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Category:H01J37/34
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This category has the following 16 subcategories, out of 16 total.
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Pages in category "H01J37/34"
The following 80 pages are in this category, out of 80 total.
1
- 17835107. MOLTEN LIQUID TRANSPORT FOR TUNABLE VAPORIZATION IN ION SOURCES simplified abstract (Applied Materials, Inc.)
- 17849914. PHYSICAL VAPOR DEPOSITION APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18089216. Power Compensation in PVD Chambers simplified abstract (Applied Materials, Inc.)
- 18110668. PHYSICAL VAPOR DEPOSITION SOURCE AND CHAMBER ASSEMBLY simplified abstract (Applied Materials, Inc.)
- 18132420. SPUTTERING TARGET AND SPUTTERING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18156900. Plasma Etching with Metal Sputtering simplified abstract (Tokyo Electron Limited)
- 18162274. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18217889. PLASMA PROCESS APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18218579. WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE (Applied Materials, Inc.)
- 18237934. METHODS AND APPARATUS FOR CONTROLLING ION FRACTION IN PHYSICAL VAPOR DEPOSITION PROCESSES simplified abstract (Applied Materials, Inc.)
- 18272438. Deposition Of Piezoelectric Films simplified abstract (Applied Materials, Inc.)
- 18281456. SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract (Applied Materials, Inc.)
- 18418930. METHODS AND APPARATUS FOR REDUCING SPUTTERING OF A GROUNDED SHIELD IN A PROCESS CHAMBER simplified abstract (Applied Materials, Inc.)
- 18512324. CONSUMABLE COMPONENT TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SEMES CO., LTD.)
- 18513313. PERMEANCE MAGNETIC ASSEMBLY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18617573. PVD SYSTEM AND COLLIMATOR simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18666251. REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18732308. GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA (Applied Materials, Inc.)
- 18745044. APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED)
- 18748650. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18957378. DEPOSITION SYSTEM AND METHOD (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18961099. SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18962406. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18971510. MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION (Applied Materials, Inc.)
A
- Applied materials, inc. (20240282558). PHYSICAL VAPOR DEPOSITION SOURCE AND CHAMBER ASSEMBLY simplified abstract
- Applied materials, inc. (20240301546). SPUTTER DEPOSITION SOURCE, MAGNETRON SPUTTER CATHODE, AND METHOD OF DEPOSITING A MATERIAL ON A SUBSTRATE simplified abstract
- Applied materials, inc. (20240304430). REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract
- Applied materials, inc. (20240420937). GROUNDING DEVICE FOR THIN FILM FORMATION USING PLASMA
- Applied materials, inc. (20250101572). MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on March 27th, 2025
- Applied Materials, Inc. patent applications on September 12th, 2024
I
S
- Samsung display co., ltd. (20240183029). DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME simplified abstract
- Samsung display co., ltd. (20240258088). SPUTTERING APPARATUS simplified abstract
- Samsung Display Co., Ltd. patent applications on August 1st, 2024
- Samsung Display Co., Ltd. patent applications on January 23rd, 2025
- Samsung Display Co., LTD. patent applications on June 6th, 2024
- Samsung Display Co., Ltd. patent applications on March 14th, 2024
- Samsung electronics co., ltd. (20240212980). PLASMA PROCESS APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240274416). PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240093357). Semiconductor Device, Method and Machine of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096609). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240183025). FILM FORMING APPARATUS AND METHOD FOR REDUCING ARCING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240429036). PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING
- Taiwan semiconductor manufacturing co., ltd. (20250087536). DEPOSITION SYSTEM AND METHOD
- Taiwan semiconductor manufacturing co., ltd. (20250092508). PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250095975). SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240240306). PVD SYSTEM AND COLLIMATOR simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347327). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062165). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING CHAMBERS
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Tokyo electron limited (20240249927). Plasma Etching with Metal Sputtering simplified abstract
- Tokyo Electron Limited patent applications on July 25th, 2024
U
- US Patent Application 18230669. IN SITU AND TUNABLE DEPOSITION OF A FILM simplified abstract
- US Patent Application 18231740. SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING simplified abstract
- US Patent Application 18341506. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18360667. PVD TARGET DESIGN AND SEMICONDUCTOR DEVICES FORMED USING THE SAME simplified abstract
- US Patent Application 18361729. DEPOSITION SYSTEM AND METHOD simplified abstract
- US Patent Application 18361767. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
- US Patent Application 18361771. SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS simplified abstract
- US Patent Application 18447557. SEMICONDUCTOR TOOL FOR COPPER DEPOSITION simplified abstract
