18218579. WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE (Applied Materials, Inc.)

WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

Organization Name

Applied Materials, Inc.

Inventor(s)

Andreas Schmid of Meyriez (CH)

Sahiti Nallagonda of Santa Clara CA (US)

Peter Muraoka of Santa Clara CA (US)

Michael T. Nichols of Sunnyvale CA (US)

Denis Martin Koosau of Sunnyvale CA (US)

Stephen D. Prouty of San Jose CA (US)

Sunil Srinivasan of San Jose CA (US)

Pranav Badole of Bangalore (IN)

WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

This abstract first appeared for US patent application 18218579 titled 'WAFER EDGE PROFILE CONTROL USING CONNECTED EDGE RING HARDWARE

Original Abstract Submitted

Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, a sliding ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The sliding ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the sliding ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the sliding ring. The actuating mechanism is configured to actuate the sliding ring such that the gap between the first ring component and the second ring component varies.