18911171. Substrate Processing Apparatus (TOKYO ELECTRON LIMITED)
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Substrate Processing Apparatus
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Substrate Processing Apparatus
This abstract first appeared for US patent application 18911171 titled 'Substrate Processing Apparatus
Original Abstract Submitted
A substrate processing apparatus comprises a processing chamber having a ceiling and a cathode part installed at the ceiling and configured to sputter a target. The ceiling has an engagement portion around the target. The cathode part includes a first shield member having an attachment portion to be attached to the engagement portion and a conductive seal member configured to electrically connect the ceiling and the first shield member.