center mask patterns as etch masks. Finally, a plurality of second etch patterns are formed on the cell center region, spaced apart from each other.
- Formation of an etch target layer in a cell region
- Use of a quadruple patterning process to form an edge mask pattern on the cell edge region
- Creation of a plurality of center mask patterns on the cell center region
- Etching of the etch target layer using the edge mask pattern and center mask patterns as etch masks
- Formation of second etch patterns on the cell center region
Potential Applications: - Semiconductor manufacturing - Advanced electronic devices
Problems Solved: - Enhancing precision in semiconductor device manufacturing - Improving the efficiency of etching processes
Benefits: - Higher quality semiconductor devices - Increased production efficiency
Commercial Applications: Title: Advanced Semiconductor Manufacturing Process This technology could be used in the production of various electronic devices, such as smartphones, computers, and other consumer electronics. The improved precision and efficiency offered by this method could lead to cost savings for manufacturers and potentially result in higher quality products for consumers.
Questions about the technology: 1. How does this method improve the precision of semiconductor device manufacturing? 2. What are the potential cost-saving benefits for manufacturers using this process?
Original Abstract Submitted
a method of manufacturing a semiconductor device includes forming an etch target layer in a surface of a cell region comprising a cell center region and a cell edge region surrounding the cell center region, forming an edge mask pattern on the surface of the cell edge region through a quadruple patterning process on the etch target layer, and forming a plurality of center mask patterns spaced apart from each other on the cell center region, and forming a first etch pattern on the cell edge region by etching the etch target layer by using the edge mask pattern and the plurality of center mask patterns as etch masks and forming a plurality of second etch patterns spaced apart from each other on the cell center region.
